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IC Insight predicts 22% semi growth 10/20/2017
For 2017, IC Insights expects a whopping 77% increase in the DRAM ASP, which is forecast to propel the DRAM market to 74% growth this year, the largest growth rate since the 78% DRAM market increase in 1994.
LG and Qualcomm partners in self-driving automobile parts 10/20/2017
Under the agreement, the two companies opened a join research lab for V2X technology in Seoul. They also plan to establish another research center in South Korea by the end of this year.
Nanya Technology rolls 20nm DRAM 10/19/2017
NANYA is scheduled to enter mass production of 20nm 8Gb DDR4 chips in the fourth quarter of 2017, according to the Taiwan-based DRAM chipmaker.
Shell opened first EV charging station 10/19/2017
Three charging stations are opening Wednesday at locations in London, Surrey and Derby, with seven more expected by the end of the year. It comes only days after Shell agreed to buy electric vehicle charging firm NewMotion.
China's president Xi calls for turther technology developement 10/19/2017
In a speech at the opening of a party congress, Xi called for making a "country of innovators" and creating competitors in aerospace, cyberspace, clean energy and other areas.
No hope to revamp NAFTA this year 10/19/2017
A fourth round of negotiations between the U.S., Mexico and Canada ended in mutual exasperation Tuesday. Talks will continue next month in Mexico City and will spill over into next year.
Nanya would rather concentrate on server market DRAM 10/18/2017
Nanya is to re-enter the server market by offering a new 8-gigabit DDR4 DRAM this quarter, in pursuit of its next growth engine.
Semiconductor shipment to break record of 11.448 billion sq. inches 10/18/2017
"Silicon shipment volumes are expected to ship at historic highs for this year and into 2019," said Dan Tracy, senior director of Industry Research & Statistics at SEMI.
Microchip ‘SuperFlash’ memory offers 64Mbit with reduced power consumption 10/18/2017
It supports full command-set compatibility to traditional Serial Peripheral Interface (SPI) protocol.
New partnership in MRAM developement 10/18/2017
Spin Transfer Technologies (STT) and capital equipment vendor Tokyo Electron Ltd. (TEL) have entered into a collaborative engineering program to jointly develop process technologies for SRAM- and DRAM-class spin-transfer torque (ST) MRAM devices.
Market outlook for NAND remains unchanged regardless of glitch at Toshiba 10/17/2017
Toshiba will be able to deliver its NAND Flash shipments as per the dates and volumes in its fourth-quarter contracts, says DRAMeXchange.
SMIC appointed new executives 10/17/2017
Semiconductor Manufacturing International Corporation ("SMIC"; the largest and most advanced foundry in mainland China, today announced the appointment of Dr. Haijun Zhao and Dr. Liang Mong Song as SMIC Co-CEO and Executive Director.
China plans to double its 12 inch capacity in 2018 10/17/2017
Shanghai Xinsheng is scheduled to come online at the end of 2017 with monthly capacity of 150,000 12-inch wafers in the first phase, and the monthly capacity will double to 300,000 units by 2020.
Toshiba eager to close the Bain deal while WD is still fighting 10/17/2017
Channels for talks with Western Digital remain open while Toshiba hoped for cordial relations and continued cooperation with the company.
Samsung Electronics CEO resigned 10/16/2017
The surprise resignation of Samsung’s chip and display head came as he was expected to take a bigger role following Lee’s arrest in February and the departures of other key executives in the wake of the bribery scandal.
DRAM manufacturers stock rises 10/16/2017
While demand for DRAM was expected to rise 20.6% next year, chipmakers were only planning to add 19.6 percent in capacity globally, a TrendForce report said
ON Semi released new image sensors 10/16/2017
The new parts provide a complete solution with the new image sensor and processing functionality integrated within a low power system-on-chip (SoC) that simplifies and speeds adoption in applications like rear and surround view cameras.
Toshiba start to order equipment for new fab 10/16/2017
The equipment is for a fabrication facility under construction at the Mie Prefecture plant, in which Toshiba jointly invests with U.S. partner Western Digital.
Semiconductor boom mostly benetit U.S. equipment manufacturers 10/13/2017
Korea’s imports of US semiconductor manufacturing equipment, the largest one among import items from the US, ballooned a whopping 199.0% to US$ 3.558 billion from the previous year.
Irish court approved Apple to build $1 billion data center 10/13/2017
Apple in February 2015 announced plans to build the data center in a rural location in the west of Ireland to take advantage of rich green energy sources nearby.
Western Digital to tap on microwave-assisted magnetic recording 10/13/2017
Western Digital demonstrated what it called the world's first MAMR, or microwave-assisted magnetic recording, hard drives, and discussed plans for bringing those drives to market.
ADI to work with imec on IoT devices 10/13/2017
The move, building on two existing initiatives, is intended to produce devices that are not only low-power, but which also feature largely improved or completely new sensing capabilities.
Qualcomm found breach of antitrust regulations in Taiwan court 10/12/2017
Apple seen as winner as Taiwan slaps Qualcomm with $773m antitrust fine.
ST to build 2 new 300mm fabs 10/12/2017
ST has not built a 300mm fab since 2002 when it built Crolles 2 with Motorola and Philips. Motorola (later Freescale) and Philips pulled out of the collaboration in 2007.
California governor Jerry Brown to put more zero emission cars on the road 10/12/2017
The state is working toward putting 1.5 million zero-emission vehicles on the road by 2025 — an ambitious target.
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