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| Korean semi manufacturers to beef up capacity |
2/9/2018 |
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Samsung Electronics Co. will invest 14.4 trillion won in Pyeongtaek while SK hynix Inc., South Korea's second-largest chipmaker, plans to invest 15.5 trillion won for the production of NAND flash memory in Cheongju.
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| NXP announced good profit |
2/9/2018 |
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The chipmaker posted revenue of $2.46 billion in the period. For the year, the company reported profit of $2.22 billion, or $6.41 per share.
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| Micron up earning guidiance |
2/9/2018 |
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Revenues will be in the range of US$7.2 billion to US$7.35 billion compared with its prior guidance of US$6.8-7.2 billion. EPS for the quarter will range from US$2.70 to US$2.75, up from its previously-estimated US$2.51-2.65.
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| Manufacturing sector continue to grow |
2/8/2018 |
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In January PMI registered 59.1 percent, a decrease of 0.2 percentage point from the seasonally adjusted December reading of 59.3 percent. This indicates growth in manufacturing for the 17th consecutive month at strong levels led by continued expansion in new order and production activity.
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| GlobalFoundries to Pioneer 7nm EUV wafer production |
2/7/2018 |
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There’s been a great deal of talk in the semiconductor industry about when EUV would arrive and what node it would use. GF is working on introducing EUV at 7nm, but it’s only going to see limited use for contacts and vias, not as part of the critical path.
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| 2017 chip sales was an industry record |
2/7/2018 |
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Global semiconductor industry posted sales totaling US$412.2 billion in 2017, the industry's highest-ever annual sales according to the Semiconductor Industry Association (SIA).
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| Winbond see memory market to be stable |
2/6/2018 |
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DRAM and Flash markets currently continue to experience stability and they anticipate that in 2018 the market conditions for these two major memory products will remain healthy. As a result, demand remains high for Winbond's niche DRAM, NOR Flash, and SLC NAND.
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| SK Hynix offers SSD with 72-Layer 3D NAND Flash chips |
2/6/2018 |
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SK Hynix succeeded in making its 72-Layer 512Gb 3D NAND chips double the current biggest density of the SSD of the same size with 256Gb NAND chips by combining the latest 3D NAND Flash with its in-house firmware and controller to provide the maximum density of 4TB (Terabytes).
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| AMD has patch for Spectre Flaw |
2/6/2018 |
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"We are deploying CPU microcode patches that in combination with OS updates provide additional mitigation steps. Longer term, we have included changes in our future processor cores, starting with our Zen 2 design, to further address potential Spectre-like exploits.”
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| Broadcom sweeten the offer to $121 billion |
2/6/2018 |
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Broadcom’s new $82 per share offer included $60 in cash and $22 in Broadcom stock. Its first offer, of $70 per share, in November comprised $60 in cash and $10 in stock.
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| TE Connectivity offers backplane transmission at 112Gbit/sec. |
2/5/2018 |
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The small form factor pluggable connector is designed to provide support eight lanes and to deliver 400GbE levels of performance amd. when paired with Credo’s 112G PAM4 SerDes, the combination is said to have bit error rate of better than 10 -7.
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| Cypress grew sales by 21 percent overall |
2/5/2018 |
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Cypress president and CEO, said in an interview with EE Times that Cypress enjoyed "stellar growth" during the year, outgrowing the industry as a whole even as the broader chip market enjoyed one of its best years in more than a decade.
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| Intel consider selling AR Glasses unit |
2/5/2018 |
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Intel is seeking multiple backers to invest in the unit, which has been developing smart glasses that pair by Bluetooth with a mobile phone. The chipmaker values the division at as much as $350 million.
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| SMIC gets funding from Chinese government to go 14nm |
2/2/2018 |
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China's National Semiconductor Industry Investment Fund (SICIF) have made capital investments in subsidiary Semiconductor Manufacturing South China (SMSC), which will become a joint venture between the parties.
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