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| Rumors for Qualcomm to acquire Xilinx |
5/25/2016 |
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Street Insider first reported the rumor of the offer, citing sources familiar with the matter, but didn’t identify the bidder. Xilinx stock shot up 5.7% near the close Tuesday and was up a fraction in after-hours trading.
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| Global Foundries' SiGe process now good for 5G RF |
5/25/2016 |
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The technology is optimized for customers who need improved performance solutions for automotive radar, satellite communications, 5G millimeter-wave base stations and other wireless and wireline communication network applications.
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| Smartphone chip shipment to step up in China |
5/25/2016 |
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About 150 million application processors will be shipped to the China smartphone market in the second quarter of 2016, up 11.3% sequentially, according to Digitimes Research.
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| NAND revenue fell |
5/24/2016 |
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The overall decrease in average selling prices (ASPs) is much greater than the total bit shipment growth for the first quarter. Consequently, branded NAND Flash manufacturers suffered an average quarterly revenue drop 2.9%, marking two consecutive quarters of decline.
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| Kaysight beats estimate |
5/24/2016 |
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Keysight Technologies (NYSE: KEYS) on May 19 reported 2016 fiscal-year second-quarter profit of $88 million, equivalent to 61 cents a share, exceeding expectations of many analysts.
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| Samsung announced 10nm 6GB LPDDR4 DRAM |
5/23/2016 |
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Manufactured on the 10nm architecture, these DRAM memory chips are going to boast better efficiency and are going to be powering up the next wave of smartphones and other tablets.
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| Applied Material sales jumped |
5/23/2016 |
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Machines that make flash memory, used as storage in phones and tablets, provided 49 percent of Applied’s total of $1.97 billion in chip equipment orders. That area is being boosted by the switch to chips called 3D Nand. Companies that manufacture smartphone displays also flooded Applied’s order books.
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| 3D NAND has limits |
5/20/2016 |
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3D NAND chips are 32- and 48-layer devices, but the technology will likely hit the ceiling at 128 layers in the 2018 timeframe. Vendors might stack three separate 48-layer 3D NAND devices, creating a 144-layer chip. Even with string stacking, though, 3D NAND could hit the wall at 300 layers.
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| IBM created a Tri-level PCM memory |
5/19/2016 |
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Three-bit PCM could be used as a faster tier of storage within arrays, including all-flash arrays, so the most-used data gets to applications faster. It could also take the place of a lot of the DRAM in systems, cutting the cost of technologies like in-memory databases.
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| DRAM revenue dropped 16.6% in Q1 |
5/18/2016 |
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DRAM industry posted US$8.56 billion in revenue in this first quarter, down 16.6% from the previous quarter. Market oversupply and sliding average selling price were the main culprits behind the revenue decline.
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| AMD introduced M400 series GPU |
5/18/2016 |
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The new series spans Radeon R9, Radeon R7, and Radeon R5-class processors sporting support for DirectX 12, the new Vulkan graphics API, OpenGL 4.4, and AMD’s own Mantle API that “speaks” to its GCN architecture.
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