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TSMC and Samsung are racing to provide embedded MRAM/RRAM foundry process 6/7/2017
TSMC will be offering embedded MRAM in 2018 and embedded RRAM in 2019.
Demand for automotive storage system to increase 6/7/2017
As the advancement of these systems continue, it raises the question of what will happen to local storage requirements as these systems connect to smartphones and the cloud.
Nvidia positions itsellf in the AI market with HGX 6/7/2017
"With Google, AWS (Amazon Web Service), Microsoft, Baidu and the lot throwing new deep learning model frameworks over the wall at a quarterly cadence, Nvidia's job is to provide non-denominational developer tools that support all of the frameworks,”
IBM's 5nm architecture to extend Moore's Law 6/6/2017
New 5nm breakthrough to more performance will boost its cognitive computing efforts as well as everybody's efforts toward higher-throughput cloud computing and deep learning, along with lower power and longer battery life for all mobile Internet-of-Things (IoT) devices.
Western Digital to settle with 19.9% ownership on Toshiba Memoryr 6/6/2017
Under the new proposal, the U.S. firm — Toshiba’s joint production partner at a chip plant in Mie Prefecture — is aiming to buy Toshiba Memory Corp. in a joint bid with the government-backed Innovation Network Corp. of Japan turnaround fund and the government-owned Development Bank of Japan.
Qualcomm gets into Intel territory with Snapdragon 835 PC 6/6/2017
“On paper, it's quite promising if it can really achieve such long battery life and always-on connectivity that x86-based systems might struggle with,”
EU gets tough on Qalcomm/NXP merger review 6/6/2017
The EU competition authority's preliminary review of the deal ends on June 9. It can either clear the deal unconditionally or open an investigation lasting up to four months.
Apple and Amazon are behind Foxconn's bid for Toshiba 6/5/2017
On Saturday night, Gou told the Nikkei Asian Review in a separate interview that he has secured support from Apple and Amazon on the Toshiba deal.
NAND prices up 6/5/2017
The NAND contract price went up 20-25% in Q1, reports DRAMeXchange.
Rumor WD to build flash memory plant in Japan 6/5/2017
WD is embroiled in a dispute with business partner Toshiba Corp over plans to sell the Japanese firm's prized semiconductor unit and is arguing that it should be given exclusive negotiating rights.
Attention goes to Artificial Intelligence at Computex 6/5/2017
"Computex seems to have shied away from mobility in favour of 'internet of things', which incorporates aspects of both cloud computing and artificial intelligence,"
New magnetoelectric memory can lead to low energy storage 6/2/2017
According to the team, the research could aid production of devices such as instant-on laptops, close-to-zero-consumption flash drives, and data storage centres that require much less air conditioning.
Phison Electronics seeks investment in China 6/2/2017
Phison is mulling whether to seek an injection of Chinese capital to a Chinese subsidiary in a bid to pursue new business opportunities
Google: Current leader in AI 6/2/2017
Google has been slowly injecting AI into many of its products and services and the company’s CEO Sundar Pichai has sounded very bullish on the prospects of artificial intelligence in recent public appearances. 
Mexico preparing for renegotiation of NAFTA 6/2/2017
The rules dictate how much U.S. content a product assembled in Mexico must have in order to escape tariffs when being imported into the United States. Currently set at 62.5 percent for the auto industry, that number could increase.
Uber fired Levandowski, self-driving car chief 6/1/2017
Levandowski is accused of downloading 14,000 documents from his Google computers onto a hard drive and then uploading them into his personal computer and bring them to Uber.
Micron to invest $2 billion on upgrading Hiroshima DRAM plant 6/1/2017
Hiroshima plant gears up for research and development on 13-nanometer process technology. It has purchased several pieces of cutting-edge chipmaking equipment at billions of yen each for R&D and is expected to buy many more when starting mass production of the dynamic random-access memory chips.
Western Digital may jally with the KKR group on Tohiba bid 6/1/2017
Western Digital Corp (WDC.O) may join a consortium of Japanese government money and KKR & Co LP (KKR.N) to bid for Toshiba Corp's (6502.T) chip unit, backing away from an earlier demand for an immediate majority stake.
Samsung to invest $9 billion to expand 3D NAND productions 6/1/2017
Samsung said it is considering various options on the NAND flash business, including making an investment in China, but made clear nothing has been fixed at present.
Intel announce Core i9 following AMD's 16-core 32-thread 5/30/2017
Intel X299 motherboards and X-series processors should hit the market "in coming weeks."
iPhone 8 will not be the same shape as any previous iPhone 5/30/2017
iPhone chipset maker TSMC have revealed the iPhone 8 display will transition to an elongated 18.5:9 aspect ratio just like Samsung’s Galaxy S8 and LG’s G6.
AI to deliver customer service at call centers 5/30/2017
the system can understand spoken word input from users. When faced with ambiguous questions using general terminology, the AI can seek clarification to correctly understand the intent of the user’s question, leading to optimal answers.
ST planing $1.1 billion capex for fab expansion 5/30/2017
Carlo Bozotti, CEO of ST, told the analysts that upgrading ST's 200mm wafer fab at Crolles to 300mm wafer processing is a possibility.
Fujitsu's high temperature FRAM targets automotive and industrial applications 5/29/2017
MB85RS128TY incorporates 128kbit FRAM memory density, SPI serial interface with a maximum operating frequency of 33MHz.
Toshiba does not want to fall into Western Digital 5/29/2017
Toshiba told them it is inclined to choose a U.S.-Japan consortium that includes state-backed turnaround fund Innovation Network Corp. of Japan and the state-owned Development Bank of Japan.
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