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| Foxconn to build 12 inch fab |
5/7/2018 |
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Foxconn is looking to step into wafer fabrication, and already has its semiconductor subgroup evaluate the feasibility of building two 12-inch wafer plants, the sources indicated.
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| Autonomous agriculture is happening much faster than autonomous cars |
5/7/2018 |
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John Deere has been involved in everything from system design to development of the human-machine interfaces that support Deere’s semi-autonomous vehicle systems. The company’s Intelligent Systems Group developed many of the components for Deere’s semi-autonomous vehicles, from the GPS receiver to the embedded controller that helps drive some of the vehicles subsystems to accomplish semi-autonomous jobs.
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| Infineon optimistic on revenue growth |
5/4/2018 |
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Infineon said it expected revenues in the year to Sept. 30 to grow by 4-7 percent, lifting the lower end of the range by a percentage point from earlier guidance
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| Chip sles continue to grow |
5/3/2018 |
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Sales of semiconductors reached US$111.1 billion during the first quarter of 2018, an increase of 20% compared to the first quarter of 2017, according to The Semiconductor Industry Association (SIA).
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| Spin Transfer Technologies unveils new MRAM |
5/2/2018 |
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Announced at Intermag, a conference on applied magnetism, Spin Transfer Technologies (STT)'s Precessional Spin Current (PSC) structure has the potential to enhance MRAM's density and zero leakage capabilities.
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| Foundry in U.K. to offer GaN process |
5/2/2018 |
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“Our GaN HEMT process addresses a growing UK space and defence customer base. The process developed over the last two years enables a unique UK sovereign supply,”
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| Toshiba might not want to sell off any more |
5/2/2018 |
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Toshiba repaid more than 40% of the debt owed to banks in a single quarter. The money owed to main lenders Sumitomo Mitsui Banking Corp. and Mizuho Bank stood at 80 billion yen each in March, plunging by 60% over the three months. The amount owed to the other four banks dropped as well.
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| Intel to delay 10nm volume production |
5/1/2018 |
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Intel's 10nm shrink – implementing a 2.7x density increase over the 14nm process – had been too ambitious. The industry average increase is 1.5-2x. Intel will increase density 2.4x in the 10nm-7nm transition. 7nm is when Intel will introduce EUV.
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| TSMC set $13.5 billion aside for R&D |
5/1/2018 |
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The proposed investment is subject to the government’s ability to procure and integrate more land into the Hsinchu science park in Taiwan, which is currently full, as well as to environmental assessments.
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| Class Action filed for DRAM price fixing |
4/30/2018 |
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Another class action lawsuit has been filed, alleging that Samsung, Hynix, and Micron conspired to limit the supply of memory, keeping consumer prices artificially high as a result.
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| Jeff Bezos' rocket took flight |
4/30/2018 |
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The New Shepard capsule successfully detached from its booster, as planned, at an altitude of about 47 miles, and went on by itself to reach a height of 351,000 feet, or about 66.5 miles.
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| Huawei under U.S. investigation |
4/27/2018 |
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The U.S. Department of Justice is looking into whether the world's No. 3 smartphone maker violated American sanctions targeting Iran, media outlets reported on Wednesday.
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| Taiwan, king of semiconductor material market |
4/27/2018 |
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At US$10.3 billion, Taiwan remained the largest region of the global semiconductor materials market in 2017, SEMI noted. China solidified its hold on the second spot, followed by South Korea and Japan.
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