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Special clause to allow Samsung Life Insurance Co. to sell off it's Samsung shares 8/16/2017
Revised bill of the Insurance Business Act proposed last year requires insurance companies to change the standard of asset management rates from acquisition costs to market prices and sell their stocks by lots within five years.
Qualcomm responded to SEC probe on dispute with Apple 8/16/2017
Apple and Qualcomm are locked in a sprawling legal battle, with the iPad maker objecting to Qualcomm's business model of requiring customers to sign patent license agreements before buying chips.
California court grant injunctions for WD to access Toshiba data base 8/16/2017
Tosiba had previously witheld early production parts of the new 96-layer NAND flash memories from WD.
ChipMOS finds market on display driver packaging 8/15/2017
Customers are benefiting from a recovery in demand for small displays used in smartphones, as most handset vendors have completed new designs by adding extra features, such as slim-barrel screens, or OLED displays.
China appoints provincial government to watch over Apple cloud center 8/15/2017
China has started to police the Internet more closely and introduced a new cyber security law on June 1 that imposes tougher controls over data than in Europe and the United States, including mandating that companies store all data within China and pass security reviews.
DRAM Q3 contract prices up 8/15/2017
Contract prices for PC DRAM modules rose nearly 40% sequentially to US$24 in the first quarter of 2017, and grew another 10% to US$27 in the second quarter. Prices for July alone increased 4.6% on month.
Toshiba's preferred bidder might have on time cash problem 8/15/2017
Toshiba Corp.’s talks to sell its chips business to a consortium led by Bain Capital hit an impasse over the timing of payments for the business and governance issues, casting doubt on the company’s ability to complete a deal quickly.
Using NFC on your phone as smartkey for your car 8/14/2017
To prevent the risk of smartkey hacking, South Korean automotive supplier Hyundai Mobis has developed an integrated smartkey system where a user installs an app on an NFC-supported smartphone and utilises it as a smartkey for their vehicle.
ChipMos hit temporal weakness on backend order 8/14/2017
Clients scaled back orders due to flagging smartphone demand in China and fewer orders from a major commodity DRAM client.
TSMC to spend $3.15 billion on new capacity 8/14/2017
TSMC recently decided to make a new capital investment of US$3.153 billion in order to increase its production capacity. US$528 million is scheduled to be spent on the construction of new manufacturing facilities and the rest goes to facility expansion and renovation.
Toshiba reconsidering Foxconn and WD 8/14/2017
On Thursday, Toshiba Chief Executive Satoshi Tsunakawa revised description, saying: "In addition to the (Japanese) consortium, we are also in talks with Western Digital and Hon Hai" Precision Industry Co.,
How much does Wisconsin give up to lure Foxconn? 8/11/2017
Wisconsin State Assembly Republicans planned to take the first votes on the package next week, with a committee vote set for Tuesday and a full floor session scheduled for Thursday.
U.S. productivity rises 8/11/2017
Productivity grew at an annual rate of 0.9 percent in the April-June quarter, slightly better than a scant 0.1 percent rate of increase in the first quarter, the Labor Department reported Wednesday.
Raw wafer supplies are tight but no shortage 8/11/2017
GlobalWafers expects the supply crunch to extend into the next two years due to limited new supply, shrugging off concerns over a potential supply glut due to SUMCOfs new fab.
China not likely to advance much on semi technology in next few years 8/11/2017
Lee Pei-ing, president of Nanya Tech, in an interview on July 27, said that it would take at least three to five years for Chinese challengers to catch up to the major players or cause oversupply issues in the industry.
ISSI offers reliable SLC Flash for automobile applications 8/10/2017
ISSI’s SLC NAND Flash product supports a wide operating temperature range of -40C to 105C, making it ideal for the next generation automotive, industrial and Internet of Things (IoT) applications.
Macronix announced Ultra-OctaFlash Memory for "instant-on" performance 8/10/2017
The series can meet the instant-on and interactive graphical user interface (GUI) requirements of next generation electronics.
Nvidia seeds Beijing automomous trucks technology startup 8/10/2017
Nvidia is targeting startups that are aligned with its strategy in fields as diverse as artificial intelligence (AI) and life sciences to automotive, robotics and virtual reality (VR).
Intel sucessfully acquired Mobileye, an automotive vision system company 8/10/2017
Israel-based Mobileye is the world's largest supplier of systems used in automotive collision detection systems and is working with Intel, car companies and auto parts suppliers to develop autonomous driving systems.
Micron is the first over the 10TB NVMe SSD barrier 8/9/2017
Micron 9200 SSDs push up to 5.5GB/sec of sequential reads, and up to 3.5GB/sec sequential writes. Random read/writes will hit 900K and 275K IOPS, while they arrive in up to 11TB.
Everspin announced Gbit MRAM 8/9/2017
Everspin hopes its products find sockets replacing DRAM in solid state drives and flash-storage arrays as a non-volatile buffer and write cache.
SoftBank to invest $5 billion into Nvidia through its $100 billion Vision Fund 8/9/2017
The equity shares are worth around $5 billion right now. Following the deal, the Vision Fund becomes Nvidia’s fourth largest shareholder.
Renesas ships R-Car system-on-chip (SoC) with  Automotive Grade Linux 8/9/2017
Renesas has started volume chip shipment for Toyota’s new 2018 Camry which is scheduled to debut late this summer in the U.S.
PC DRAM module prices up 8/8/2017
The average contract price of PC DRAM modules rose by nearly 40% sequentially in the first quarter to US$24 and then by more than 10% sequentially in the second quarter to US$27.
New Zealand leads Asian Smart City race 8/8/2017
For the second straight year, New Zealand and Singapore have received the highest tally in IDC's Smart City Asia Pacific Awards.
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