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SK Hynix introduced 27nm 8Gb GDDR6 DRAM 4/24/2017
SK Hynix has been planning to mass produce the product for a client to release high-end graphics card by early 2018 equipped with high performance GDDR6 DRAMs.
Several 12-inch fab projects in China put on hold 4/24/2017
Speculaiton has emerged recently in China's chipmaking industry about several local 12-inch fab projects being put on hold.
In-memory graphic process to boost performance by 65% 4/24/2017
Researchers at the Pacific Northwest National Laboratory and the University of Houston have announced a technique for carrying out graphics processing in-memory which is claimed to boost performance by up to 65 percent.
Western Digital is bidding hard while others wouldn't let go 4/24/2017
Toshiba narrowed the list of contenders to a group that includes Western Digital’s rivals, including Taiwan’s Hon Hai Precision Industry Co., South Korea’s SK Hynix Inc. and chipmaker Broadcom Ltd.
Huawei's P10 models experimenting with different memory systems 4/21/2017
The company equipped the new flagship smartphone models with both eMMC 5.1, UFS 2.0, and UFS 2.1 storage. Speeds of UFS 2.1 storage could hit 700 Mbps, while UFS 2.0 and eMMC 5.1 storage generally had test results of around 500 Mbps and 300 Mbps.
iPhone chip shipment to exceed 50 million in second half 2017 4/21/2017
Chip demand for Apple's upcoming iPhone series will exceed 50 million sets per quarter during the second half of 2017, adding that unit sales of the new iPhone are forecast to reach a total of 220-230 million units.
ASML to ship extreme ultraviolet lithography on 2018 4/21/2017
The company continues to make progress toward its goals for EUV of 125 wafers per hour productivity and 90 percent light-source availability.
Samsung claims 2nd generation 10nm FinFET process 4/21/2017
The 10-nanometer Lower Power Plus (10LPP) increases performance by 10 percent and consumes 15 percent less power than its predecessor.
New LI-RAM to reduce memory power by 10% 4/20/2017
Light-induced magnetoresistive RAM (LI-RAM) essentially “allows computer chips to exist at a molecular level,” which aims to reduce the power consumed and heat produced by modern PC processors
Intel to fabricate another 14nm chip for Spreadtrum 4/20/2017
Intel will fabricate Spreadtrum's SC9853 series chips slated for launch in the third quarter of 2017.
White House stalls world climate meeting 4/20/2017
White House postponed a meeting Tuesday where top aides were to have hashed out differences on what to do about the non-binding international deal forged in Paris in December 2015.
IMF prdicts global growth to 3.5% 4/20/2017
International Monetary Fund, which predicts that the world economy will grow 3.5 percent this year, up from 3.1 percent in 2016, a slight upgrade from the 3.4 percent global growth it had forecast in January.
Apple continue to make gain in the U.S. while weakening at China market 4/18/2017
In China, iOS lost 8.9 percentage points in market share over a period of one year. iOS holds 13.2%. It's Apple's lowest share in China in the last three years.
Powertech to buy Micron's memory assembly plant in Japan 4/18/2017
PTI disclosed it had signed an agreement with Micron to buy 100% Micron Akita. The pair also agreed to enhance their "long-term strategic relationship."
28nm is the sweet spot for SMIC in 2017 4/18/2017
SMIC expects 28nm process technology to account for nearly 10% of its total wafer sales by the end of 2017. The proportion climbed to 3.5% in the fourth quarter of 2016 from 1.4% in the prior quarter and 0.3% a year earlier.
SK Hynix is an eager party in acquiring Toshiba NAND properties 4/18/2017
SK Group chairman Chey Tae-Won expressed his strong will to take over Toshiba on April 13. The SK Group chairman is currently working on business reorganization led by the expansion of its semiconductor business.
TSMC expects phone market to slump in 1st half of year 4/17/2017
TSMC says it is expecting an inventory correction in smartphones to continue through the first half of this year.
Blackout affected manufacturers in South Taiwan 4/17/2017
Temporary power failure was caused by an unnamed manufacturer's faulty 161 kilovolt (kV) power transformer that caused an electric voltage drop that affected at least 10 semiconductor companies sharing the same power circuit.
Gartner revised semiconductor growth to 12.3% 4/17/2017
Gartner Inc. said it expects semiconductor industry sales to grow 12.3 percent this year, reaching $386 billion. Gartner said favorable market conditions that gained momentum in the second half of 2016 have raised the outlook for the chip market in both 2017 and 2018.
Charles Kau: China's emerging memory industry will balance the domination of Samsung 4/17/2017
"Samsung's domination in the global memory chip market is in fact a global issue, and it appears that China can serve as an emerging force to balance the power of Samsung,"
China Yangtze River Storage Technology claim to design its own DRAM 4/13/2017
Charles Kau of YMTC says the company may go straight to fabrication of memory chips with features measuring 18 nanometers or 20nm.
PC Market show sign of hope in Q1 4/13/2017
PC shipments in the first quarter rose by about 1 percent from last year, based on calculations from the research firm International Data Corp. The modest gain marks the first quarterly increase in five years.
2017 to be marked as the year of the cloud 4/13/2017
This is the year when cloud deployment will dominate industry news. Signs point to it, from industry trends to forecasts from analysts, media pundits and software experts.
U.S. manufacturing continue to rise 4/13/2017
U.S. manufacturing technology orders increased more than expected in February, up 19.6 percent from January, while overall orders were up 1.7 percent year over year.
Market demand helped advance China fabs to 28nm 4/12/2017
Semiconductor Manufacturing International Corporation (SMIC) and Shanghai Huali Microelectronics Corporation (HMLC) are the two leaders among Chinese foundries in the development of the 28nm processing. The existence of foreign-owned fabs in China will pressure these two domestic manufacturers to further accelerate their timetables for this technology.
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