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Intel warns of tight supply on SSD drives 3/28/2017
Intel told partners in an "Intel SSD Supply Health Messaging" memo that the SSD and NAND memory industry is experiencing record demand across all markets. As a result, SSD supply is expected to remain tight for all of 2017.
IBM/Tokyo Electron to put AI into semi manufacturing 3/27/2017
IBM and Tokyo Electron Ltd (TEL) have signed a joint development programme to add cognitive capabilities to TEL’s chip manufacturing equipment to track down anomalies so that the equipment keeps running smoothly.
Google calls for expansion in optical communications while controlling cost 3/27/2017
Urs Hölzle, vice president of technical infrastructure at Google, called for 2x cost reductions, 10x capacity gains, and more programmability on optical technologies.
Japanese government to scrutinize acquisition of Toshiba's memory chip business 3/27/2017
Japanese law requires advance notice of foreign acquisitions of Japanese companies in certain fields so the government can gauge the impact on national security. The government can recommend that a given deal be changed or scrapped if necessary.
Intel formed AI product development unit 3/27/2017
The Artificial Intelligence Products Group will focus on the development of chips and software products tied to machine learning, algorithms, and deep learning.
Thanks to DRAM prices, Micron is far ahead on quarterly revenue 3/24/2017
Global memory chip makers are on the cusp of what analysts call an ultra-super-cycle as supply bottlenecks created by efforts to make smaller yet more efficient chips weigh, while demand soars for data storage from smartphones and artificial intelligence to autonomous driving and the Internet of Things.
Samsung to work with eSilicon and Rambus to create HBM2 memory to network interface chip 3/24/2017
Samsung said I-Cube solution will be essential to network applications for high-speed signaling in networks, and will likely be adopted for other areas such as computing where high-speed processing power is required.
Japanese start-up to manufacture power diodes with gallium oxide process 3/24/2017
The firm is aiming to commercialise crystalline á-Ga2O3 (corundum/sapphire/ruby structure) in power transistors and Schottky diodes – with the intention of manufacturing 600V TO-220 diodes in 2018 to compete against silicon carbide power devices.
Flash storage is taking over 3/24/2017
‘It has reached a point in its technology development to be able to scale hugely to drive a transformational shift in computing and information processing, as it is radically faster than a traditional spinning disk, with much higher capacity,’
China/s aggressive expansion will drain tech telents globally 3/23/2017
China’s IC manufacturers are affecting the movement of industry talents worldwide as they continue to aggressively headhunt for senior managers and engineers. The competition for human resource is becoming fiercer and will reach a critical point this year
UMC to run 28nm in Xiamen 3/23/2017
UMC's transfer of 28nm process technology to subsidiary United Semiconductor (Xiamen) has been approved by the Investment Commission of Taiwan's Ministry of Economic Affairs
Most tech industry immigrants are legally in the country 3/23/2017
Just over a quarter of people employed in the computer and electronic product sector were born abroad but the industry is distinct in having the lowest quota of unauthorized immigrants, just 5 percent.
Wal-Mart launch incubator lab as its effort to embrace technology 3/23/2017
Wal-Mart focused on projects in robotics, virtual and augmented reality and artificial intelligence as it aims to compete more aggressively with Amazon.
Micron/s acquisition of Cando establishes quality center in Taiwan 3/22/2017
The new integrated center of excellence is expected to bring greater operational cost efficiency that will benefit Micron's DRAM business on a global scale.
Qualcomm introduced chip for under $50 phones 3/22/2017
The new offering -- designed for phones to be sold in markets such as India, Latin America and Southeast Asia -- allows for longer battery life and faster access to social media and other content.
Samsung factory in southern Seoul to start production early this year 3/22/2017
The new line is expected to focus on the production of 3-D Vertical NAND (V-NAND) flash memory, which will boast significantly higher data storage compared with the previous 2-D technology.
GlobalFoundries U.S. has secured foundry contract from Defense Department 3/22/2017
The company will perform contract work in Burlington, Vermont and East Fishkill, New York through March 31, 2018.
Apple to expand R&D in Shanghai 3/21/2017
Apple will launch new research and development centers in Shanghai and Suzhou. According to a report published by Apple, the company has promised to invest over CNY3.5 billion into R&D centers in China.
TSMC talks about building 3nm fabs on U.S. soil 3/21/2017
“We have not ruled out going to the U.S., but the formal decision will not be made until early next year so there’s still quite a few months to go,”
AMD's 16 core CPU promise to outperform Intel i7 3/21/2017
AMD Ryzen is a great multi-threaded performer and easily beats Intel's more expensive CPUs in rendering and content creation workloads that use plenty of threads.
ITC launched investigation on MediaTek 3/21/2017
The commission said that the probe has been instituted following a request by California-headquartered Advanced Micro Device Inc. (AMD), which has accused the company of infringing upon three of its patents on graphics chips.
Amazon to expand data center in Oregon 3/20/2017
The Seattle-based e-commerce giant recently bought 120 acres of land next to the Hermiston Generating Plant. It already operates two server farms in eastern Oregon.
IBM partners with Chinese Wanda on cloud business 3/20/2017
The venture between IBM and Wanda Internet Technology Group will be "responsible for distributing, building and operating the IBM cloud platform in China".
TSMC say it will use EUV for 7nm process 3/20/2017
TSMC noted 76 percent yields on the 256Mbit SRAM made in its first-generation 7nm node, which will be in volume production next year. It also reported that an ARM Cortex-A72 processor in the node exceeded 4GHz using a new design flow.
Bidders for Toshiba are plenty 3/20/2017
The number of interested parties, which already include semiconductor makers and investments funds, may increase beyond the current 10 and the company expects final bids by March 29, the executive said. Western Digital Corp., SK Hynix Inc., Foxconn Technology Group, Micron Technology Inc. and Kingston Technology Co. are among those interested.
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