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| iSuppli said worldwide chip sales to pick up sequentially |
6/19/2009 |
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Global chip sales in the first quarter declined to $44.3 billion, down 18.8 percent from $54.5 billion in the fourth quarter, and a decline of 33.8 percent from $66.8 billion in the first quarter of 2008, according to market tracker iSuppli.
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| Intel put more resource in energy R&D |
6/19/2009 |
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Intel Corp. has revamped its R&D activities, by renaming the group and forming several new units in the arena. The company has also formed a new group that will focus on energy.
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| TSMC to boost 2009 CAPEX to $1.9 billion |
6/18/2009 |
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Silicon foundry giant Taiwan Semiconductor Manufacturing Co. Ltd. (TSMC) plans to boost its capital spending from $1.5 billion to $1.9 billion in 2009, according to a report from the Financial Times.
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| ProMos to supply DRAM to Elpida, sources said |
6/17/2009 |
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ProMOS Technologies will sign a DRAM supply agreement with Elpida Memory soon, forming a partnership that may be key to success of the Taiwan government-led Taiwan Memory Company (TMC) project, according to industry sources.
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| Best Buy quarterly earnings down |
6/17/2009 |
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Best Buy Co. Inc. posted lower first-quarter earnings and weaker-than-expected sales Tuesday and implied earnings for the rest of the year would be worse than forecast.
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| Foundry to see improved sales in Q2 |
6/17/2009 |
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Global revenue for pure-play foundries is expected to jump in Q2 after disastrous performance in Q1 impacted the top 10 foundries, according to a report from iSuppli Corp.
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| Sharp intergrates memory to LCD panel to save power |
6/16/2009 |
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Because liquid crystal display (LCD) pixels are relatively large it is possible to integrate memory in the active memory backplane at each pixel site. Sharp Corp. has done this for a 96 x 96 pixel miniature monochrome LCD and claims a power saving of a factor of 130 compared to standard LCDs of equal size.
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| ST, Soitec co-develop next generation image sensors |
6/16/2009 |
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STMicrolectronics and Soitec announced an exclusive joint cooperation to develop 300-mm wafer-level BSI (backside-illumination) technology for the next-generation of image sensors in consumer electronics.
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| Microsoft to strip IE from Window 7 |
6/12/2009 |
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Microsoft said EU regulatory wrangling has prompted it to strip Internet Explorer Web browsers from copies of its Windows 7 operating system to be sold in Europe.
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| Cadence cuts 225 jobs in US |
6/11/2009 |
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Cadence Design Systems will eliminate 225 jobs as part of a restructuring expected to save about $30 million per year.
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| Micron support JEDEC standard eMMC 4.4 |
6/11/2009 |
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Micron Technology has announced support of the newly-ratified JEDEC eMMC 4.4 standard with its portfolio of managed NAND solutions for mobile applications.
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| Taiwan motherboard makers reports poor May sales |
6/10/2009 |
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Taiwan-based motherboard maker Micro-Star International (MSI) saw May revenues increase on month while Asustek Computer, Elitegroup Computer Systems (ECS), and Gigabyte Technology all recorded a decline in revenues.
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| Winbond reports high yield at 65nm Fab |
6/9/2009 |
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Winbond said DRAM production at its 65nm process node is progressing with yield rates on the rise. Annual production capacity is expected to reach 8,000 wafers at the end of 2009.
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