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China memory fab. breaks ground 1/4/2017 Yangtze River Storage Technology recently broke ground on a new memory semiconductor fabrication plant located in the Donghu New Technology Development Zone, Wuhan (Hebei province, China). Total investment in the plant is estimated at US$24 billion. Chinese smartphone vendor Meizu reached license agreement with Qualcommm 1/4/2017 Qualcomm and Chinese smartphone maker Meizu have reached a patent-licensing agreement. Qualcomm had sued Meizu in several countries this year to force the smartphone vendor to license its patents. The new agreement settled all disputes between the two companies. Apple to cut iPhone production by 10% 1/4/2017 iphones have sold more sluggishly than expected. Information on production of the latest models and global sales suggests cuts in both the 7 and 7 Plus lines in the coming quarter. Samsung Galaxy 8 to break down wall between phone and PC 1/4/2017 The Samsung Galaxy S8 could offer a PC-like, extended desktop experience. This would be similar to the Continuum feature in Windows phones. Consumer robots to roam CES Show 1/2/2017 Seriously, robots are cool. They are fun. And thanks to the newly released "Rogue One: A Star Wars Story," public sentiment toward droids is off the charts. LG to abandon the modular cellphone design concept 1/2/2017 LG, the first major phone maker to launch a modular phone, might scrap the G5's swappable design in favor of a more traditional metal-and-glass design if a a new leak is to be believed. SPIL to spend $37 millions on backend test equipment 1/2/2017 Market watchers believe that SPIL's revision in 2016 capex is to satisfy customer demand for fan-out wafer-level packaging and other high-end packaging technologies. Intel is changing focus from PC to self-driving cars 1/2/2017 Intel is on its way to become a dominant force in the software-defined automotive world. Rumor Samsung to un-wire ear-plugs on Galaxy S8 12/30/2016 The Korean company will once again emulate Apple and ditch the analog connector, and today a new report might have confirmed that. Heat goes up for Apple to set manufacturing in India 12/30/2016 In a communication to the government, the Cupertino-based technology major has asked for several tax and other incentives to enter India in the manufacturing sector. Intel to ditch Core architecture and streamline x86 12/30/2016 This could be the biggest change we've seen to its CPUs since the introduction of multiple-core CPUs over a decade ago. Lite-On glass passivated diodes are finding path to smartphones 12/30/2016 The company's GPP diodes have found their way into the smartphone supply chains of Oppo and Vivo, and Lite-On Seimi is expected to add another China-based vendor into its client list in 2017. Data Centers will need faster storage system beyond NAND 12/29/2016 Meanwhile, most of the companies that build flash memory -- including some of those pursuing alternatives to straight-up flash -- are looking to improve their flash products. NAND prices can rise 10% in 2017 12/29/2016 Market researcher DRAMeXchange predicted that spot prices of NAND flash memory chips could rise by about 10 percent next year. Qualcomm fined $853 million for antitrust in Korea 12/29/2016 The agency said Qualcomm coerced its customers into signing patent license contracts when selling its chips used in mobile phones in the country, and it didn’t fairly pay for the use of patents held by other phone makers. China to soft land a probe on the moon as soon as 2018 12/29/2016 Achieving mankind's first soft landing on the far side of the moon is a newly stated goal. It indicates that China has mastered the underlying technology needed to land on a specific area of the lunar surface. Tesla to roll out Enhanced Autopilot software 12/28/2016 Tesla announced that all of its new vehicles would include the hardware for full autonomy, which sets the stage for such a service to be rolled out later in 2017 or in 2018. Nokia midrange Android phone to hit market 2017 12/28/2016 Nokia E1 handset is expected to come with Android 7.0 Nougat out-of-the-box. It will be reportedly powered by a 4GB RAM and a Snapdragon 600 chipset. It may also have 64GB internal storage. SnapDragon 835 details to be disclosed at CES 12/28/2016 Qualcomm states, “Our Snapdragon 835 processor will come into focus at CES 2017.” Samsung to register $7.5 billion profit for Q4 12/28/2016 Half of the $7.5 Billion profit comes from the semiconductor sector boosted by strong memory chip prices. Amazon said it sold "millions" of Alexa-enabled devices 12/27/2016 Echo and Echo Dot were the best-selling products across Amazon this year, and we’re thrilled that millions of new customers will be introduced to Alexa as a result. Samsung to cut 2/3 nomal bonus at Mobile Division 12/27/2016 Samsung is preparing to reduce the division’s employee bonuses. These bonuses are highly related to a division’s revenue and profit. Because Galaxy Note 7’s aftermath cost Samsung billions of US dollars, this division must pay the price by lowering employees’ bonuses. TSMC rebutted report on 10nm trouble 12/27/2016 Calming fears of a possible iPad shortage, TSMC said its 10nm production had been proceeding as planned, adding that the chip had now entered volume production and was set to bring in profits in the first quarter next year. Surface Pro 5 may be packed with Qualcomm ARM processor 12/27/2016 There is a high possibility that the Microsoft Surface Pro 5 will pack a quality Snapdragon chipset and not an Intel processor. SK Hynix to advance to 72 layear 3D NAND 12/26/2016 The company announced on Thursday that it expects to complete designs for 72-layer 3-D NAND in the first half of 2017. It aims to begin production at its plant in Icheon in the second half of the year.  310  |  311  |  312  |  313  |  314  |  315  |  316  |  317  |  318  |  319

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