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| IC Insights forecasts analogue IC market to grow |
1/15/2018 |
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Report forecasts that revenues for analogue products—including both general purpose and application-specific devices—will increase by a CAGR of 6.6% to $74.8 billion in 2022 from $54.5 billion in 2017.
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| Fujitsu offers die shrinked 2 Mbit FRAM |
1/12/2018 |
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Die shrink offers a series of technical advantages. The maximum operating frequency has been increased from 25 MHz up to 40 MHz at 3 V supply. The device consumes max 2.0 mA active current at 40 MHz.
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| Texas Instruments applies DLP technology to adaptive headlampss |
1/12/2018 |
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The system can turn off the part of the headlight that would project into the windshields of oncoming cars. The new system can also project images and signs onto the road ahead of you, like lane markings during a road closure or navigation directions.
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| TSMC reports higher than expected revenue |
1/12/2018 |
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Taiwan Semiconductor Manufacturing Co yesterday posted a 10.1 percent growth in revenue for last quarter to NT$277.57 billion (US$9.38 billion), surpassing its projection.
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| Intel/Micron announced folding of IM Flash JV |
1/11/2018 |
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In a joint statement issued Monday (Jan. 8), Intel and Micron said they would "work independently" on future 3D NAND after completing development of their third generation of 3D NAND late this year and into 2019.
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| AT&T dropped plans to sell Huawei smartphones |
1/11/2018 |
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>Huawei suffered a setback in the U.S. market when a congressional report in October 2013 said it was a security risk and warned telecom carriers not to use its equipment.
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| MIcron CFO optimistic about memory market in 2018 |
1/10/2018 |
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Maddock says that the expected amount of increase in “bit supply,” the basic measure of how much is produced by the industry in total, is 40% to 50% this year, and that such a level of production can easily be absorbed by rising demand.
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| NVM Express takes hold in 2018 |
1/10/2018 |
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In June, the NVMe specification got its first major update in nearly three years, putting it on the cusp of becoming the defacto standard for SSD interfaces.
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| Is the memory boom ending? |
1/10/2018 |
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Samsung guidance fell short of consensus estimate, spooking investors already worried that a memory chip boom could be ending sooner rather than later.
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| Micron call quit on 3D stack NAND cooperation with Intel |
1/9/2018 |
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However, the parting of the ways does not apply to the phase-change based 3D-XPoint memory. The two companies said they will continue to cooperate on 3D-XPoint memory at the Intel-Micron Flash Technologies (IMFT) joint venture fab in Lehi, Utah.
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| Broadcom takes Qualcomm to Proxy vote challenge |
1/8/2018 |
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In November Broadcom made an unsolicited bid to buy Qualcomm for $70 a share. Qualcomm’s board rejected the buyout offer. The rebuff prompted Broadcom to challenge all 11 members of Qualcomm’s board with its own nominees.
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| Intel upgrade fixed processor security issues |
1/8/2018 |
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Security researchers had disclosed two security flaws exposing vulnerability of nearly every modern computing device containing chips from Intel, Advanced Micro Devices Inc (AMD.O) and ARM Holdings.
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| OmniVision offers 24M-Pixel image sensor |
1/5/2018 |
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OmniVision’s PureCel Plus stacked die 0.9-micron pixel leverages multiple generations of advanced pixel technologies to match the latest 1.0-micron pixel quantum-efficiency performance. This enables higher-resolution pictures and video in a compact form factor.
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