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| AI to deliver customer service at call centers |
5/30/2017 |
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the system can understand spoken word input from users. When faced with ambiguous questions using general terminology, the AI can seek clarification to correctly understand the intent of the user’s question, leading to optimal answers.
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| Toshiba does not want to fall into Western Digital |
5/29/2017 |
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Toshiba told them it is inclined to choose a U.S.-Japan consortium that includes state-backed turnaround fund Innovation Network Corp. of Japan and the state-owned Development Bank of Japan.
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| GlobalFoundries gets $7.5 million grant to develope 7nm |
5/29/2017 |
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Gov. Andrew Cuomo's economic development agency is giving GlobalFoundries $7.5 million. The grant is coming from a $208 million pool of money set aside in the latest state budget for various SUNY Polytechnic Institute programs across the state.
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| TSMC aims to deliver 5nm by 2019 |
5/26/2017 |
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Trial production of 5-nanometer chips are to start in the second quarter of 2019 and mass production in 2020, Wei said, in line with the companyfs aim of upgrading its node technology by one generation every two years.
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| Samsung propose NVMe for Data Centers |
5/26/2017 |
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Data centers can move and analyze data faster through the use of solid-state drives with nonvolatile memory express chips with the PCIe interface, Samsung Semiconductor said NVMe has a number of advantages over DRAM.
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| SoftBank to invest $4 billon on Nvidia |
5/25/2017 |
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SoftBank founder Masayoshi Son’s plans to become the biggest investor in technology over the next decade, with bets on emerging trends such as artificial intelligence to provide the underpinnings of machine intelligence in everything from data centers to automobiles.
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| WD bid $17.8 billion |
5/25/2017 |
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Western Digital’s plan could prolong antitrust examinations and cause an ill-timed delay for Toshiba, whose survival relies on the sale of the flash memory business.
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| SK Hynix to spin off foundry business |
5/25/2017 |
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All eyes are on the company’s next move as it can improve its status as integrated device manufacturer (IDM) by strengthening the non-memory chip business and seek various ways to reorganize the business by using its subsidiaries.
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| ITIF says: Trump's policy is bad for science and innovations |
5/25/2017 |
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The administration’s budget proposal would undermine America’s long-term growth prospects by slashing investments that are critical to the country’s innovative capacity and to the competitiveness of its most strategically important industries.
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| Huawei enters PC market |
5/24/2017 |
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Initially, Huawei plans to target the premium-priced consumer market, competing with Lenovo, HP and Dell [DI.UL], which together sell more than 50 percent of all PCs.
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| ARM signed JV with China |
5/24/2017 |
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China's HOPU-ARM Innovation Fund signed a memorandum of cooperation in Beijing with ARM aiming to set up a joint venture in Shenzhen and develop it into an important Chinese holding integrated circuit core intellectual property development and service platform.
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| Powertech's backend acquisitions in Japan |
5/24/2017 |
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gPowertechfs planned investment could help the Taiwanese firm expand its production base to Japan and grow its position there,h commission Executive Secretary Emile Chang (’£–Á•k) said by telephone.
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| China bets on FD-SOI process |
5/24/2017 |
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Globalfoundries and the municipality of Chengdu unveiled a plan to pump $100 million into a project to “spur innovation in China’s semiconductor industry” around FD-SOI.
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| MacBooks shipment rebounced |
5/23/2017 |
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Apple's notebook shipments totaled an estimated 3.4 million units in the first quarter of the 2017 calendar year, representing a year-on-year increase of 15.4 percent.
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| Taiwan IC quarterly production to reach $19 billon |
5/23/2017 |
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The IEK said the output growth momentum for the IC industry would likely see a substantial recovery next quarter at the earliest, with production value reaching NT$696.3 billion, up 21.3 percent quarter-on-quarter and 5.6 percent year-over-year.
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| 3DXPoint DIMM to replace DRAM and boost system memory |
5/22/2017 |
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Intel views current DRAM solutions as being too small, too expensive, and not stable enough to maintain its position as the top memory solution. That is where 3D XPoint could come into play. The promise of 3D XPoint DIMMs is that they'd offer more storage at a lower cost.
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| Chips for bike-share IoT heats up |
5/22/2017 |
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MediaTek has managed to ship its MT2503 IoT chips to the supply chain of China-based smart bike sharing firm Bluegogo, indicated the sources. The MT2503 is based around a highly integrated, ultra-small system in package (SiP) design that contains Bluetooth 3.0, multiple GNSS systems and integrated 2G modem.
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| Qualcomm tested rapid wireliess charging for electric cars |
5/22/2017 |
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The smartphone chipmaker said a so-called "dynamic charging" test took place on a test track in Versailles, France. It used two Renault Kangoo vehicles driving over embedded pads in the road that transferred a charge to the cars' batteries at up to 20 kilowatts at highway speeds.
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