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Is Huawei on the way to be a $100 billion company? 10/30/2017
“Huawei is a one stop shop for services, we can provide a comprehensive full spec solution to our partners: connection, storage, cloud compute, IoT platform…”
Qualcomm's purchase of NXP delayed 10/30/2017
Qualcomm’s $38 billion acquisition of NXP will not happen — as promised — this year. The deal, is likely to slip to “early 2018.”
Nvidia talked about AI and deep learning 10/30/2017
Huang and MOST announced an extensive partnership centered on creating Taiwan's first AI-focused supercomputer at the National Center for High-Performance Computing as a platform for accelerating advanced research.
Macronix logged handsome profit 10/27/2017
Macronix International Co (ÍúºêëŠ×Ó) yesterday posted its strongest quarterly profit in seven years for last quarter, as prices climbed on strong demand for high-density memory chips and supply constraints.
NXP teams with Taiwan Metanoia on broadband communications technology 10/27/2017
The technology collaboration will deliver next generation broadband access solutions for home and carrier gateways, xDSL Central Office systems and standalone xDSL termination such as SFP modules.
Bain put partnership restrictions on Seagate and SK Hynix 10/27/2017
Seagate pledged not to buy any stake in the unit for 10 years as part of the $18 billion deal. Toshiba has said SK Hynix will for 10 years be prevented from accessing proprietary information belonging to the chip unit.
SK Hynix post $2.7 billion record profit 10/27/2017
SK hynix posted new quarterly records in net profit, operating income and revenue. Net profit came to a record high of 3.05 trillion won (US$2.7 billion).
AMD realize first profit in three years 10/26/2017
The company reported an adjusted 10 cents a share on revenue of $1.64 billion (with revenue up 26 percent from a year ago). Analysts were expecting 8 cents a share on revenue of $1.51 billion in the quarter.
Qualcomm leads the AP Chip market with 42% share 10/26/2017
“After a successful 2016, Qualcomm continued its momentum and gained market share with the help of a strengthened portfolio across the board from flagship to mid-range,”
Survey shows self-driving cars are making steady progress 10/26/2017
Survey found that traditional automakers and suppliers have been joined by emerging and mature technology companies in the race to fill the streets with driverless cars. However, there remain barriers to these technologies reaching their growth potential and gaining acceptance by the general public.
Order for durable manufacturing goods up 2.2% 10/26/2017
Commerce Department says that the September advance in durable goods followed a 2 percent rise in August and was the sharpest increase since a 6.4 percent jump in June.
Apple quietly pulled 256GB iPhone 7 10/25/2017
It appears that the company quietly pulled the 256GB iPhone 7 from sale on Sept. 12, the same day it unveiled the iPhone 8 and the iPhone X.
ARM core has new architecture for better security 10/25/2017
ARM has announced the launch of its Platform Security Architecture (PSA), a holistic set of documents and specifications that the company hopes will help shift the economics of security to the advantage of the entire industry.
GlobalFoundries invvesting into silicon startups 10/25/2017
The model is common in the global semiconductor industry, where research and development costs are high and the number of full-scale manufacturers is small.
Intel helped on Google Pixel chip development 10/25/2017
Last week, device repair website iFixit published a teardown of the Pixel 2 XL that showed what the Pixel Visual Core chip actually looks like. The serial number on the chip in a photograph begins with "SR3," like some Intel chips.
Delay of sales put $1 billion financial set back on Toshiba 10/24/2017
A highly contentious auction meant that a decision on the buyer took much longer than expected, and Toshiba has run the risk of not getting anti-trust clearance before the end of the financial year in March.
Apple to have difficult time to meet initial iPhone X quantity 10/24/2017
Some of the data gathered by Taipei-based KGI Securities research company forecasts that Foxconn will only ship around 25-30 million iPhone X units in Q4 2017. Previously, the company's analyst Ming-chi Kuo said around 30-35 million handsets will be shipped by the end of 2017.
Intel heavily invested in AI tech 10/24/2017
The acquired companies seemingly useful to Intel’s AI ambitions thus far include Altera (2015), Saffron (2015), Nervana (2016), Movidius (2016) and Mobileye (2017). Intel Capital has also fattened its AI portfolio with startups Mighty AI, Data Robot, Lumiata, CognitiveScale, Aeye Inc., Element AI and others.
New iMac reported to have AMD GPU 10/24/2017
The new iMac series adopt GPUs supplied by AMD, with the super workstation-class 27-inch iMac Pro equipped with Radeon Pro Vega 56 GPU and 8GB HBM2 memory or Radeon Pro Vega 64 and 16GB HBM2 memory.
Intel believes in future of Big Data 10/23/2017
“The world is undergoing a data explosion. By 2020, every autonomous vehicle on the road will create 4TB of data per day. A million self-driving cars will create the same amount of data every day as 3 billion people.”
10nm process expected to soar 10/23/2017
Based on the latest forecast, TSMC would log $3.2 billion from sales of 10nm chips in 2017. The company started 10nm production in the second quarter of this year.
China set out to improve quality 10/23/2017
"Three years ago, we relied chiefly on a price war to crack the market. But as more resources were poured into research and development, we saw a fundamental change."
Blooming business at foundries 10/23/2017
With Taiwan-based IC design houses ramping up wafer starts at their local foundry partners, the foundries will see their fab utilization rates remain high in the fourth quarter.
Silicon wafers expected to continue rising in 2018 and 2019 10/20/2017
Epitaxial silicon shipments for semiconductor applications (excluding solar) will total 11.5 billion square inches in 2017, up 8 percent from 2016. Shipments are expected to rise to 11.8 billion square inches next year and 12.4 billion square inches in 2019.
Challenges in testing the new memories 10/20/2017
Memory test vendors are contending with next-generation devices, such as 3D NAND flash memories, HBM2 chips, low-power double-data-rate DRAMs, graphics DRAMs, phase-change memories, magnetoresistive RAMs, and resistive RAMs, some of which present new technical challenges to testing with their advanced packaging.
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