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Samsung preparing its mid-range Galaxy J8 3/6/2018
The mid-range handset will be powered by a 1.6GHz octa-core Exynos 7870 processor, paired with 3GB RAM.
Xiaomi think it's ready to take on the U.S. market 3/6/2018
A new report from Wall Street Journal cites Xiaomi's Chairman Lei Jun, who said his company plans “to start entering the market by end 2018, or by early 2019.” Xiaomi is the fourth largest handset maker in China.
January semiconductor sales up 22.7% from last year 3/6/2018
Global semiconductor industry is off to a strong and promising start to 2018, posting its highest-ever January sales and 18th consecutive month of year-to-year sales increases.
Qualcomm delays meeting citing government investigations on Broadcom bid 3/6/2018
The meeting, originally scheduled for Tuesday (March 6), would have marked the deadline for a proxy vote for board directors on the largest acquisition proposed in the semiconductor industry to date.
Cypress's FRAM offers unlimited endurance for automotive applications 3/5/2018
Cypress unveiled a new serial nonvolatile memory family to meet the performance and reliability demands of mission-critical data capture. The Excelon (FRAM) line was designed specifically for the high-speed nonvolatile data logging needed for autonomous vehicles.
Infineon JV with Chinese to offer EV power modules in China 3/5/2018
The joint venture, to be named SAIC Infineon Automotive Power Modules and headquartered in Shanghai, will make the power modules at Infineon’s plant in Wuxi, China.
White House questions Broadcom/s bid on Qualcomm 3/5/2018
Broadcom Ltd.’s hostile bid for Qualcomm Inc. is drawing the attention of a secretive U.S. panel that reviews whether acquisitions of American companies raise national security concerns
Microchip Technology to acquire Microsemi 3/5/2018
Microsemi supplies high-performance analog and mixed signal integrated circuits and semiconductors to the aerospace and defense, communications, data center and industrial sectors.
Samsung in preparation to build another major memory fab 3/2/2018
Samsung has begun preparations to build another semiconductor production facility near Pyeongtaek, South Korea. The fab will produce various types of memory as the market demands. The new fab may be larger than the adjacent fab that began operations last year.
Cadence to collaborated with Imec on 3nm note MPU 3/2/2018
The project was completed using design rules focused at EUV and 193nm immersion lithography, along with Cadence’s Innovus and Genus software suites.
China to raise $31.5 billion for their Semiconductor Industry 3/2/2018
China aggressively invest in homegrown chip companies and accelerate its ambition of building a world-class semiconductor industry.
Intel offers further Spectre patch for older PC models 3/2/2018
The updates address Variant 2 of the three Meltdown and Spectre CPU flaws that Google revealed on January 3 and are released to end-users as firmware or BIOS updates from hardware manufacturers.
TDK acquiresd Chirp Micro, a sona-on-chip startup 3/1/2018
Chirp is hopeful that the deal with TDK will create an opportunity for the startup team to accelerate the growth of its ultrasound technology across several markets ranging from automotive and IoT to home and mobile devices.
Toshiba offers micro SDXC card that host 256GB memory 3/1/2018
With capacities of up to 256GB maximum read/write speeds of 98MB/s and 65MB/s respectively, as well as a new Video Speed Class 30 (V30), the M303 allows users to record and store 4K Ultra HD content.
Samsung demos ISOCELL image sensor and Exynos chips at Mobile World Congress 2018 3/1/2018
At Samsung’s semiconductor booth, the company prepared four separate rooms for memory chips, system LSI chips, display and electro-mechanic products.
Consumer confidence at highest since 2000 3/1/2018
The Conference Board says its consumer confidence index rose to 130.8 in February, highest since November 2000 and up from 124.3 in January.
U.S. regulators blocked sales of Xcerra to China 2/28/2018
Xcerra said that CFIUS had blocked its proposed $580 million sale to China-backed investment fund Hubei Xinyan. Xcerra and Xinyan are discussing alternatives to pursue opportunities in new and existing markets in China.
Huawei has signed up 30 carriers for early 5G trial 2/28/2018
Huawei’s Hu said 2018 will mark the first year of commercialization for 5G.
Micron offers new 3D NAND memory system for high end smartphones 2/28/2018
These second-generation 3D NAND storage products, supports the high-speed Universal Flash Storage (UFS) 2.1 standard. Micron's new mobile 3D NAND products are available in 256GB, 128GB and 64GB capacities.
Intel to put embedded 5G modem into some PC 2/28/2018
Dell, HP and Microsoft are working with Intel to ship PCs before the end of 2019 using its XMM 8060 5G modem.
Mobile DRAM revenue pulls back some after seasonal rush 2/27/2018
Global mobile DRAM revenue hit a new high of US$8 billion in 4Q17, a robust sequential growth of 23.6%. In 1Q18, global mobile DRAM revenues are expected to grow slower due to weaker demands on the smartphone market. Most smartphone brands have made adjustments to their production plans and postponed the restocking of materials.
Nanya predicts a good year for DRAM 2/27/2018
gThe industryfs uptrend only kicked off in the second half and is to extend into the whole of this year. The strongest demand comes from servers and data centers.h
South Korea's chip exports up 53% in January 2/27/2018
Exports of semiconductors soared 53.8 percent on-year to $9.86 billion in January. In September last year, exports of semiconductors soared 73.3 percent on-year to an unprecedented $9.88 billion, and subsequently surpassed $9 billion for five months in a row.
Demand for voice command chips to increase 2/27/2018
MediaTek's shipments for voice-assistant devices are expected to surge over 50% on year in 2018, as the chip firm has obtained orders from the world's leading smart speaker vendors, according to the sources.
Xiaomi announced new phone with Snapdragon 845 chipset 2/26/2018
According to previous rumors, the device will come with 8GB of LPDDR4X RAM along with 256GB of high speed UFS storage. A pair of 12MP cameras will adorn the back of the handset and an "under-the-display" fingerprint scanner will be on board.
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