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Intel heavily invested in AI tech 10/24/2017
The acquired companies seemingly useful to Intel’s AI ambitions thus far include Altera (2015), Saffron (2015), Nervana (2016), Movidius (2016) and Mobileye (2017). Intel Capital has also fattened its AI portfolio with startups Mighty AI, Data Robot, Lumiata, CognitiveScale, Aeye Inc., Element AI and others.
New iMac reported to have AMD GPU 10/24/2017
The new iMac series adopt GPUs supplied by AMD, with the super workstation-class 27-inch iMac Pro equipped with Radeon Pro Vega 56 GPU and 8GB HBM2 memory or Radeon Pro Vega 64 and 16GB HBM2 memory.
Intel believes in future of Big Data 10/23/2017
“The world is undergoing a data explosion. By 2020, every autonomous vehicle on the road will create 4TB of data per day. A million self-driving cars will create the same amount of data every day as 3 billion people.”
10nm process expected to soar 10/23/2017
Based on the latest forecast, TSMC would log $3.2 billion from sales of 10nm chips in 2017. The company started 10nm production in the second quarter of this year.
China set out to improve quality 10/23/2017
"Three years ago, we relied chiefly on a price war to crack the market. But as more resources were poured into research and development, we saw a fundamental change."
Blooming business at foundries 10/23/2017
With Taiwan-based IC design houses ramping up wafer starts at their local foundry partners, the foundries will see their fab utilization rates remain high in the fourth quarter.
Silicon wafers expected to continue rising in 2018 and 2019 10/20/2017
Epitaxial silicon shipments for semiconductor applications (excluding solar) will total 11.5 billion square inches in 2017, up 8 percent from 2016. Shipments are expected to rise to 11.8 billion square inches next year and 12.4 billion square inches in 2019.
Challenges in testing the new memories 10/20/2017
Memory test vendors are contending with next-generation devices, such as 3D NAND flash memories, HBM2 chips, low-power double-data-rate DRAMs, graphics DRAMs, phase-change memories, magnetoresistive RAMs, and resistive RAMs, some of which present new technical challenges to testing with their advanced packaging.
IC Insight predicts 22% semi growth 10/20/2017
For 2017, IC Insights expects a whopping 77% increase in the DRAM ASP, which is forecast to propel the DRAM market to 74% growth this year, the largest growth rate since the 78% DRAM market increase in 1994.
LG and Qualcomm partners in self-driving automobile parts 10/20/2017
Under the agreement, the two companies opened a join research lab for V2X technology in Seoul. They also plan to establish another research center in South Korea by the end of this year.
Nanya Technology rolls 20nm DRAM 10/19/2017
NANYA is scheduled to enter mass production of 20nm 8Gb DDR4 chips in the fourth quarter of 2017, according to the Taiwan-based DRAM chipmaker.
Shell opened first EV charging station 10/19/2017
Three charging stations are opening Wednesday at locations in London, Surrey and Derby, with seven more expected by the end of the year. It comes only days after Shell agreed to buy electric vehicle charging firm NewMotion.
China's president Xi calls for turther technology developement 10/19/2017
In a speech at the opening of a party congress, Xi called for making a "country of innovators" and creating competitors in aerospace, cyberspace, clean energy and other areas.
No hope to revamp NAFTA this year 10/19/2017
A fourth round of negotiations between the U.S., Mexico and Canada ended in mutual exasperation Tuesday. Talks will continue next month in Mexico City and will spill over into next year.
Nanya would rather concentrate on server market DRAM 10/18/2017
Nanya is to re-enter the server market by offering a new 8-gigabit DDR4 DRAM this quarter, in pursuit of its next growth engine.
Semiconductor shipment to break record of 11.448 billion sq. inches 10/18/2017
"Silicon shipment volumes are expected to ship at historic highs for this year and into 2019," said Dan Tracy, senior director of Industry Research & Statistics at SEMI.
Microchip ‘SuperFlash’ memory offers 64Mbit with reduced power consumption 10/18/2017
It supports full command-set compatibility to traditional Serial Peripheral Interface (SPI) protocol.
New partnership in MRAM developement 10/18/2017
Spin Transfer Technologies (STT) and capital equipment vendor Tokyo Electron Ltd. (TEL) have entered into a collaborative engineering program to jointly develop process technologies for SRAM- and DRAM-class spin-transfer torque (ST) MRAM devices.
Market outlook for NAND remains unchanged regardless of glitch at Toshiba 10/17/2017
Toshiba will be able to deliver its NAND Flash shipments as per the dates and volumes in its fourth-quarter contracts, says DRAMeXchange.
SMIC appointed new executives 10/17/2017
Semiconductor Manufacturing International Corporation ("SMIC"; the largest and most advanced foundry in mainland China, today announced the appointment of Dr. Haijun Zhao and Dr. Liang Mong Song as SMIC Co-CEO and Executive Director.
China plans to double its 12 inch capacity in 2018 10/17/2017
Shanghai Xinsheng is scheduled to come online at the end of 2017 with monthly capacity of 150,000 12-inch wafers in the first phase, and the monthly capacity will double to 300,000 units by 2020.
Toshiba eager to close the Bain deal while WD is still fighting 10/17/2017
Channels for talks with Western Digital remain open while Toshiba hoped for cordial relations and continued cooperation with the company.
Samsung Electronics CEO resigned 10/16/2017
The surprise resignation of Samsung’s chip and display head came as he was expected to take a bigger role following Lee’s arrest in February and the departures of other key executives in the wake of the bribery scandal.
DRAM manufacturers stock rises 10/16/2017
While demand for DRAM was expected to rise 20.6% next year, chipmakers were only planning to add 19.6 percent in capacity globally, a TrendForce report said
ON Semi released new image sensors 10/16/2017
The new parts provide a complete solution with the new image sensor and processing functionality integrated within a low power system-on-chip (SoC) that simplifies and speeds adoption in applications like rear and surround view cameras.
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