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| Challenges in testing the new memories |
10/20/2017 |
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Memory test vendors are contending with next-generation devices, such as 3D NAND flash memories, HBM2 chips, low-power double-data-rate DRAMs, graphics DRAMs, phase-change memories, magnetoresistive RAMs, and resistive RAMs, some of which present new technical challenges to testing with their advanced packaging.
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| IC Insight predicts 22% semi growth |
10/20/2017 |
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For 2017, IC Insights expects a whopping 77% increase in the DRAM ASP, which is forecast to propel the DRAM market to 74% growth this year, the largest growth rate since the 78% DRAM market increase in 1994.
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| Nanya Technology rolls 20nm DRAM |
10/19/2017 |
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NANYA is scheduled to enter mass production of 20nm 8Gb DDR4 chips in the fourth quarter of 2017, according to the Taiwan-based DRAM chipmaker.
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| Shell opened first EV charging station |
10/19/2017 |
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Three charging stations are opening Wednesday at locations in London, Surrey and Derby, with seven more expected by the end of the year. It comes only days after Shell agreed to buy electric vehicle charging firm NewMotion.
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| No hope to revamp NAFTA this year |
10/19/2017 |
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A fourth round of negotiations between the U.S., Mexico and Canada ended in mutual exasperation Tuesday. Talks will continue next month in Mexico City and will spill over into next year.
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| New partnership in MRAM developement |
10/18/2017 |
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Spin Transfer Technologies (STT) and capital equipment vendor Tokyo Electron Ltd. (TEL) have entered into a collaborative engineering program to jointly develop process technologies for SRAM- and DRAM-class spin-transfer torque (ST) MRAM devices.
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| SMIC appointed new executives |
10/17/2017 |
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Semiconductor Manufacturing International Corporation ("SMIC"; the largest and most advanced foundry in mainland China, today announced the appointment of Dr. Haijun Zhao and Dr. Liang Mong Song as SMIC Co-CEO and Executive Director.
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| China plans to double its 12 inch capacity in 2018 |
10/17/2017 |
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Shanghai Xinsheng is scheduled to come online at the end of 2017 with monthly capacity of 150,000 12-inch wafers in the first phase, and the monthly capacity will double to 300,000 units by 2020.
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| Samsung Electronics CEO resigned |
10/16/2017 |
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The surprise resignation of Samsung’s chip and display head came as he was expected to take a bigger role following Lee’s arrest in February and the departures of other key executives in the wake of the bribery scandal.
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| DRAM manufacturers stock rises |
10/16/2017 |
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While demand for DRAM was expected to rise 20.6% next year, chipmakers were only planning to add 19.6 percent in capacity globally, a TrendForce report said
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| ON Semi released new image sensors |
10/16/2017 |
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The new parts provide a complete solution with the new image sensor and processing functionality integrated within a low power system-on-chip (SoC) that simplifies and speeds adoption in applications like rear and surround view cameras.
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| ADI to work with imec on IoT devices |
10/13/2017 |
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The move, building on two existing initiatives, is intended to produce devices that are not only low-power, but which also feature largely improved or completely new sensing capabilities.
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| ST to build 2 new 300mm fabs |
10/12/2017 |
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ST has not built a 300mm fab since 2002 when it built Crolles 2 with Motorola and Philips. Motorola (later Freescale) and Philips pulled out of the collaboration in 2007.
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