Home
News
Products
Corporate
Contact
 
Wednesday, November 27, 2024

News
Industry News
Publications
CST News
Help/Support
Software
Tester FAQs
Industry News
Cadence to collaborated with Imec on 3nm note MPU 3/2/2018
The project was completed using design rules focused at EUV and 193nm immersion lithography, along with Cadence’s Innovus and Genus software suites.
China to raise $31.5 billion for their Semiconductor Industry 3/2/2018
China aggressively invest in homegrown chip companies and accelerate its ambition of building a world-class semiconductor industry.
Intel offers further Spectre patch for older PC models 3/2/2018
The updates address Variant 2 of the three Meltdown and Spectre CPU flaws that Google revealed on January 3 and are released to end-users as firmware or BIOS updates from hardware manufacturers.
TDK acquiresd Chirp Micro, a sona-on-chip startup 3/1/2018
Chirp is hopeful that the deal with TDK will create an opportunity for the startup team to accelerate the growth of its ultrasound technology across several markets ranging from automotive and IoT to home and mobile devices.
Toshiba offers micro SDXC card that host 256GB memory 3/1/2018
With capacities of up to 256GB maximum read/write speeds of 98MB/s and 65MB/s respectively, as well as a new Video Speed Class 30 (V30), the M303 allows users to record and store 4K Ultra HD content.
Samsung demos ISOCELL image sensor and Exynos chips at Mobile World Congress 2018 3/1/2018
At Samsung’s semiconductor booth, the company prepared four separate rooms for memory chips, system LSI chips, display and electro-mechanic products.
Consumer confidence at highest since 2000 3/1/2018
The Conference Board says its consumer confidence index rose to 130.8 in February, highest since November 2000 and up from 124.3 in January.
U.S. regulators blocked sales of Xcerra to China 2/28/2018
Xcerra said that CFIUS had blocked its proposed $580 million sale to China-backed investment fund Hubei Xinyan. Xcerra and Xinyan are discussing alternatives to pursue opportunities in new and existing markets in China.
Huawei has signed up 30 carriers for early 5G trial 2/28/2018
Huawei’s Hu said 2018 will mark the first year of commercialization for 5G.
Micron offers new 3D NAND memory system for high end smartphones 2/28/2018
These second-generation 3D NAND storage products, supports the high-speed Universal Flash Storage (UFS) 2.1 standard. Micron's new mobile 3D NAND products are available in 256GB, 128GB and 64GB capacities.
Intel to put embedded 5G modem into some PC 2/28/2018
Dell, HP and Microsoft are working with Intel to ship PCs before the end of 2019 using its XMM 8060 5G modem.
Mobile DRAM revenue pulls back some after seasonal rush 2/27/2018
Global mobile DRAM revenue hit a new high of US$8 billion in 4Q17, a robust sequential growth of 23.6%. In 1Q18, global mobile DRAM revenues are expected to grow slower due to weaker demands on the smartphone market. Most smartphone brands have made adjustments to their production plans and postponed the restocking of materials.
Nanya predicts a good year for DRAM 2/27/2018
gThe industryfs uptrend only kicked off in the second half and is to extend into the whole of this year. The strongest demand comes from servers and data centers.h
South Korea's chip exports up 53% in January 2/27/2018
Exports of semiconductors soared 53.8 percent on-year to $9.86 billion in January. In September last year, exports of semiconductors soared 73.3 percent on-year to an unprecedented $9.88 billion, and subsequently surpassed $9 billion for five months in a row.
Demand for voice command chips to increase 2/27/2018
MediaTek's shipments for voice-assistant devices are expected to surge over 50% on year in 2018, as the chip firm has obtained orders from the world's leading smart speaker vendors, according to the sources.
Xiaomi announced new phone with Snapdragon 845 chipset 2/26/2018
According to previous rumors, the device will come with 8GB of LPDDR4X RAM along with 256GB of high speed UFS storage. A pair of 12MP cameras will adorn the back of the handset and an "under-the-display" fingerprint scanner will be on board.
Huawei announced first 5G chips at Mobile world Congress 2/26/2018
The company claims that its Huawei Balong 5G01 chip is the first to support the new 3GPP standard for 5G networks, and that it should be able to download data at 2.3Gbps.
Top firms spent $35.9 billion in semiconductor R&D in 2017 2/26/2018
The 10 largest semiconductor R&D spenders increased their collective expenditures to US$35.9 billion in 2017, an increase of 6% compared to US$34.0 billion in 2016.
Samsung reported building $6 billion fab with EUV process 2/26/2018
Extreme ultra violet (EUV) lithography equipment will be installed in the plant, which will help Samsung maintain technological leadership in very large scale integrations.
Intel to collaborate with Chinese mobile chip maker 2/23/2018
Intel Corporation officially announced a long-term strategic collaboration on 5G. The companies plan to develop a 5G smartphone platform for the China market that will feature an Intel 5G modem and will be targeted to coincide with 5G network deployments in 2019.
Qualcomm adopts 7nm Samsung process on Snapdragon 5G chipsets 2/23/2018
The two have consistently patched things up and cooperate on a win-win arrangement, despite some disputes over licensing agreements.
Irish chipmaker received funding to expand ultra-wideband wireless technology 2/23/2018
The company offers ultra-wideband wireless technology via a low-power chip that can identify the specific location of any object indoors to within a few centimetres. the data communication capability of the chip makes it a good fit for Internet of Things (IoT) applications.
Broadcom lower bid to offset Qualcomm's increased NXP offer 2/23/2018
Qualcomm issued a statement Wednesday that criticized the reduced offer, saying that Broadcom does not understand the value that the NXP acquisition would bring to Qualcomm.
Micron announce plans for quadruple-level cell (QLC) flash memory 2/22/2018
SLC drives have the greatest endurance and best voltage tolerance, but they have much lower capacity. Given the increasing use of flash, users want capacity first and foremost.
Intel plans to invest $5 billion in expanding production in Israel 2/22/2018
Intel Technology and Manufacturing Group Plant Manager, Daniel Benatar presented a plan to start expanding the Kiryat Gat fab this year. The $5 billion investment would be completed in 2020.
 264  |  265  |  266  |  267  |  268  |  269  |  270  |  271  |  272  |  273 

CST Inc. Memory Tester DDR Tester
Copyright © 1994 - 2023 CST, Inc. All Rights Reserved