|
 |
|
| DRAM manufacturers slow to migrate to EUV |
9/29/2017 |
|
The industry was previously anticipated to transition to EUV litho technology beyond 20nm, but the high cost of EUV litho tools has discouraged Samsung and other DRAM chipmakers from pursuing the technology for their 1xnm manufacturing lines.
|
|
|
| Toshiba/Bain deal signed with WD not giving in |
9/29/2017 |
|
Western Digital has repeatedly opposed the sale of the NAND flash-memory SanDisk joint venture, stressing it will continue with legal action. Toshiba reiterated in a statement that it will go ahead with the deal, despite any litigation.
|
|
|
| TrendForce predicts NAND supply to regain balance next year |
9/28/2017 |
|
During 2017, NAND Flash demand continues to expand because of the increase in average memory content of smartphones and the strong server market. At the same time, the growth in NAND Flash supply has been constrained by the pace of the major suppliers’ respective technology migrations.
|
|
|
| Micron forecast above analysts |
9/28/2017 |
|
Micron said on Tuesday that average selling prices of dynamic random access memory (DRAM) chips, used in PCs and servers, jumped 8 percent in the fourth quarter.
|
|
|
| Qualcomm extends its tender offer to buy NXP |
9/27/2017 |
|
Qualcomm extended its tender offer for all outstanding shares of NXP Semiconductors as it continues to work toward obtaining regulatory approval of the $38 billion deal.
|
|
|
| Cree has new CEO and is a familiar face |
9/27/2017 |
|
Lowe joins Cree having previously served as the CEO of Freescale Semiconductor, a company in Austin, Texas, that makes semiconductors and employs around 17,000 employees. Before that Lowe worked for nearly 30 years at Texas Instruments.
|
|
|
| MEMS sensors surge |
9/27/2017 |
|
With smartphones requiring more MEMS sensors to enable innovative features, and self-driving cars relying on MEMS sensors such as LiDAR, MEMS sensor demand for smartphones and car electronics has been growing robustly.
|
|
|
| French company Upmem wants to put processing units inside the DRAM |
9/26/2017 |
|
Upmem combines main memory with thousands of DRAM processing units, which sit directly next to data. The specialized silicon is linked to a traditional processor, which runs an operating system and offloads tasks to the battalion of DPUs. The result is 20 times better performance without using any additional power
|
|
|
| Nanya Technology cash in some Micron holdings |
9/26/2017 |
|
In a filing with the TSE on September 15, Nanya said it sold about 1.1 million shares of Micron for about US$38.15 million. Nanya expects to recognize a gain of about US$19.09 million from the sale.
|
|
|
| TSMC's Chang vowed to remain in Taiwan |
9/26/2017 |
|
Chang said that China offers a huge market and opportunity, but added that being part of China¡¯s supply chain does not mean that most of TSMC¡¯s production will move to China.
|
|
|
| China,s Canyon Bridge to bid for Immigination |
9/25/2017 |
|
The offered price of 182p per share has hardly moved the Imagination share price which was 123p before the bid and is 129p now, suggesting that the bid may fail because of regulatory issues.
|
|
|
| GlobalFoundries asked EU to investigate TSMC |
9/25/2017 |
|
GlobalFoundries has told the European Commission that TSMC is unfairly using loyalty rebates, exclusivity clauses and bundled rebates and even penalties to discourage customers from switching to rivals.
|
|
|
| Tesla is working with AMD on automotive AI chips |
9/22/2017 |
|
A more power-efficient purpose-built chip could help Tesla get closer to delivering totally autonomous driving. Tesla CEO Elon Musk promised this year that capability will be available to consumers in 2019.
|
|
|
| Rambus reported to have DDR5 driver chips |
9/22/2017 |
|
DDR5 driver chips are the next major interface for DRAM dual in-line memory modules (DIMMs). The register clock drivers and data buffers could help double the throughput of main memory in servers, probably starting in 2019
|
|
|
| Jedec's new xSPI standard allows instant on NOR applications |
9/21/2017 |
|
Developed by a task force comprised of representatives from most NOR flash device manufacturers and several PC and microcontroller companies, the xSPI standard establishes mechanical, electrical and transactional guidelines for developing high-throughput octal devices.
|
|
|
|
