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Intel unveiled new class of memory module made with X-Point memories 6/4/2018
Intel positions Optane DC persistent memory as a tier between DRAM and storage that will help accelerate in-memory databases in the data center. The idea is to cut latency by moving more of the workload closer to the processor.
ARM to offer CPU chip challenging Intel X86 6/1/2018
Arm announced a new mobile CPU core that it said can deliver performance within 10% of Intel’s latest Skylake chips. Analysts praised the architecture’s leap forward but said that they doubt Arm will take a significant share of today’s x86-based notebooks.
Texas Instruments supplies mmWave radar sensor chips for automobiles 6/1/2018
The radar sensors, which will first appear in vehicles on the road in late 2018, to enable ADAS applications, which include long-, short- and medium-range radar.
Samsung offers 32GB DDR4 modules for game computers 6/1/2018
Samsung started production of the industry's first 10-nano level 32GB DDR4 small outline dual in-line memory module (SODIMM). Samsung said the product provides optimized performances for premium gaming laptops, allowing users to play various titles more smoothly.
Nvidia CEO Claims AI revolve around GPU 6/1/2018
Huang detailed a "Cambrian explosion" of technologies driven by GPU-powered deep learning. In less than a decade, the computing power of GPUs has grown 20-fold, representing a 1.7-fold growth per year, far outstripping Moore's law.
China's complain on DRAM prices can shoot a hole on Micron stock prices 5/31/2018
Recent report from TrendForce's DRAMeXchange claims that China's Ministry of Commerce -- which focuses on antitrust probes -- recently met with Micron to express concerns about rising DRAM prices. This doesn't mean that China will launch an antitrust probe into Micron, but it raises some troubling questions about the chipmaker's future.
Qualcomm offers dedicated VR/AR chip 5/31/2018
The company says the XR1 can output video up to 4K resolution at 60 frames per second, that it’ll keep motion-to-photon latency “well below” 20 milliseconds, and that it can handle both 3DoF and 6DoF tracking for headsets and accompanying controllers if needed.
Trade talk goes into deadlock with China 5/31/2018
Trump's administration announced plans Tuesday to slap $50 billion worth of tariffs on Chinese technology while taking steps to impose new investment restrictions and export controls, aimed at pushing China to remove trade barriers.
Q1 economic growth revised down 5/31/2018
The U.S. economy grew at a weaker 2.2 percent annual rate in the first three months of the year. But given the economy's recent performance, analysts are still looking for a solid rebound in the current quarter.
Global NAND shipment down 3% 5/30/2018
Looking ahead to 2H18, stock-up demand related to the next iPhone release and the year-end busy season will stabilize prices of NAND Flash products. In fact, the NAND Flash demand from OEM has been constrained by surging prices for almost one year, so the latest development in price trend will spur OEMs in the PC and smartphone markets to upgrade the storage specifications of their upcoming products. In turn, the demand in the NAND Flash market will return to a state of healthy growth.
Samsung plans 3nm for 2021 5/30/2018
Samsung's GAA transistors are field-effect transistors (FET) that feature a gate on all four sides of the channel to overcome the physical scaling and performance limitations of FinFETs, including supply voltage.
China’s Anti-Monopoly Bureau discuss with Micron on DRAM prices 5/30/2018
China anti-trust laws provide for investigations of situation aimed at “limiting the amount of products for sale”.
Hong Kong Tencent Holdings vowed to support China semiconductor industry 5/30/2018
“The recent ZTE incident made everyone more clearly realize that however advanced one may be in mobile payment, without the mobile, the chips and the operating system, you still cannot compete,”
Reported China use the Qualcomm/NXP merger approval to trade for ZTE deal 5/30/2018
China’s review of Qualcomm’s largest-ever acquisition has languished amid an escalating trade fight between the world’s two largest economies, fueling concern that the NXP deal might become a bargaining chip.
U.S. proposed to put compliance officers inside ZTE 5/28/2018
"If we do decide to go forward with an alternative, what it literally would involve would be implanting people of our choosing into the company to constitute a compliance unit."
UMC to expand China fab. 5/28/2018
United Semi will build additional production capacity according to customer demand. UMC expects to see its overall revenues generated from the China market grow at a CAGR of 15% from 2018 to 2020.
China made semiconductor goal to be "made in China 2025" 5/28/2018
The world’s second-largest economy has big ambitions when it comes to Fabs, a crucial component of President Xi Jinping’s “Made in China 2025” policy.
Qualcomm put all AI developments under one group 5/28/2018
The reorganization reflects Qualcomm's doubling down on embedded artificial intelligence, which it argues can improve privacy for applications like voice-controlled speakers and save energy wasted sending information to the cloud.
California court ordered Samsung to pay $539 million in damages to Apple 5/25/2018
Samsung must pay about $533.3 million for infringing on three Apple design patents and about $5.3 million for infringing on two utility patents. The infringements in question occurred in Android phones Samsung sold in 2010 and 2011.
Chinese foundries work hard to transition towards sub-10nm process 5/25/2018
Semiconductor Manufacturing International (SMIC) and Huali Microelectronics, and memory foundry specialist Yangtze Memory Technologies (YMTC) are all gearing up for transition to sub-10nm process technology with respective deployments kicking off this year.
China starts to supply processor chips from domestic semiconductor makers 5/25/2018
China’s semiconductor industry, which relies on an annual US$200 billion of imports from the US, has been in the spotlight recently after ZTE, the nation’s biggest publicly-traded telecom equipment maker, was banned from buying key American components for seven years.
The chip world has to go “heterogeneous integration” (HI) 5/25/2018
HI is “a holistically integrated approach” that involves system design, algorithms, and software, together with different types of silicon dice such as SoC, DRAM, flashes, A-to-D/D-to-A, power management, security, and reliability control dices.
A startup works with Imec to shrink the SRAM cell 5/24/2018
A team from Unisantis and Imec is using the startup’s so-called Surrounding Gate Transistor with a 50-nm-minimum pillar pitch. The design is suited to a 5-nm SRAM.
TSMC starts production on Apple next generation chip 5/24/2018
The processor, likely to be called the A12 chip, will use a 7-nanometer design that can be smaller, faster and more efficient than the 10-nanometer chips in current Apple devices.
Wyoming bets on blockchain economy 5/24/2018
In March, Gov. Matt Mead signed four blockchain-friendly bills that arguably make the least-populated state friendlier to the technology than any other.
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