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Infineon business grew on automotive and industrial sector 11/29/2016
The success was widely driven by Infineon’s focus on applications that help customers to improve their energetic sustainability, be it in the area of electromobility or energy efficiency in industrial environments
China consumes 11.6% more on Mobile Application Processor 11/29/2016
Shipments of mobile application processors for smartphones and tablets in China are expected to grow 11.6% sequentially in the fourth quarter of 2016, thanks mainly to seasonal factors and inventory build-ups for the first quarter of 2017.
MediaTek to invest in EV company 11/29/2016
MediaTek said the company continues efforts to explore business opportunities in the in-vehicle networking and car electronics markets.
Samsung champion 64.5% of the DRAM market 11/29/2016
The mobile DRAM market share claimed by Samsung has increased to 64.5 percent in the third quarter from 6.5 percent in the second.
U.S. hedge fund calls for Samsung to split 11/28/2016
The U.S. activist hedge fund, which owns 0.6 percent of Samsung, called on the South Korean tech giant in October to divide itself into a holding vehicle for ownership purposes and an operating company, as well as pay out 30 trillion won ($26 billion) in a special dividend.
Renesas teams with German company on automotive Cybra security platform 11/28/2016
The planned platform comprises Renesas' RH850/P1x-C Series of automotive safety microcontrollers with Escrypt’s CycurHSM, a security software stack, to realise highly complex automotive security solutions.
New deposition process improves large display production 11/28/2016
Recently, researchers at Holst Centre have shown that sALD can deliver semiconductor layers with better performance than physical vapour deposition (PVD) at the same—and potentially even higher—throughputs.
Significant process to convert auto part from metal to moulded plastic 11/28/2016
The principal advantage for designers is that metal-to-plastic conversions not only eliminate 35% of housing weight in comparison with conventional aluminium, but also provide cost reductions of up to 65% through the elimination of secondary operations.
Samsung wants to sell its PC business to Lenovo 11/25/2016
Back in 2014, Samsung had decided to pull a plug on its PC and ChromeBook business. Soon after, it made a re-entry into the market with the launch of the Notebook 9 Series of ultrabooks earlier this year. The premium ultrabook from the Korean firm, despite packing excellent hardware, seems to have failed to sell in large numbers,
Apple to offer 3D photography on 2017 iPhones 11/25/2016
"Apple is now studying how to apply its 3D camera technology into LG Innotek's smartphone camera. Since LG Innotek also has its own 3D camera and related technologies, such joint efforts will likely to bear fruit sometime within next year."
Microsoft partners with Nvidia on AI 11/25/2016
It's no secret that Microsoft is banking on artificial intelligence (AI) to deliver next-generation IT services to its corporate customers as they embark on their digital transformation journey.
Durable good orders up 11/25/2016
Orders for durable goods rose 4.8 percent in October, the Commerce Department reported Wednesday. That is the best showing since a similar advance in October 2015.
Samsung might seperate fab from system design 11/23/2016
Insiders of the company are suggesting to reorganize the System LSI division in order to systematically grow the system semiconductor business. They are planning to separate the design and manufacturing sectors in the division and separate or spin off to fabless and foundry business divisions.
PC DRAM prices up 15% 11/23/2016
global DRAM market in the first quarter of 2017 will benefit from the stock-up activities ahead of the Chinese New Year holidays and the widespread expectations of tight supply. The average contract price of PC DRAM 4GB modules is estimated to rise by around 15% sequentially in next year’s first quarter.
Assume 10nm mobile SOIC to take hold next year 11/23/2016
Major smartphone companies are gearing up to roll out their 10nm mobile chips which will be shipped in during 2017.
Macom to acquire Applied Micro for ARM server chips 11/23/2016
Assuming the technology works as advertised and delivers on the lower costs it promises, it has the potential to significantly boost data center performance at a price that many data centers are likely to find quite agreeable.
HTC might have reasons to leave the smartphone market 11/22/2016
Due to struggles, there is a new rumor swirling that the company is considering the sale of its mobile division.
Fujitsu Semiconductor and Panasonic have developed the densest ReRAM. 11/22/2016
It is targeted at battery-operated wearables and medical devices such as hearing aids, which require high density, low power consumption electronic components.
Chinese to appeal directly to Obama on purchase of Aixtron 11/22/2016
An American security panel that advises the White House on foreign deals had recommended the two sides drop their plan, citing unspecified national security concerns. Aixtron said it and its Chinese suitor would do something unusual: They would appeal to President Barack Obama directly to approve the deal.
Snapdragon 835 goes beyond mobile 11/22/2016
AR, VR and AI will affect mobile shipments. On spec, the Snapdragon 835 SoC will enable richer apps to be built, advancing the platform shift.
China Changjiang Storage to negotiate memory license from Micron 11/18/2016
"We are in talks with Micron for possible licensing for its NAND flash as well as DRAM technology, but have yet to reach a conclusion,"
Component cost up as PC production volume goes down 11/18/2016
¡°The market demand for notebooks is flat. The strong orders for components from PC vendors last quarter and this quarter could lead to inventory correction at the beginning of next year,¡±
China made "huge progress" in High Performance Computer 11/18/2016
According to the latest rankings released this week at Salt Lake City, China's Sunway TaihuLight has once again been named the world's fastest supercomputer, the eighth time in a row that a Chinese-made machine has taken the semiannual TOP500 crown.
UMC opens 12" China fab 11/18/2016
Fab 12X is part of a 3-way joint venture foundry company between UMC, Xiamen Municipal Government and Fujian Electronics and Information Group. The JV foundry, named United Semi, will initially offer 55nm and 40nm process.
Macronix to jump onto 3D NAND bandwagon 11/17/2016
"Our 3D-NAND is based on charge-trap flash, something we have been working on since 1998. We have long experience."
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