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New partnership in MRAM developement 10/18/2017
Spin Transfer Technologies (STT) and capital equipment vendor Tokyo Electron Ltd. (TEL) have entered into a collaborative engineering program to jointly develop process technologies for SRAM- and DRAM-class spin-transfer torque (ST) MRAM devices.
Market outlook for NAND remains unchanged regardless of glitch at Toshiba 10/17/2017
Toshiba will be able to deliver its NAND Flash shipments as per the dates and volumes in its fourth-quarter contracts, says DRAMeXchange.
SMIC appointed new executives 10/17/2017
Semiconductor Manufacturing International Corporation ("SMIC"; the largest and most advanced foundry in mainland China, today announced the appointment of Dr. Haijun Zhao and Dr. Liang Mong Song as SMIC Co-CEO and Executive Director.
China plans to double its 12 inch capacity in 2018 10/17/2017
Shanghai Xinsheng is scheduled to come online at the end of 2017 with monthly capacity of 150,000 12-inch wafers in the first phase, and the monthly capacity will double to 300,000 units by 2020.
Toshiba eager to close the Bain deal while WD is still fighting 10/17/2017
Channels for talks with Western Digital remain open while Toshiba hoped for cordial relations and continued cooperation with the company.
Samsung Electronics CEO resigned 10/16/2017
The surprise resignation of Samsung’s chip and display head came as he was expected to take a bigger role following Lee’s arrest in February and the departures of other key executives in the wake of the bribery scandal.
DRAM manufacturers stock rises 10/16/2017
While demand for DRAM was expected to rise 20.6% next year, chipmakers were only planning to add 19.6 percent in capacity globally, a TrendForce report said
ON Semi released new image sensors 10/16/2017
The new parts provide a complete solution with the new image sensor and processing functionality integrated within a low power system-on-chip (SoC) that simplifies and speeds adoption in applications like rear and surround view cameras.
Toshiba start to order equipment for new fab 10/16/2017
The equipment is for a fabrication facility under construction at the Mie Prefecture plant, in which Toshiba jointly invests with U.S. partner Western Digital.
Semiconductor boom mostly benetit U.S. equipment manufacturers 10/13/2017
Korea’s imports of US semiconductor manufacturing equipment, the largest one among import items from the US, ballooned a whopping 199.0% to US$ 3.558 billion from the previous year.
Irish court approved Apple to build $1 billion data center 10/13/2017
Apple in February 2015 announced plans to build the data center in a rural location in the west of Ireland to take advantage of rich green energy sources nearby.
Western Digital to tap on microwave-assisted magnetic recording 10/13/2017
Western Digital demonstrated what it called the world's first MAMR, or microwave-assisted magnetic recording, hard drives, and discussed plans for bringing those drives to market.
ADI to work with imec on IoT devices 10/13/2017
The move, building on two existing initiatives, is intended to produce devices that are not only low-power, but which also feature largely improved or completely new sensing capabilities.
Qualcomm found breach of antitrust regulations in Taiwan court 10/12/2017
Apple seen as winner as Taiwan slaps Qualcomm with $773m antitrust fine.
ST to build 2 new 300mm fabs 10/12/2017
ST has not built a 300mm fab since 2002 when it built Crolles 2 with Motorola and Philips. Motorola (later Freescale) and Philips pulled out of the collaboration in 2007.
California governor Jerry Brown to put more zero emission cars on the road 10/12/2017
The state is working toward putting 1.5 million zero-emission vehicles on the road by 2025 — an ambitious target.
Kobe Steel accused of altering inspection data 10/12/2017
Kobe Steel, Japan's third-largest steel maker, has announced that between Sept. 1, 2016 and Aug. 31 of this year it sold aluminum and copper materials using falsified data on such things as the products' strength.
Multi-layer 3D-NAND takes impractical wafer process time 10/11/2017
The limitations of 3D NAND scaling seem obvious. Then, will 3D NAND reach the end of its life span? It might not be that far off.
Iron Mountain to acquire data centers in London and Singapore 10/11/2017
This marks Iron Mountain’s first step toward international data center expansion. It expands Iron Mountain’s portfolio, which provides data center services to organizations across all industries that require highly secure, reliable, and compliant data storage and related capabilities.
Alexia application development kit now available 10/11/2017
This is the first far-field linear mic array solution available on the market, the kit has been designed for developers who are looking to integrate Alexa into smart panels, kitchen appliances, and other commercial and industrial electronics.
Intel sets up to do AI development in India 10/11/2017
Intel India has trained 9,500 developers, students and professors across 90 organisations in the past six months in the emerging field of artificial intelligence (AI).
Tech Gurus to rebuild Puerto Rico with innovative approach 10/10/2017
Google’s Loon project is to set up ballon-based communications in Puerto Rico and Tesla’s Elon Musk has discussed with the Governor the possibility of restoring power supplies by installing solar power infrastructure.
Japan to build 37 petaflops supercomputer 10/10/2017
The machine will use 1,088 servers, 2,176 Intel CPUs and 4,352 Nvidia graphics processing units.
Improving Li Battery charge time with asphalt carbon 10/10/2017
We can bring them from zero charge to full charge in five minutes, rather than the typical two hours or more needed with other batteries.
Proposed TSMC fab to cost $20 billion 10/10/2017
TSMC is now racing to meet the future demand it anticipates from computers and connected devices in the so-called Internet of Things, from cars to home appliances and voice-activated speakers.
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