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| ITIF says: Trump's policy is bad for science and innovations |
5/25/2017 |
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The administration’s budget proposal would undermine America’s long-term growth prospects by slashing investments that are critical to the country’s innovative capacity and to the competitiveness of its most strategically important industries.
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| Huawei enters PC market |
5/24/2017 |
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Initially, Huawei plans to target the premium-priced consumer market, competing with Lenovo, HP and Dell [DI.UL], which together sell more than 50 percent of all PCs.
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| ARM signed JV with China |
5/24/2017 |
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China's HOPU-ARM Innovation Fund signed a memorandum of cooperation in Beijing with ARM aiming to set up a joint venture in Shenzhen and develop it into an important Chinese holding integrated circuit core intellectual property development and service platform.
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| Powertech's backend acquisitions in Japan |
5/24/2017 |
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gPowertechfs planned investment could help the Taiwanese firm expand its production base to Japan and grow its position there,h commission Executive Secretary Emile Chang (’£–Á•k) said by telephone.
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| China bets on FD-SOI process |
5/24/2017 |
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Globalfoundries and the municipality of Chengdu unveiled a plan to pump $100 million into a project to “spur innovation in China’s semiconductor industry” around FD-SOI.
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| MacBooks shipment rebounced |
5/23/2017 |
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Apple's notebook shipments totaled an estimated 3.4 million units in the first quarter of the 2017 calendar year, representing a year-on-year increase of 15.4 percent.
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| Taiwan IC quarterly production to reach $19 billon |
5/23/2017 |
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The IEK said the output growth momentum for the IC industry would likely see a substantial recovery next quarter at the earliest, with production value reaching NT$696.3 billion, up 21.3 percent quarter-on-quarter and 5.6 percent year-over-year.
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| 3DXPoint DIMM to replace DRAM and boost system memory |
5/22/2017 |
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Intel views current DRAM solutions as being too small, too expensive, and not stable enough to maintain its position as the top memory solution. That is where 3D XPoint could come into play. The promise of 3D XPoint DIMMs is that they'd offer more storage at a lower cost.
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| Chips for bike-share IoT heats up |
5/22/2017 |
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MediaTek has managed to ship its MT2503 IoT chips to the supply chain of China-based smart bike sharing firm Bluegogo, indicated the sources. The MT2503 is based around a highly integrated, ultra-small system in package (SiP) design that contains Bluetooth 3.0, multiple GNSS systems and integrated 2G modem.
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| Qualcomm tested rapid wireliess charging for electric cars |
5/22/2017 |
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The smartphone chipmaker said a so-called "dynamic charging" test took place on a test track in Versailles, France. It used two Renault Kangoo vehicles driving over embedded pads in the road that transferred a charge to the cars' batteries at up to 20 kilowatts at highway speeds.
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| Renesas seeks new market for extreme low power MCU |
5/22/2017 |
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The Japanese company is confident that it can slash power consumption in its MCUs, reducing, for example, a 20 mW Synergy microcontroller to 2 mW. The goal is a quantum leap in battery life in IoT devices that could lead to a “battery-less” product when combined with energy harvesting.
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| DRAM revenue reached a new record high |
5/19/2017 |
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Demand for sustained DRAM supply had resulted in an at least 30% increase in the average contract price of PC DRAM modules between the fourth quarter of 2016 and the first quarter of 2017.
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| Break through in Lithium battery |
5/19/2017 |
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The team says its research project has developed ‘realistic’ cells with a storage capacity of 30mAh/cm2, compared to the typical 2mAh/cm2 of conventional lithium-ion batteries.
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| Intel - the quiet NAND producer |
5/19/2017 |
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Intel is stepping up investment in 3D Xpoint, another non-volatile memory technology that promises to serve as a storage product as well as a DRAM replacement. The 3D Xpoint memory technology is said to offer vast improvements in speed and endurance.
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| Texas Instruments puts automotive radar on a chip |
5/18/2017 |
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Typically, they are boxes measuring inches across that house multiple components and require watts of power. A new range of chips from Texas Instruments, reduces that to a postage-stamp sized part
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| Samsung to spin off foundry division |
5/17/2017 |
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The separation of Samsung’s contract chipmaking from its branded semiconductor business would remove a conflict of interest with potential customers such as Nvidia and MediaTek, and create a new threat to dedicated foundries such as TSMC.
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| Gartner confirms 2.6% on IC growth in 2016 |
5/17/2017 |
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Gartner (Stamford, Conn.) concluded that global semiconductor sales reached $343.5 billion last year, an increase of 2.6 percent compared to 2015. The growth rate is higher than that estimated by other market watchers previously.
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