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| Prosecutors appealed and demand 12-year prison term for Samsung heir |
12/28/2017 |
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In August, a lower court sentenced Lee to five years in prison for offering bribes to former South Korean President Park Geun-hye and her confidante while Park was in office. Both Lee and prosecutors, who earlier had requested a 12-year prison term, appealed that ruling.
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| Court fine Apple for late to produce suit evidence |
12/27/2017 |
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Apple is being fined $25,000 a day for missing a court-imposed deadline to produce evidence in a government lawsuit that alleges mobile chip supplier Qualcomm has been imposing unfair licensing terms on the makers of smartphones.
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| Molecular memory advanced with 2D material |
12/27/2017 |
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The technology uses electron injection — not to encode the memory as charge, spin, or any ephemeral quantity, but rather to change the crystalline lattice structure of MoTe2 in a reversible process.
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| Famous Apple chip designer migrates to Google |
12/27/2017 |
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Bruno served at Apple for five years before joining Google this month. Bruno has run the silicon competitive analysis group at the Cupertino-based iPhone maker. The group was responsible for making sure Apple stayed ahead of its rivals, 9to5Google reports. He has worked on a series of iPhone chips since 2012.
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| Micron to have GDDR6 production in 2018 |
12/26/2017 |
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Micron is gearing up to transition from the older generation of GDDR5 graphics memory, which is currently in production, to GDDR6, which is coming in the first half of 2018.
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| China wants to be self-sufficient on memory chips |
12/22/2017 |
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YMTC is building a flash fab site in the Wuhan Donghu New Technology Development Zone. Innotron is building a mobile DRAM capability. JHICC is making speciality DRAM for the consumer electronics market.
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| Chinese startup discloses AI processor |
12/22/2017 |
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Horizon Robotics Inc, a Chinese startup backed by chip giant Intel Corp, has unveiled two artificial intelligence-tailored processors to power intelligent driving vehicles and image recognition-enabled smart cameras.
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| Murata to increase flex PCB production for Apple iPhone |
12/22/2017 |
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The company’s MetroCirc circuit boards can be bent, making it easier to pack them into smartphones, including the latest iPhone X and 8 models. Factories are already operating at full capacity, forcing the Japanese company to turn customers away.
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| Samsung enters into 2nd generation 10nm DRAM production |
12/21/2017 |
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The South Korean tech giant said it is producing 8-gigabit DDR4 chips using 10-nanometer class technology, which marks another breakthrough after Samsung adopted the first-generation technology in February 2016.
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| Micron gained on strong DRAM sales |
12/21/2017 |
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Revenues for the first quarter of 2018 were 11 percent higher compared to the fourth quarter of 2017, reflecting increased demand for our mobile, server, and SSD products.
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| Recounting DRAM latency issues |
12/20/2017 |
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DRAM latency problem into four issues:
* Inefficient bulk data movement.
* DRAM refresh interference. While DRAM is being refreshed, it can't all be accessed.
* Cell latency variation, due to manufacturing variability.
* The fourth issue, the impact of power on latency
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| Nanya enters market with self developed 8GB 20nm DDR4 |
12/19/2017 |
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Nanya Technology Corporation announced that they have completed their first independently-developed 20nm process 8GB DDR 4 DRAM, and after having obtained PC companies’ certification, they will begin shipments this month.
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| ASE/SPIL stock swap date to defer |
12/19/2017 |
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The companies have decided to defer the long stop date for share exchange from December 31, 2017 to October 31, 2018 beause their plan to set up a joint holding company in May 2018 had just been approved by Anti-monopoly Bureau under China's the Ministry of Commerce November 24.
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| Globalfoundries to put autombile chips in Dresden and IoT in Chengdu |
12/19/2017 |
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Globalfoundries (GF) will have its 12-inch wafer fabs in Dresden, Germany focus on using FD-SOI (fully-depleted silicon-on-insulator) process technology to fabricate automotive-use chips for the European market, while its fab in Chengdu, China will be dedicated to manufacturing ICs on the process for IoT (Internet of Things) and 5G applications.
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