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Samsung takes very different approach from TSMC on 7nm process 2/10/2017
TSMC’s paper described a test chip that could pass for a commercial part and said it had “healthy” yields. Samsung described its use of extreme ultraviolet (EUV) lithography to repair what was clearly a research device, suggesting what it will call 7nm could still be years away.
Toshiba chip unit bid prices rise 2/10/2017
Toshiba Corp has received bids ranging from 200 billion yen to as much as 400 billion yen ($1.8-3.6 billion) for a 19.9 percent stake in its flash memory business.
U.S. move to block Infineon/Cree merger 2/10/2017
Wolfspeed, a division of Cree, makes devices using gallium nitride, a sensitive powdery compound that can have military applications and has been responsible for the U.S. blocking acquisitions in the past.
Intel use multi-die packaging to enhance FPGA I/O performance 2/9/2017
EMIB uses a combination of 55 micron micro-bumps and 100+ micron flip-chip bumps to support up to 24 transceiver channels with 96 I/Os each. They deliver 2 Gbits/second/pin at 1.2 pJ/bit/die using a proprietary protocol.
Flaw found in Intel Atom microserver chip 2/9/2017
In January, Intel added an erratum to the Atom C2000 documentation, stating systems with the chip "may experience [an] inability to boot or may cease operation."
EV car battery prices dropped 2/9/2017
average price of battery packs for cars has dropped from $1,000 per kWh in 2010 to around $230 per kWh in the past year. How much of a difference does that make to the price of a car, you ask? A big one.
SonicWall reports 2016 cybra security statistics 2/9/2017
Total malware attack attempts dropped for the first time in years to 7.87 billion from 8.19 billion in 2015. However, cyber criminals garnered quick payoffs from ransomware.
Sefar fabric-based electrodes simplify large-area OLED production 2/7/2017
CSEM and Sefar have developed low-cost, flexible, transparent, highly conductive electrodes made of fabric substrates comprising of flexible metallic wires and polymeric fibres woven together in a highly transparent and flexible polymer.
TDK/Qualcomm JV to develope RF front-end in singapore 2/7/2017
The venture aims to enable Qualcomm’s RF front-end (RFFE) business unit to deliver RFFE modules and RF filters into fully integrated systems for mobile devices, internet of things (IoT), automotive apps.
Intel and Micron race to ship 3DXpoint storage 2/7/2017
While Intel ships its first low-capacity Optanes for PCs, Micron is already researching the second- and third-generations of 3D Xpoint technology. Micron's 3D Xpoint products are called QuantX.
China tightens anti-trust policy 2/7/2017
Chinese government has recently set up its new detailed regulations or amend old regulations on the anti-monopoly law, and will reveal and implement the 6th anti-monopoly guidelines, which guide the procedure of anti-monopoly investigations, soon.
China set new rules for offshore investment 2/6/2017
China officials announced offshore M&A transactions are subject to additional governmental scrutiny. They include outbound investment by limited partnerships that are popular with private equity and VC finds in China as well as investments by newly set-up companies.
STMicro joins Charging Interface Initiative e. V 2/6/2017
Charging Interface Initiative e. V, an open association founded to develop and establish the Combined Charging System (CCS) as the standard for charging all kinds of battery-powered electric vehicles.
Fujisu offers FRAM memory for automotive systems 2/6/2017
FRAM reduces system complexity and increases data integrity by allowing instant and continuous data storage in applications such as air bag data storage, event data recorders (EDR), battery management systems (BMS), automatic driving assistance systems (ADAS) or navigation and infotainment systems.
NXT sales jumped 56% in 2016 2/6/2017
Qualcomm has played a critical role in driving the evolution of the mobile industry. The NXP acquisition accelerates our strategy to extend our leading mobile technology into robust new opportunities.
Micron Board forms CEO search committee 2/3/2017
“Mark Durcan recently discussed with the Board his desire to retire from Micron when the time and conditions were right for the company,” says Micron Chairman Robert E. Switz.
Apple to load new Macs with ARM based processor 2/3/2017
Internally codenamed T310, would handle some of the computer’s low-power mode functionality, they said. It’s built using ARM Holdings Plc. technology and will work alongside an Intel processor.
GM joint with Honda to make fuel cell car in Detroit 2/3/2017
The initiative is funded with $85 million in investment, split evenly between the two automakers, and is expected to create about 100 jobs.
Confidence Index slipped 2/3/2017
Consumer confidence index slipped to 111.8 in January from a December reading of 113.3, which had been the highest since August 2001. Americans overall have been in a sunny mood since the Nov. 8 election of Donald Trump.
Panasonic partners with UMC on ReRAM development 2/2/2017
The design of the ReRAM will be Panasonic's job. The two companies will work together to develop the microfabrication technologies, and UMC will then handle production.
Jury found Toshiba not guilty on NAND infringement 2/2/2017
After an eight-day trial that concluded Monday, the jury found that U.S. Patent No. 5,701,270 was invalid because prior art anticipated its content, according to the verdict form. And Intellectual Ventures hadn’t proven that Toshiba’s work infringes its U.S. Patents Nos. 5,568,431 and 5,500,819, according to the form.
Samsung be the first to incorporate MEMS tuning array antenna 2/2/2017
Samsung Electronics Co. Ltd. has beaten rival Apple Inc. to the punch in offering microelectromechanical systems (MEMS) antenna tuning array that promises to instantaneously insert/remove antenna compensation capacitance to prevent dropped calls.
AMD financial performance improved 2/2/2017
"We met our strategic objectives in 2016, successfully executing our product roadmaps, regaining share in key markets, strengthening our financial foundation, and delivering annual revenue growth,"
Intersil chip reduces eCall battery leakage to 3uA 2/1/2017
The ISL78693's battery temperature monitoring and 3.6V output voltage helps safeguard and extend the life of popular LiFePO4 batteries.
Artificial intelligence chip with 256 cores predicted 2/1/2017
Korean-made AI chips are expected to bring a big change to the semiconductor industry in the era of the fourth industrial revolution as they can make personal small information and communication devices such as smartphones and internet of things (IoT) devices as powerful as supercomputers.
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