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IEEE working on lower frequency/low power WiFi standard for IOT 8/20/2015
802.11ah is based on down-clocking of the 802.11ac standard and adds some enhancements in PHY and MAC layers such as power saving, large number of station support, better coverage and mobile reception.
Google mapping can help you plan solar installations 8/20/2015
Once supplied with a user's address, the site provides user-specific data on the amount of usable sunlight that hits the roof per year, which parts of the house receive the most sunlight, the amount of space available on the home for solar panels, and the amount of money that could be saved by switching to solar.
Microsoft is working on a comeback high-end mobile 8/19/2015
Microsoft will launch the device with Windows 10 Mobile, but there were some rumors that the company was also trying to make it possible for the phone to run Win32 apps. This way, the “productivity on the go” concept would be pushed to a completely new level.
Mobile DRAM market grew 7.7% 8/19/2015
The global mobile DRAM market came to US$3.85 billion in the April-June period, up 7.7 percent on-quarter.
Micron to use 3rd party in supplying legacy memory modules 8/19/2015
Micron Technology’s legacy DRAM modules (SDR/DDR) will be manufactured by ATP following a license agreement between the companies.
Companies are using data-driven model to manage their employees 8/19/2015
"The old mentality was once a year we would check in with an annual survey, have an annual review, set goals," said Barnett. "What we've learned is the world today moves much faster than that."
Rambus to sell its own brand DDR4 accelerator chips 8/18/2015
The first in a family of R+ chips, the RB26 is an enhanced memory module chipset designed to accelerate data-intensive applications, the company said. Rambus’ plan is to sell the chips to existing memory companies such as Hynix, Micron and Samsung.
SK Hynix to build 2 new wafer fabs in Korea 8/18/2015
The company said it will come up with "innovative ways" of creating jobs for young adults and expanding its social contribution.
Frisker electrical vehical due to return 8/18/2015
The report said that new Fisker plug-in hybrid cars could go on sale as early as mid-2016. Fisker in 2009 received a $529 million loan commitment from the U.S. Department of Energy, and its Karma plug-in hybrid model sold well despite the $100,000 price tag.
Apple is looking for automobile test facility 8/18/2015
Apple recently made inquiries about a former navy base that's been converted into a testing ground for self-driving cars and other cutting-edge vehicles.
Intel overpowers Qualcomm to provide LTE modem to Apple 8/17/2015
If true, this is a real breakthrough for Intel, which has struggled for more than 15 years to break into the mobile phone market.
BitMicro provides 8TB Flash Storage 8/17/2015
The company’s ASICs reduce the overhead tax on servers for managing SSDs from about 12 percent on average down to one percent. The Talino architecture also does not require any on-board fans.
Consumer price index up 0.2% 8/17/2015
The Federal Reserve has said that it needs to feel "reasonably confident" that inflation will move back to its 2 percent goal before beginning to raise interest rates from a record low near zero,
Lenovo caught installing spyware onto PCs 8/17/2015
The company was in hot water after reportedly shipping laptops with pre-installed software called "Superfish" that could let hackers steal passwords or other sensitive information when users accessed the web to shop, pay bills or check email.
Scientist at Rice invented room temperature process on graphene base ReRAM 8/14/2015
"Our group's ultrahigh-density nonvolatile resistive memory uses a 3-D material that can be fabricated at room temperature,"
Toshiba is developing QLC level NAND 8/14/2015
Many of today’s solid state drives use Triple Level Cell (TLC). This kind of flash can store 3 bits of data per cell. QLC, as the name implies, Toshiba’s technology boosts that to 4 bits per cell.
Qualcomm announce significant upgrade in Snapdragon 820 8/14/2015
“We’re significantly enhancing the visual processing capabilities of Snapdragon to support next-generation user experiences related to computational photography, computer vision, virtual reality and photo-realistic graphics on mobile devices, all while maximizing battery life,”
New water bottle is made out of paper 8/14/2015
The manufacturing process saves both energy and water and enables a lower carbon footprint. The bottles can also be recycled into paper products or green building materials.
Taiwan government allows TSMC to invest in 12" fab in China 8/13/2015
Companies are now allowed to set up 12-inch wafer factories as co-investors with Mainland Chinese companies or purchase 99% or above of stock in Mainland Chinese companies.
Intel includes Win 10 on Compute Stick 8/13/2015
The Intel Compute Stick is practically a Windows pico PC in an even more portable form. Powered by an Intel Atom Z3735F, with 2 GB of RAM and 32 GB of storage, it offers to get basic computing jobs done.
Semi wafer shipment up 2.5% 8/13/2015
Total silicon wafer area shipments were 2,702 million square inches during the most recent quarter, a 2.5% increase from the 2,637 million square inches shipped during the previous quarter resulting in a new quarterly volume shipment record.
U.S. Wind turbines are increasing 8/13/2015
Wind energy prices are at an all-time low and remain competitive with conventional power sources in many areas of the country.
Is China losing position as the world's manufacturing center? 8/12/2015
The Chinese company has decided to make its phones here in India in order to reduce production costs and speed up time to market as it tries to benefit from the country's huge consumer base.
Toshiba announced 16-die stack with TSV 8/12/2015
Traditional stacked NAND flash memories are connected together with wire bonding in a package, while TSV technology uses the vertical electrodes and vias to pass through the silicon dies for the connection. This enables high-speed data input and output, and reduces power consumption.
AMD to add FPGA to make processor flexible for data centers 8/12/2015
The chip would leverage the capabilities in AMD's upcoming second-generation High-Bandwidth Memory (HBM2) technology, which would help create high-speed communications between the CPU, FGPA and memory.
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