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| ST/Erricson JV to split |
3/18/2013 |
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Ericsson (Stockholm, Sweden) will take back the LTE 2G-through-4G multimode modem technology while ST (Geneva, Switzerland) will take control of the existing ST-Ericsson products excluding the LTE multimode thin modem ICs and certain assembly and test operations.
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| Qualcomm succeed in CMOS front end design |
3/18/2013 |
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"Qualcomm is the first to launch a CMOS PA [power amplifier] alternative to GaAs-based multiband multimode PAs for mid- to high-tier 3G/4G smartphones, a phone segment formerly the exclusive domain of GaAs PAs.
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| "iPhone" trademark blocked in Mexico |
3/18/2013 |
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The issue over the iPhone trademark started when Apple tried to register its trademark in Mexico. However, to their surprise the Mexican Industrial Property Institute did not allow the registration as the name was already taken.
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| China Mobile aims to sell 100-120 million Handsets |
3/15/2013 |
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China Mobile, the only TD-SCDMA mobile telecom carrier in China, aims to sell 100-120 million TD-SCDMA handsets in 2013, 80% of which will be smartphones, according to company president Li Yue.
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| Samsung unveil Galaxy S4 |
3/15/2013 |
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Samsung Electronics has announced the fourth generation of the Galaxy smartphone series, the Galaxy S4 that weighs 130g.
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| UMC to buy back shares |
3/14/2013 |
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United Microelectronics (UMC) has unveiled plans to buy back up to NT$15.5 billion (US$447 million) of its shares and distribute them to employees. .
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| HTC delays HTC One delivery |
3/13/2013 |
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HTC has confirmed that it is pushing back the launch date of its new HTC One in certain markets to the end of March.
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| Rexchip ramps up DRAM capacity |
3/13/2013 |
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Rexchip Electronics will allocate 50% of the production capacity at its 12-inch fab for mobile RAM before June 2013
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| AMD launches Richland APU |
3/13/2013 |
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AMD on March 12 launched Richland, a new APU equipped with a Radeon HD 8000 graphics core.
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| Acer to adopt recycled materials in products |
3/12/2013 |
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Acer will cooperate with Wistron to adopt recycled materials such as plastic into their products and the company also plans to cut its carbon emissions by 30% by 2015 and 60% by 2020.
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| Taiwan IC test company reports poor Ferbruary revenue |
3/12/2013 |
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King Yuan Electronics (KYEC), Sigurd Microelectronics and STATS ChipPAC Taiwan Semiconductor all suffered sequential revenue decreases in February 2013, due to inventory adjustments at their clients and fewer working days in the month because of the Lunar New Year holiday.
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| Acer to add more Taiwan R&D investment |
3/12/2013 |
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Acer plans to significantly raise its R&D and marketing funds for 2013 with such investment' share of revenues to gradually increase from 0.6-0.8% in 2012 to 1.2-1.5% by the fourth quarter of 2013, according to company president Jim Wong.
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| Samsung to offer Wireless Charging |
3/11/2013 |
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Samsung is expected to adopt Qi wireless charging technology run by the Wireless Power Consortium (WPC) for its next flagship model, the Galaxy S IV, the sources indicated.
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| Macronix February slips 19.52% |
3/11/2013 |
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Macronix had consolidated revenues of NT$1.315 billion (US$44.3 million) for February slipping 19.52% on month and 28.48% on year and those of NT$2.950 billion for January-February declining 16.12% on year.
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| HTC one to launch in Taiwan |
3/8/2013 |
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The New HTC One will be avaialbe in Taiwan at the end of March, with a retail price of NT$19,900 (US$670)
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| HP turns to purchasing components from China makers |
3/8/2013 |
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Hewlett-Packard (HP) has recently turned to seek component supplies from China-based makers in order to cut costs and continue staying competitive in the PC market, according to sources from the upstream supply chain.
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| Samsung to invest in Sharp |
3/7/2013 |
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Samsung Electronics may invest JPY10 billion (US$107 million) in Sharp, according to industry rumors.
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