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Retrofit box provides machine IoT connections 3/6/2017
The cube, which houses a standard industrial PC with Windows as the operating system, allows machines to communicate with other systems.
Competitions on features will drive Smart phone prices high 3/3/2017
Prices of mobile DRAM, mobile NAND Flash products and AMOLED panels will continue to climb through 2017. As smartphone brands will be raising hardware specifications of their products.
Micron to make salary adjustments for Inotera employees 3/3/2017
Micron completed its acquisition of Inotera last December ¡ª valued at more than NT$130 billion (US$4 billion) ¡ª and is scheduled to officially take over Inotera's operations this Friday.
ARM will have more sales in China than into the U.S. 3/3/2017
China as "massively" important to ARM's growth and believes the country will become its biggest market in a few years, a senior executive said Wednesday. ARM's microprocessor architecture powers more than 95% of the world's smartphones.
Surprise : Foxconn to bid on Toshiba Chip Unit 3/3/2017
"I cannot say we are for sure getting it, but we are very confident. We are also very sincere," Gou said. He later told Reuters that Foxconn was "definitely bidding" for Toshiba.
Panasonic to expand factory in Vietnam 3/2/2017
Panasonic will expand the wiring devices and circuit breakers factory of Panasonic Eco Solutions Vietnam, located in Binh Duong province.
Seagate see SSDs and HDDs to co-exist 3/2/2017
The company will continue to put resources into HDD R&D, as the larger storage capacity of HDDs will still allow the product line to enjoy market demand in a number of areas. Seagate will continue to see demand for HDDs in areas such as surveillance, gaming, consumer electronics and datacenter markets.
Amazon Cloud outage on Tuesday 3/2/2017
Amazon Web Services suffered an unspecified breakdown in its eastern U.S. region starting about midday Tuesday. The result: unprecedented and widespread performance problems for thousands of websites and apps.
Manufacturing sector expanded 3/2/2017
Manufacturing expanded in February as the PMI registered 57.7 percent, an increase of 1.7 percentage points from the January reading of 56 percent, indicating growth in manufacturing for the sixth consecutive month, and is the highest reading since August 2014.
Lattice shareholders approved $1.3 billion take over 3/1/2017
The jury is still out on how U.S. President Donald Trump will react to China’s increasing attempts to acquire U.S. semiconductor firms. During his campaign, Trump signaled that he would take a hard line on trade with China.
Multilayer graphene nanoribbons may be useful alternative to copper interconnections 3/1/2017
A team of researchers at the University of California at Santa Barbara has now shown that intercalation-doped multilayer graphene nanoribbons (ML-GNRs) could make good alternatives to copper in this context because they are better in terms of performance, reliability and energy efficiency down to 20 nm width.
Renesas completed acquisition of Intersil 3/1/2017
With the close of this acquisition, Renesas has transformed into an industry powerhouse with one of the most comprehensive set of advanced embedded solutions.
Softbank set goal for ARM to be in 1 trillion IoT devices 3/1/2017
Softbank's (9984.T) semiconductor subsidiary ARM will deliver about a trillion chips designed for the so-called internet of things (IoT) over the next 20 years, the chairman and CEO of the Japanese company said on Monday.
China to become the largest fab equipment market 2/28/2017
China is expected to be the top spending region for fab equipment spending in 2019 and 2020, overtaking South Korea and Taiwan.
Mobile network needs to deal with defined and un-defined users 2/28/2017
Customers are no longer just people. They need to deal with defined and non-defined uses of their network–by machines, vehicles, sensors, hot spots, ‘things’–in an orchestrated ecosystem. Connectivity will be a core component, delivered across multiple vertical industries and devices.
Silicon labs supplies chip for wireless LED lighting 2/28/2017
The bulbs provide energy savings from the very nature of LED lighting as well as multiple functions to support the smart home.
UMC: 14nm is now in volume production 2/28/2017
UMC (Hsinchu, Taiwan) said it is shipping 14nm wafers to lead customers and has achieved “industry-competitive yields” using the process.
Toshiba to sample a 1Tbyte NAND memory component in April 2017 2/27/2017
The component will be based on 16 die in a single package with each die being a 512Gbit 64-layer 3D-NAND device with 3-bit-per-cell triple-level cell (TLC).
SoftBank and Foxconn joint venture to invest in the U.S. 2/27/2017
The move will give Foxconn, formally known as Hon Hai Precision Industry Co, a 54.5% stake in one of SoftBank's existing subsidiaries for $600 million and comes as both groups step up investments in the technology sector and consider expansion in the United States.
Nothing is secure in CyberSpace 2/27/2017
Researchers at the Dutch research institute CWI and Google have broken the SHA-1 internet security standard, which is widely used for digital signatures and file integrity verification, including secure credit card transactions.
Qualcomm announced VR development kit 2/27/2017
The VRDK is expected to be available in the second quarter of 2017. It is engineered to help developers attain improved VR performance and power efficiency for upcoming VR OEM devices built with the Snapdragon 835.
Toshiba samples 512Gbit 3D NAND with 64 layers 2/24/2017
Toshiba is sampling 64-layer 3-bit-per cell 512Gbit 3D NAND.
Exynos 9 is 10 core with 10nm FinFET processs 2/24/2017
Samsung said it plans to apply the new FinFET technology to Exynos 9 which is widely predicted by analysts to be installed in the tech company's next flagship smartphone, the Galaxy S8, scheduled to be released as early as next month.
Over 100 million GPU's shipped in Q4 2/24/2017
Among the big three suppliers, AMD and Nvidia both increased shipments by 10% in the fourth quarter (sequentially), while Intel shipments were down 4%. Discrete GPUs gained market over integrated units.
SK Hynix to bid on Toshiba Semiconductors 2/24/2017
SK Hynix said earlier that it had submitted a non-binding bid for a stake in the business on Feb. 3, without specifying the size of the stake. It will consider a fresh bid should Toshiba make another offer.
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