Home
News
Products
Corporate
Contact
 
Tuesday, January 14, 2025

News
Industry News
Publications
CST News
Help/Support
Software
Tester FAQs
Industry News
DRAM prices up 85% on short supply 12/5/2017
Prices of the semiconductors in a wide range of digital devices have been on the rise steadily since late 2016. DRAM prices stood at US$3.59 as of end November from just $1.94 at the end of last year.
4DS collaborates with IMEC to develope fast ReRAM 12/5/2017
4DS Memory Limited announced in June it had successfully tuned its Interface Switching ReRAM cell architecture to storage class memory with read speeds comparable to DRAM without needing speed-limiting error correction.
Apple may be getting into semiconductors in an even bigger way 12/5/2017
Apple, which has designed the brains for its iPhones and iPads for years, has made moves to make even more of its components on its own.
Broadcom delays follow-up bid for Qualcomm 12/1/2017
Broadcom doesn’t anticipate increasing its $70-a-share offer until closer to Qualcomm’s board meeting in March. Broadcom plans to nominate directors to Qualcomm’s board ahead of a Dec. 8 deadline.
Qualcomm filed new infringement complaints against Apple 12/1/2017
Qualcomm said there were 16 more of its patents that Apple was using in its iPhones.
New material discovered can lead to better memories 12/1/2017
Devices tend to store that information in two ways: through electric fields, like a flash drive, or through magnetic fields, like a computer’s spinning hard disk. Each method has advantages and disadvantages. Can you cross-couple these two different ways to store information? Could we use an electric field to change the magnetic properties? Then you can have a low-power, multifunctional device.
Yaskawa to invest in high-voltage gallium nitride developer 12/1/2017
The company announced in September that Yaskawa is using Transform's 650V GaN chips in its Ó-7 F servo motor, the first servo motor to make use of high-voltage GaN technology.
Samsung introduced 2nd generation 10nm process 11/30/2017
The SoC, which integrates all components of a computer or other electronic system into a single integrated circuit, will boast far improved performance compared to those produced through first-generation processes.
Japanese court to hear Toshiba/Western Digital dispute 11/30/2017
The Tokyo District Court's ruling could determine whether or not the sale, needed to keep financially strapped Toshiba afloat, can proceed.
American consumer confidence up 11/30/2017
>"Consumers are entering the holiday season in very high spirits and foresee the economy expanding at a healthy pace into the early months of 2018,"
Manufacturers Alliance forcast good manufacturing business 11/30/2017
A Strong Turn in Aerospace and Moderate Growth in Capital Goods and Chemicals Propels U.S. Manufacturing, focuses on the manufacturing outlook featuring both improvements and ongoing challenges for the U.S. manufacturing industry.
SEMI reports semiconductor equipment manufacturer billings 11/29/2017
SEMI reports that worldwide billings of North American equipment manufacturers in October 2017 was $2.02 billion. Figure is 1.8 percent lower than the final September 2017 level of $2.05 billion, and is 23.7 percent higher than the October 2016 billings level of $1.63 billion.
UMC provides certified military grade memory process for Cypress 11/29/2017
The next-generation 144-Mbit Quad Data Rate (QDR) II+, 144-Mbit QDR IV and 16-Mbit Asynchronous SRAM devices, manufactured at United Microelectronics' (UMC) Fab 12A in Tainan, Taiwan, were qualified under the QML-V certification for aerospace-grade applications.
ASE and SPIL to form joint holding company 11/29/2017
ASE and SPIL will have meetings in February 2018 to set up a joint holding company next May at the earliest, as they have won all the necessary regulatory approvals after China issued a green light to their proposed merger on November 24.
Siemens gets further into machine learning by acquiring Solido Design Automation 11/29/2017
The acquisition is another smoke signal signifying that Siemens wants to expand into software tools for chips and circuit boards used in everything from factory equipment to airplanes to self-driving cars.
Samsung stock dropped 5% on prediction of memory market peak 11/28/2017
Morgan Stanley expressed concerns again that a boom in memory chips is likely to peak soon, investors sold their Samsung shares for profit making.
Israel-based Weebit Nano offer a better ReRAM 11/28/2017
Data retention lifetime extrapolation showed the ability to keep written data for 10 years at above room temperature, he added, and high enough to meet the requirements of market segments such as industrial and automotive.
Mobile DRAM market keep growing 11/28/2017
The global market for mobile DRAM grew 4.3 percent on-quarter to US$6.4 billion during the third quarter, according to the data.
Broadcomm up its offer for Qualcomm 11/28/2017
Broadcom is prepared to raise the value of its offer by including more of its own stock: Quite how much and when such an offer might be put in front of Qualcomm shareholders is not known.
Taiwan's industrial output up for 6 consecutive months 11/27/2017
gThe 18-month upward spiral reflects strong demand from overseas during the electronics industryfs peak season. It also indicates that people are more willing to spend on electronics amid a continuing recovery in the global economy,h
Apple files patent for folderable display 11/27/2017
iPhone with a foldable display is expected to be unveiled in the year 2021. By that time, the company may have transitioned to microLED screens. Along with all the benefits of OLED, it further boosting brightness, saturation and power efficiency.
French semiconductors are gaining design wins in advanced systems 11/27/2017
French companies, as illustrated in an increased share of French tech designed into Apple’s iPhone X. Local media are almost giddy with the news, touting big wins by STMicroelectronics and Soitec in Apple’s new flagship iPhone model.
China is working towards self-reliance on electronic components 11/27/2017
ratio of domestically made key electronic parts in defense and high-tech equipment rose from 30 percent to 85 percent. "China is now fully capable of producing secure and reliable advanced electronic components.
Broadcom to tape out 7nm devices 11/24/2017
Based on TSMC 7nm process technology, the platform offers IP cores including SerDes, HBM PHY, Die2Die PHY, mixed-signal IP, and foundation IP such as standard cells, SRAM, TCAM memory, and I/O cells.
SPIL to build new plant in Fujian, China 11/24/2017
SPIL in early May disclosed plans to set up a production subsidiary in Jinjiang (Fujian province) through a third party for a total of US$45 million.
 278  |  279  |  280  |  281  |  282  |  283  |  284  |  285  |  286  |  287 

CST Inc. Memory Tester DDR Tester
Copyright © 1994 - 2023 CST, Inc. All Rights Reserved