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| iPhone 11 will be more affordable |
2/19/2018 |
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Apple will release an improved version of the iPhone 11 that will still be rather affordable. This smartphone will feature a 6.1-inch screen, yet will retail at a price point of just $699.
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| EUV lithography challenges the semi industry |
2/19/2018 |
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As chip makers start using EUVL in fabs--scanner uptime (mostly related to source), lack of commercial actinic patterned mask inspection tools and readiness of EUV mask pellicles will challenge their future.
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| ON Semi offers 2D and 3D CMOS image sensor |
2/19/2018 |
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ON Semi says the depth mode will enable depth mapping concurrently, while shooting video at 30 fps. The device has been designed to empower innovative industrial and consumer end-product applications with its 3D features.
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| Taiwan forecast 6% increase in semiconductor output |
2/16/2018 |
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In the IC manufacturing segment, the annual growth in output is expected to be 5.9 percent in 2018, while the IC packaging and testing segments are likely to show 4.5 percent and 4.2 percent growth, respectively.
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| China plead for Trump to avoid trade interuption |
2/15/2018 |
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U.S.-Chinese trade is "mutually beneficial" and disagreements are inevitable, said foreign ministry spokesman Geng Shuang. He said all governments should "spare no effort to avoid negative impacts" on the global recovery.
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| Is run away inflation on the horizon? |
2/15/2018 |
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Analysts are hyper-focused on whether faster price increases may cause the Federal Reserve to raise short-term interest rates faster than expected. Higher interest rates make it more expensive for consumers and businesses to borrow and spend and could slow growth.
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| Micron offers 3D quad-level NAND for higher density SSD |
2/14/2018 |
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We could be looking at larger capacity SSDs at more attractive price points. That's because QLC flash memory offers a 33 percent higher bit density and lower per-bit cost compared to triple-level cell (TLC) flash memory that is commonly found in high-capacity SSDs currently.
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| Broadcom added a $8 billion breakup clause to its latest offer |
2/14/2018 |
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As you will see, the agreement is highly favorable to Qualcomm and its stockholders and includes an $8 billion regulatory reverse termination fee and a 6% per annum regulatory ticking fee on the cash portion of the merger consideration (net of dividends).
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| Long pending ASE/SPIL merger approved by shareholder |
2/14/2018 |
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Both ASE and SPIL held their extraordinary shareholders meetings yesterday (February 12) to vote on their merger plan, which had already received all the necessary regulatory approvals from related authorities including those in China and the US.
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| Total DRAM revenue to increase by 30% this year |
2/14/2018 |
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Industry output value for the fourth quarter of 2017 climbed 14.2% sequentially to nearly US$21.9 billion, driven by a seasonal pickup in demand for smartphones and rising mobile DRAM prices
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| New investment focus on DRAM |
2/13/2018 |
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Memory revenue increased by 61.5 percent last year, with DRAM sales growing by a 76.8 percent and NAND sales increasing by 47.5 percent.
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| Qualcomm signing up OEM's on 5G |
2/13/2018 |
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Qualcomm announced that 19 OEMs plan to use its Snapdragon X50 5G cellular modem and 18 carriers will conduct 5G field trials with it.
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