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Intel/Micron JV looking for fab space in Utah 3/21/2006
“We're conducting a worldwide search, so we haven't ruled out any region at the moment,”
Samsung to supply 32GB NAND Flash drive 3/21/2006
Samsung (Seoul) also sells hard disk drives, but the company is aggressively developing NAND-based solid-state storage devices as a potential replacement for traditional storage, especially in MP3 players and hard drives.
H1-B workers badly needed 3/21/2006
Congress is considering increasing the annual H-1B visa cap by at least 50,000 without strengthening safeguards to protect foreign and domestic technology workers.
Transmeta did design for Sony and Microsoft 3/21/2006
“We intend to continue to seek additional strategic alliance opportunities and related agreements with these or other parties to provide engineering services that leverage our microprocessor design and development capabilities,”
IBM licensed Rambus XDR for Cell system usage 3/20/2006
"This agreement with Rambus is part of IBM's continued focus on our Cell BE-based chipsets in support of our goal of developing an array of leading edge computing products based on the revolutionary Cell BE architecture,"
SMIC selects Aviza termal processing system 3/20/2006
The RVP-550 vertical thermal processor for 300mm batch wafer processing is designed for process capability and production requirements through the 65nm node and beyond. The tool offers enhanced throughput as a result of its dual-boat platform.
U.S. to help Chinese in understanding semi IP's 3/20/2006
Even though there is deep dissatisfaction among many U.S. businesses about China’s track record, many semiconductor executives believe the benefits of engagement outweigh the risks of IP abuse. “The Chinese mainland will not go on ignoring IP protection,”
Fujitsu signed Rambus system license 3/20/2006
Semiconductor IP company Rambus Inc. has signed a patent license agreement with Fujitsu Ltd., covering the manufacture and sale of systems and semiconductors worldwide.
Seiko Epson restructure products for profit 3/20/2006
"By making the entire operation leaner and more agile, the company intends to give the business a wider variety of future options,"
Lenovo to cut 1000 jobs 3/17/2006
Lenovo said it’s undergoing a restructuring that calls for the layoff of 1,000 employees and corporate operations to be moved from Purchase, N.Y., to Raleigh, N.C.
ATI and Nvidia said to be uncertain about 80nm production 3/17/2006
ATI Technologies and Nvidia will focus on graphics chips manufactured on a 90nm process technology rather than migrating their production to 80nm this year
Intel may not offer entry level chipset 3/17/2006
Intel is rumored to exit the entry-level chipset market amid tight supply of flip chip (FC) substrates,
VIA's C7-M processor ordered by China PC OEM 3/17/2006
China-based PC vendor Tsinghua Tongfang confirmed that it placed orders for VIA’s C7-M processor for use in its entry-level V30 notebook
Samsung Downgrades Restructuring Headquarters 3/16/2006
Samsung downgraded its Group Reformation Headquarters and cut the number of personnel at the chaebol's powerful control tower 33 percent.
Nanya breaks ground at 12-inch fab, trial production to begin in mid-2007 3/16/2006
On March 15, Nanya Technology broke ground at its 12-inch fab located in Linko (northern Taiwan), and trial production runs are slated to begin in the middle of 2007.
Nanya to enter Nand Flash Market 3/16/2006
Nanya Technology indicated that it is also considering to offer foundry services for NAND flash production
Inotera capacity to reach 80,000 12-inch wafers by 2007 3/15/2006
Inotera Memories has announced that its combined 12-inch wafer capacity will reach a minimum of 80,000 wafers per month by 2007.
Sony delays PS3 3/15/2006
Sony Corp. has delayed the introduction of the Playstation 3 game machine to November — or about six months later than expected.
Intel launched low power Dual Core 3/15/2006
Intel on Tuesday began making good on its pledge to revamp its processor line with devices that generate significantly less heat when it introduced the dual-core Xeon low-voltage processor, which has a total dissipated power of 31 watts.
Infineon eyeing IPO 3/15/2006
A sale of the memory business of German chipmaker Infineon Technologies AG to investors through an initial public offering of shares is becoming more likely
Samsung improves yield, run DDR2 on 80nm 3/14/2006
"With demand for DDR2 at its highest level since it was made its market debut in 2004, our 80nm technology provides us with the ability to more efficiently support the sustained demand growth that is expected in the DDR2 marketplace this year,"
Infineon not to miss window on Flash 3/14/2006
Compared to competing single-bit-per-cell floating-gate technologies with equivalent process structures, TwinFlash claims to offers 40 percent smaller die sizes due to its two-bit-per-cell approach, as well as lower mask levels.
NEC Hua Hong to partner with STMicro on 300mm fab 3/14/2006
Under the plan, STMicroelectronics (Geneva), which is expanding its reach into China, will transfer its 300-mm copper technology to HHNEC (Shanghai),
Breakthrough in white LED 3/14/2006
Nichia Corp. has developed a white LED chip with 100-lumens/watt efficiency, with volume production expected this year.
LCD glass, a growin business for Corning 3/14/2006
Corning now expects LCD glass market volume to grow at a compound average rate of 37 percent through 2007, up from an earlier estimate of 32 percent.
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