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| Nanya enters market with self developed 8GB 20nm DDR4 |
12/19/2017 |
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Nanya Technology Corporation announced that they have completed their first independently-developed 20nm process 8GB DDR 4 DRAM, and after having obtained PC companies’ certification, they will begin shipments this month.
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| ASE/SPIL stock swap date to defer |
12/19/2017 |
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The companies have decided to defer the long stop date for share exchange from December 31, 2017 to October 31, 2018 beause their plan to set up a joint holding company in May 2018 had just been approved by Anti-monopoly Bureau under China's the Ministry of Commerce November 24.
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| Globalfoundries to put autombile chips in Dresden and IoT in Chengdu |
12/19/2017 |
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Globalfoundries (GF) will have its 12-inch wafer fabs in Dresden, Germany focus on using FD-SOI (fully-depleted silicon-on-insulator) process technology to fabricate automotive-use chips for the European market, while its fab in Chengdu, China will be dedicated to manufacturing ICs on the process for IoT (Internet of Things) and 5G applications.
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| Big Data intellegence to help IC design |
12/15/2017 |
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IC Manage CEO, described Big Data Labs as a “platform” on which his company hopes to “develop and customize new big-data-based design analytic tools” for customers.
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| Nvidia AI chip goes into Komatsu construction automation machine |
12/15/2017 |
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Komatsu will use image data processed by Nvidia's AI chips to monitor work sites in real time and quickly update construction plans according to the progress made. Drones will fly over large projects to capture the images via cameras equipped with the chips. Komatsu also seeks to develop autonomous construction machinery and other labor-saving services.
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| Apple invested in Finisar, an image recognition chip provider |
12/14/2017 |
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Finisar Corp clarified that Apple’s funding was not a debt or equity investment in the company. "The amount referred to by Apple represents anticipated future business between the companies over a period of time," Finisar said in a filing.
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| Manufacturing IoT to realize its power in 2018 |
12/14/2017 |
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IoT adoption and embrace the smart, digital solutions that will continue to push the industry forward. The benefits of IoT adoption for the manufacturing industry are undeniable which is why we’ll continue to see IoT speed ahead in 2018.
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| Toshiba offers JEDEC USF-2 compliant embedded NAND |
12/13/2017 |
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The devices integrate NAND chips fabricated with 15nm process technology and a controller in a single package. Five different capacities of 16GB, 32GB, 64GB, 128GB and 256GB support a variety of automotive applications.
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| NAND flash to reach supply/demand balance by Q1 |
12/12/2017 |
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Thanks to increased production and the seasonal downturn, DRAMeXchange estimates that overall demand will fall by 15 percent in Q1 2018 compared to Q4 2017. The one caveat is that demand in the server market is expected to remain relatively flat.
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| Apple Watch 3 drove packaging to new height |
12/12/2017 |
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The ASE group is responsible for packaging and testing radio frequency, Wi-Fi and MEMS chips for iPhone and Apple Watch devices, and is expected to score record quarterly revenues in the fourth quarter of 2017, the sources said.
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| Micron suit UMC for leaking DRAM technology to China |
12/12/2017 |
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The sources said Micron has filed a lawsuit with a federal court in the North California District accusing UMC and JHICC of copying its DRAM trade secrets, marking the first time for Micron to extend its legal battle across the Taiwan Straits in safeguarding its DRAM IPs.
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| Lisa Su, CEO of AMD, talked architecture at IEDM |
12/12/2017 |
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Su began her address by saying that it was an honor for her to be speaking at the conference 25 years after receiving an award for best student paper at IEDM in 1992 at the age of 22.
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