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| Softbank set goal for ARM to be in 1 trillion IoT devices |
3/1/2017 |
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Softbank's (9984.T) semiconductor subsidiary ARM will deliver about a trillion chips designed for the so-called internet of things (IoT) over the next 20 years, the chairman and CEO of the Japanese company said on Monday.
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| Mobile network needs to deal with defined and un-defined users |
2/28/2017 |
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Customers are no longer just people. They need to deal with defined and non-defined uses of their network–by machines, vehicles, sensors, hot spots, ‘things’–in an orchestrated ecosystem. Connectivity will be a core component, delivered across multiple vertical industries and devices.
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| UMC: 14nm is now in volume production |
2/28/2017 |
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UMC (Hsinchu, Taiwan) said it is shipping 14nm wafers to lead customers and has achieved “industry-competitive yields” using the process.
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| SoftBank and Foxconn joint venture to invest in the U.S. |
2/27/2017 |
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The move will give Foxconn, formally known as Hon Hai Precision Industry Co, a 54.5% stake in one of SoftBank's existing subsidiaries for $600 million and comes as both groups step up investments in the technology sector and consider expansion in the United States.
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| Nothing is secure in CyberSpace |
2/27/2017 |
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Researchers at the Dutch research institute CWI and Google have broken the SHA-1 internet security standard, which is widely used for digital signatures and file integrity verification, including secure credit card transactions.
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| Qualcomm announced VR development kit |
2/27/2017 |
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The VRDK is expected to be available in the second quarter of 2017. It is engineered to help developers attain improved VR performance and power efficiency for upcoming VR OEM devices built with the Snapdragon 835.
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| Exynos 9 is 10 core with 10nm FinFET processs |
2/24/2017 |
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Samsung said it plans to apply the new FinFET technology to Exynos 9 which is widely predicted by analysts to be installed in the tech company's next flagship smartphone, the Galaxy S8, scheduled to be released as early as next month.
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| Over 100 million GPU's shipped in Q4 |
2/24/2017 |
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Among the big three suppliers, AMD and Nvidia both increased shipments by 10% in the fourth quarter (sequentially), while Intel shipments were down 4%. Discrete GPUs gained market over integrated units.
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| SK Hynix to bid on Toshiba Semiconductors |
2/24/2017 |
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SK Hynix said earlier that it had submitted a non-binding bid for a stake in the business on Feb. 3, without specifying the size of the stake. It will consider a fresh bid should Toshiba make another offer.
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| Tsinghua Unigroup plans IPO |
2/23/2017 |
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Unigroup Spreadtrum RDA, China's top mobile chipmaker which supplies to Samsung Electronics, has been spearheading Beijing's ferocious efforts to cultivate its domestic semiconductor industry to reduce dependence on foreign imports due to economic and security concerns.
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| Micron to complete R & D facility in Boise |
2/22/2017 |
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Micron needs space because of a wider product base the company supports globally, including products from former Japanese chip maker Elpida Memory Inc., which Micron bought in 2013.
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| Server memory demand drive memory module prices up |
2/21/2017 |
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Contract prices of server DRAM modules will increase by almost 40% sequentially on average this first quarter. The contract market for server DRAM modules is expected to see another sequential price hike of 10% in the second quarter.
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| Xiaomi to announce its own "Pinecone" AP chip |
2/21/2017 |
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Rather than fully relying on the likes of Qualcomm and MediaTek, Xiaomi can take advantage of Leadcore's cellular radio technology for its own chipsets, thus keeping costs down in the long term.
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| 2016 R & D spending ranked |
2/21/2017 |
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Intel Corp. came first with R&D expenditures of $12.7 billion, followed by Qualcomm Inc. with $5.1 billion and Broadcom Ltd. with $3.1 billion.
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