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European countries screamble to seek exemption on tarriff 3/23/2018
President Donald Trump's strong-armed trade policies have set off an intense scramble among industry groups, companies and foreign countries seeking exemptions from tariffs of 25 percent on steel imports and 10 percent on imported aluminum.
More smartphone makers opt'd for custom AP chips 3/23/2018
It is estimated 26.9% of smartphone AP shipments will have deep learning inference and even training capabilities enabled by heterogeneous computing in 2018.
Rumor that Broadcom may be going for MediaTek 3/22/2018
After the Broadcom-Qualcomm debacle, the Singapore-based chip company has set its sights on Qualcomm’s nearest rivals — MediaTek, Xilinx Inc and Cirrus Logic Inc — as potential targets, the Chinese-language Economic Daily News reported yesterday.
Expectations on Micron stock soared 3/22/2018
While analyst price hikes usually come after a company reports earnings, nearly a third of analysts who cover the company have raised their price targets in the days leading up to the report.
Microsoft's Project Denali to speed up flash memories in cloud 3/22/2018
Denali works by splitting apart the monolithic components of an SSD into two different modules. The drive deals with bad blocks, media, and power failures, presenting a set of clean memory blocks. Companies can then create an optimized software interface to handle tasks like garbage collection and wear leveling, based on the applications that they run.
Would $60 billions tarriff hold back China's ambitions ? 3/22/2018
While there is broad support in the corporate community for a tougher U.S. stance toward China, Trump’s critics say he erred by first tackling other trade issues.
Rambus and IBM to develope hybrid memory system for servers 3/21/2018
As part of the collaboration, Rambus Labs and IBM will develop a flexible prototype hybrid memory platform using the OpenCAPI interface to demonstrate performance of multiple memory types in real-world server applications.
Apacer Technology achieved DDR4-2666 module production 3/21/2018
DDR4-2666 is expected to emerge as the mainstream spec for memory products after Intel and AMD launch their new-generation server processors that can support transmission speed of up to 2666 MT/s.
IBM Power 9 processor outperforms X86 servers 3/21/2018
China’s Alibaba and Tencent also are testing Power 9. Tencent said Power 9 is delivering 30 percent more performance than the x86 while using fewer servers and racks.
KLA-Tencor acquires diverse Israel company, Orbotech 3/21/2018
The firm says will help diversify its revenue base and add $2.5 billion of addressable market opportunity in high-growth printed circuit boards, flat panel displays, packaging and semiconductor manufacturing.
Server DRAM prices continue to rise due to high demand in China 3/20/2018
Suppliers are progressing towards the specification of 32GB RDIMM. DRAM supply will grow by only 4% compared with 4Q17 in order to ensure sales by favorable prices. In 2Q18, as domestic server demand from China rises, the server DRAM prices will continue to rise, says DRAMeXchange.
Special foundry customized to niche process 3/20/2018
The SkyWater 200mm foundry in an office park outside the Mall of America in Bloomington, Minnesota, shows avenues for growth making semiconductors at 90nm and larger nodes.
China is certain that it can meet its own semiconductor production needs 3/20/2018
China wafer foundry houses still technologically lag far behind first-tier players although they will surely grow into strong competitors in the long run, according to MC Chiu, chairman of Taiwan-based Gudeng Precision Industrial, a supplier of photomask and wafer handling solutions and equipment.
5G and AI could lead semi industry to $500 billion 3/20/2018
A new round of growth mainly driven by AI and 5G technologies and applications and may challenge US$500 billion in the foreseeable future according to Ajit Manocha, president and CEO of SEMI.
Notebook shipment recovers some 3/19/2018
“Looking into the second quarter, we expect total notebook shipments of 29.7 million units (up 10 percent quarter-on-quarter, but down 5 percent year-on-year), reaching the high end of the historical range since 2013 with a 3 to 10 percent increase quarter-on-quarter,” the Morgan Stanley analysts said.
Micron's CEO Sanjay Mehrotra cites high barriers to entry for Chinese suppliers 3/19/2018
"To be a meaningful player, you need leading-edge technology, you need intellectual property, you need a large scale of production, you need product design, product specifications that meet customer application requirements, and you need quality,"
ChipMOS found business on niche-market DRAM and NOR flash packaging 3/19/2018
ChipMOS' production capacity for COF packaging is estimated at 6,500-7,000 wafers monthly. Demand for 12-inch fine-pitch COF packaging has been strong, said company chairman.
Broadcom: We're open to looking at anything that helps 3/19/2018
While revenue rose 28%. Broadcom CEO Hock Tan expressed a willingness to pursue new acquisition targets in the wake of the failed Qualcomm bid,
ChipMOS profit tumbled on order cuts by Micron 3/16/2018
Net profit plunged to NT$163 million (US$5.58 million) from NT$613.9 million the previous year, with earnings per share (EPS) dipping to NT$0.19 from NT$0.72.
Semi market forecast revised up 15% 3/16/2018
Just as strength in the memory chip market drove the broader chip market last year, the same trend is holding true early in 2018. IC Insights (Scottsdale, Ariz.) dramatically increased its forecast for DRAM sales growth to 37 percent from 13 percent and lifted its forecast for NAND sales growth to 17 percent from 10 percent.
In spite of failed Broadcom/Qualcomm merger, more semi M&A are coming 3/16/2018
If Broadcom bought Qualcomm the combined company could have held a 59 percent share in Wi-Fi, 46 percent in Bluetooth, 67 percent in location chips and 41 percent in RF, he estimated. Such dominance is “unheard of…[and] an unhealthy practice.
Globalfoundries now delivers 90nm silicon photonics on 300mm wafer 3/16/2018
Globalfoundries (GF) says it has qualified the first 90nm manufacturing process using 300mm wafers. The foundry has also revealed plans to move to 45nm in order to deliver higher bandwidth and better energy efficiency.
As prices drop, more Notebook incorporated SSD 3/15/2018
Solid-state drives (SSDs) will be featured in more than half of notebook PCs produced by OEMs for the first time this year as the result of falling prices
Samsung to expand NAND fab in China 3/15/2018
The South Korean tech giant plans to start the construction to expand the facilities in Xian later this month, with Kim Ki-nam, the head of Samsung's crucial chip business, participating in the groundbreaking ceremony with Chinese provincial officials.
European Union seeking compromise on Trump tarriff 3/15/2018
EU Council President Donald Tusk put it succinctly in a Twitter message: "Make trade, not war, Mr President" and added that "Instead of trade war, we should go back to EU-US trade talks now."
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