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| Qualcomm announced VR development kit |
2/27/2017 |
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The VRDK is expected to be available in the second quarter of 2017. It is engineered to help developers attain improved VR performance and power efficiency for upcoming VR OEM devices built with the Snapdragon 835.
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| Exynos 9 is 10 core with 10nm FinFET processs |
2/24/2017 |
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Samsung said it plans to apply the new FinFET technology to Exynos 9 which is widely predicted by analysts to be installed in the tech company's next flagship smartphone, the Galaxy S8, scheduled to be released as early as next month.
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| Over 100 million GPU's shipped in Q4 |
2/24/2017 |
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Among the big three suppliers, AMD and Nvidia both increased shipments by 10% in the fourth quarter (sequentially), while Intel shipments were down 4%. Discrete GPUs gained market over integrated units.
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| SK Hynix to bid on Toshiba Semiconductors |
2/24/2017 |
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SK Hynix said earlier that it had submitted a non-binding bid for a stake in the business on Feb. 3, without specifying the size of the stake. It will consider a fresh bid should Toshiba make another offer.
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| Tsinghua Unigroup plans IPO |
2/23/2017 |
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Unigroup Spreadtrum RDA, China's top mobile chipmaker which supplies to Samsung Electronics, has been spearheading Beijing's ferocious efforts to cultivate its domestic semiconductor industry to reduce dependence on foreign imports due to economic and security concerns.
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| Micron to complete R & D facility in Boise |
2/22/2017 |
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Micron needs space because of a wider product base the company supports globally, including products from former Japanese chip maker Elpida Memory Inc., which Micron bought in 2013.
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| Server memory demand drive memory module prices up |
2/21/2017 |
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Contract prices of server DRAM modules will increase by almost 40% sequentially on average this first quarter. The contract market for server DRAM modules is expected to see another sequential price hike of 10% in the second quarter.
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| Xiaomi to announce its own "Pinecone" AP chip |
2/21/2017 |
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Rather than fully relying on the likes of Qualcomm and MediaTek, Xiaomi can take advantage of Leadcore's cellular radio technology for its own chipsets, thus keeping costs down in the long term.
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| 2016 R & D spending ranked |
2/21/2017 |
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Intel Corp. came first with R&D expenditures of $12.7 billion, followed by Qualcomm Inc. with $5.1 billion and Broadcom Ltd. with $3.1 billion.
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| Cypress provides chip for both USB-C video and HDMI operations |
2/20/2017 |
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All HD and 4K televisions include HDMI connections, but previously connecting USB-C enabled source devices required adapters or converters that do not enable all native HDMI features. Cypress' EZ-PD CCG3 silicon is doing the conversion and management work.
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| Korean memory manufacturers to up their Capex |
2/20/2017 |
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South Korean semiconductor businesses are increasing investment in facilities this year by approximately 30 percent compared. This is to secure technological advantage over other competitors with large preemptive investments.
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| Bad news hit Toshiba |
2/17/2017 |
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In one day, the company lost its chairman, said it will stop building nuclear power plants, wrote off about US$6.2 billion relating to that business, and postponed its fourth-quarter earnings report for a month.
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| Mobile DRAM continue to grow |
2/17/2017 |
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DRAMeXchange, a division of TrendForce, finds that the global mobile DRAM revenue for the fourth quarter increased by about 20% sequentially to reach around US$5.51 billion.
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| ADI quarterly result beat estimate |
2/17/2017 |
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Company expects revenue to grow 17% over the prior year, which would represent the 4th consecutive quarter of year-over-year revenue growth for ADI.
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| Panasonic/UMC partners in ReRAM memory |
2/17/2017 |
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The partners plan to use a 40-nanometer fabrication process to make ReRAM chips that can run on as little as one-seventh the power of today's NAND flash memory.
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