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Ananlyst see microprocessor market to expand 1/22/2013
The market researcher sees the microprocessor market gaining strength between 2013 and 2016 with modest growth returning in standard PCs made with x86 processors and stronger demand continuing for MPUs used in tablet computers and smartphones.
Huawei to flood Europe with lower-end smartphones 1/22/2013
The Ascend G615 will retail for 299 euros (£250), a price that, along with the device’s specs, suggest Huawei is gunning for the lower-end of the smartphone market.
AMD rehired engineers exposed to Mobile technologies 1/22/2013
An AMD spokesperson has confirmed that the hiring of the two engineers, stating that they will help the company expand into new markets, but no further details as to their specific areas of responsibility was given.
AT&T to acquire Alltel assets 1/22/2013
The acquisition must be reviewed and approved by the Federal Communications Commission and the Department of Justice, with an expected approval coming in the second half of this year some time.
Facebook-led Open Compute Project (OCP) propells ARM servers 1/21/2013
With OCP, Facebook is encouraging large and small data centers and their vendors to set common specs for servers and other data center gear to lower costs.
Semi companies are optimistic on the future 1/21/2013
Executives from TSMC, Intel and ASML said they expect their respective companies to grow sales modestly in 2013. A slow start but strong full year perspective can be attributed to the need for chip makers to invest in the 14nm and 20nm foundry and logic nodes.
Smartphone upgrade puts pressure on carrier profit 1/21/2013
The more smartphones carriers sell, the worse their profit margins get. They pay the heavy upfront subsidy to get you hooked on a long-term contract. The longer you hang on to your phone, the better their bottom line gets.
Eric Schmidt's account of his North Korean trip 1/21/2013
"They have to make it possible for people to use the internet, which the government of North Korea has not yet done. It is their choice now, and in my view, it's time for them to start, or they will remain behind."
HTC to unveil new M7 Smartphone 1/18/2013
HTC will likely use Full HD panels made by Sharp for its reported soon-to-be released M7 smartphone due to low OLED yields from Taiwan-based panel maker AU Optronics (AUO).
Powerchip execuitves vow to keep P3 fab 1/18/2013
High-level executives from several Taiwan-based niche-market memory suppliers to discuss the possibility of jointly bidding for Powerchip's P3 12-inch wafer fab.
Micron re-ink new supply agreement with Nanya 1/18/2013
Micron Technology announced on January 17 that it has entered into agreements with Nanya Technology to amend their joint venture relationship involving Inotera Memories
UMC and Chipbond co-develop new copper process 1/17/2013
UMC has developed a thick-plated copper process, in collaboration with packaging house Chipbond Technology, for power management IC applications.
Intel unveil Atom processor for low-end smartphone 1/17/2013
Intel's introduction of a new Atom processor platform designed to target the fast-growing market for low-end smartphones in emerging economies.
Acer retire eMachine brand 1/17/2013
Acer has confirmed that it has discontinued the operations of its eMachines brand, which it brought in after acquiring Gateway.
LG launches first next-generation OLED 55in TV 1/16/2013
LG has launched a 55in (140cm) OLED TV - kickstarting a battle over the next-generation of high-quality screens.
UMC delivers samples to Qualcomm 1/16/2013
United Semiconductor (UMC) has delivered samples of Qualcomm's new 28nm chips for verification.
HP predict 1Q13 notebook shipment to fall 20% 1/16/2013
Hewlett-Packard (HP) expect to see their notebook shipments drop about 20% sequentially in the first quarter of 2013, higher than an average 10% decline anticipated for the industry, according to sources at the notebook supply chain.
Oracle release new Java patch 1/15/2013
Oracle confirmed that it had released a new patch, but did not return a call for comment on the lingering concerns.
Foxconn to produce materials for railroad cars 1/15/2013
Foxconn has established Qingdao Haiyuan New Alloy Materials in Qingdao, northern China, to produce materials for railroad car production.
Winbond swings back to profitability 1/15/2013
Winbond Electronics, a manufacturer of specialty DRAM and NOR flash memory, is set to return to the profitability in the first quarter of 2013
DRAM prices soars due to shortage 1/14/2013
With DRAM makers allocating more capacity to producing chips for phones and other non-PC applications, spot prices for commodity DRAMs have soared recently,
NAND flash device suppliers report decline sale for December 2012 1/14/2013
NAND flash device manufacturers Transcend Information, Apacer Electronics and Phison Electronics have all reported sequential revenue declines for December 2012,
Samsung sell-off Skymedi shares 1/14/2013
Samsung Electronics, through its investment arm Samsung Venture Investment Corporation (SVIC), has started disposing of its Skymedi shares since January 10.
More chipset vendors offering multi-core processor 1/11/2013
Chipset vendors including Nvidia, Qualcomm, Samsung Electronics and ST-Ericsson have all unveiled their new multi-core solutions for mobile devices
Inotera signs NT$10 billion syndicated loan 1/11/2013
DRAM manufacturer Inotera Memories, a production subsidiary of US-based Micron Technology, has signed a NT$10 billion (US$345.3 million) three-year syndicated loan agreement with a consortium of 12 banks led by the Bank of Taiwan.
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