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| Micron to have GDDR6 production in 2018 |
12/26/2017 |
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Micron is gearing up to transition from the older generation of GDDR5 graphics memory, which is currently in production, to GDDR6, which is coming in the first half of 2018.
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| China wants to be self-sufficient on memory chips |
12/22/2017 |
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YMTC is building a flash fab site in the Wuhan Donghu New Technology Development Zone. Innotron is building a mobile DRAM capability. JHICC is making speciality DRAM for the consumer electronics market.
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| Chinese startup discloses AI processor |
12/22/2017 |
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Horizon Robotics Inc, a Chinese startup backed by chip giant Intel Corp, has unveiled two artificial intelligence-tailored processors to power intelligent driving vehicles and image recognition-enabled smart cameras.
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| Murata to increase flex PCB production for Apple iPhone |
12/22/2017 |
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The company’s MetroCirc circuit boards can be bent, making it easier to pack them into smartphones, including the latest iPhone X and 8 models. Factories are already operating at full capacity, forcing the Japanese company to turn customers away.
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| Samsung enters into 2nd generation 10nm DRAM production |
12/21/2017 |
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The South Korean tech giant said it is producing 8-gigabit DDR4 chips using 10-nanometer class technology, which marks another breakthrough after Samsung adopted the first-generation technology in February 2016.
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| Micron gained on strong DRAM sales |
12/21/2017 |
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Revenues for the first quarter of 2018 were 11 percent higher compared to the fourth quarter of 2017, reflecting increased demand for our mobile, server, and SSD products.
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| Recounting DRAM latency issues |
12/20/2017 |
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DRAM latency problem into four issues:
* Inefficient bulk data movement.
* DRAM refresh interference. While DRAM is being refreshed, it can't all be accessed.
* Cell latency variation, due to manufacturing variability.
* The fourth issue, the impact of power on latency
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| Nanya enters market with self developed 8GB 20nm DDR4 |
12/19/2017 |
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Nanya Technology Corporation announced that they have completed their first independently-developed 20nm process 8GB DDR 4 DRAM, and after having obtained PC companies’ certification, they will begin shipments this month.
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| ASE/SPIL stock swap date to defer |
12/19/2017 |
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The companies have decided to defer the long stop date for share exchange from December 31, 2017 to October 31, 2018 beause their plan to set up a joint holding company in May 2018 had just been approved by Anti-monopoly Bureau under China's the Ministry of Commerce November 24.
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| Globalfoundries to put autombile chips in Dresden and IoT in Chengdu |
12/19/2017 |
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Globalfoundries (GF) will have its 12-inch wafer fabs in Dresden, Germany focus on using FD-SOI (fully-depleted silicon-on-insulator) process technology to fabricate automotive-use chips for the European market, while its fab in Chengdu, China will be dedicated to manufacturing ICs on the process for IoT (Internet of Things) and 5G applications.
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| Big Data intellegence to help IC design |
12/15/2017 |
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IC Manage CEO, described Big Data Labs as a “platform” on which his company hopes to “develop and customize new big-data-based design analytic tools” for customers.
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