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Ford to develope EV with Chinese partner 11/9/2017
Sales of pure-electric and gasoline-electric hybrids in China rose 50 percent last year over 2015 to 336,000 vehicles, or 40 percent of global demand. U.S. sales totaled 159,620.
Uber wants to have flying taxies 11/9/2017
The company aims to have its first paying passengers in various cities around the world by 2023, though the plan still faces major hurdles.
EU push to cut car emmission 11/9/2017
EU wants to cut emissions of carbon dioxide from cars by 30 percent by 2030, and boost the use of electric vehicles by making them cheaper and easier to charge.
US Supreme Court upholds circuit decision for Samsung to pay Apple 11/8/2017
The justices left in place a 2016 ruling by the US Court of Appeals for the Federal Circuit that upheld a verdict that found South Korea's Samsung Electronics had infringed Apple's patents on several popular features of the California-based company's iPhone.
Morris Chang: 3nm is ear marked for 2020 11/8/2017
TSNC, the pure-play foundry will start constructing its advanced 3nm wafer fab located at the Southern Taiwan Science Park (STSP) in 2020.
Cambricon, a China startup targets 1 billion AI chips 11/8/2017
"We aim to account for 30 percent of China's high-performance AI chip market in three years. The goal is within our reach."
China has concern about proposed Broadcom/Qualcomm merger 11/8/2017
“This is a critical industry for China and Qualcomm has been fined by the Ministry of Commerce (Mofcom) before so it’s on its radar,” said Wendy Yan, Shanghai-based partner at law firm Faegre Baker Daniels.
Galaxy Note 9 pilot production to start on Q1 11/7/2017
An official from a smartphone parts supplier allegedly told the newspaper: "We will start providing components for a pilot production [of the Galaxy Note 9] in the first quarter next year."
China-based Gowin Semiconductor joins race on high performance FPGA 11/7/2017
Gowin Semiconductor has announced the development of its first 28nm FPGA product, the GW3AT-100, fabricated by Taiwan Semiconductor Manufacturing Company (TSMC).
UK based Pleassey has advanced process for LED 11/7/2017
Plessey is the UK’s only LED maker, and the only LED maker in the world commercially making LEDs on silicon substrates. Plessey insists that this theoretical cost advantage has definitely translated into a lower product cost.
Broadcom offers $105 billion bid on Qualcomm 11/7/2017
Qualcomm is expected to reject the bid as opportunistic and too cheap. And analysts and investors have raised the prospect that a merger of the two companies might be blocked by government regulators on antitrust grounds.
Is the DRAM boom to end soon? 11/6/2017
The rise in DRAM prices will slow down as Samsung Electronics, which accounts for about half of the market, will increase DRAM supply.
Apple iPhone sales up 3% 11/6/2017
Apple sales grew by double digits in the USA, China, Canada, Germany, France, Italy, Spain, Korea and by more than 30% in Mexico, the Middle East, Turkey and Central and Eastern Europe.
In securing the Smart Home 11/6/2017
Security concerns reach deeper into the home than just the Internet gateway or a home router. They now touch everything connected to that home network, from computers and remote servers all the way to appliances such as washing machines and refrigerators.
SK Hynix to fabricate more DRAM in China 11/6/2017
SK Hynix recently struck a deal with China's city government of Wuxi to expand its DRAM production capacity locally with total investment estimated at US$8.6 billion.
First major semiconductor company to return to the U.S. 11/3/2017
Broadcom Limited, which based in Singapore will legally relocate its home address to the United States, President Donald Trump announced Thursday.
4DS to demonstrate its process with a 1Mbit ReRAM test chip. 11/3/2017
4DS has a development agreement with Western Digital subsidiary HGST to develop interface switching ReRAM based on 4DS’ metal oxide hetero-junction operation (MOHJ0) non-volatile memory.
Singapore-based Sesto Robotics offers transport for semi process 11/3/2017
The company has been spending most of its effort studying semiconductor manufacturing processes and procedures for 3-4 years in order to enable its AGVs to coordinate with the transportation processes of the semiconductor industry.
Memory supply will be tight into 2018 11/3/2017
While mature IC parts and components has been strong since the beginning of 2017, the proliferation of IoT/AR/VR applications, cloud services, drone devices, and smart voice assistant products has worsened the shortages
AMS takes NFC into industrial applications 11/2/2017

AMS has launched a NFC tag IC with industrial-grade quality, intended for high-reliability long term use. It combined with an advanced energy harvesting feature, greatly increases battery life time or even allows battery-less designs.

Imagination shareholders approved offer from Cnyon Bridge 11/2/2017
Canyon’s founder Benjamin Chow was charged on Monday with insider trading. However, a spokeswoman for Canyon said on Tuesday that the Imagination deal would not be jeopardized by the allegations.
Calls to stop unfair state tax credit to manufacturers 11/2/2017
"We are struck by how awarding benefits to a select group of businesses harms their competitors in California. We also think the resources consumed by the program are not as focused as they should be on winning economic development competitions with other states."
Manufacturing Index continue on growth path 11/2/2017
U.S. manufacturing expanded in October as the PMI registered 58.7 percent, a decrease of 2.1 percentage points from the September reading of 60.8 percent. This indicates growth in manufacturing for the 14th consecutive month and continues expansion consistent with pre-hurricane levels.
Semi sales reach $108 billion in Q3 11/1/2017
The semiconductor industry is almost certain to set a sales record this year, with sales potentially topping $400 billion for the first time, thanks largely to tremendous growth in memory revenue amid tight supply.
Winbond offers secured flash memories 11/1/2017
Winbond announced it was meeting challenges with the expansion of its TrustME Secure Flash products portfolio based on the Trusted Computing Group (TCG) Device Identifier Composition Engine (DICE) Architecture specification, which defines new security and privacy technologies applicable to systems and components.
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