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Hynix ordered to halt NAND flash sales to Japan 3/27/2006
Hynix Semiconductor Inc. was ordered by a Tokyo court to halt its NAND flash memory sales in Japan after Toshiba Corp. filed a patent lawsuit against the South Korean rival, according to news report.
IBM moves closer to Nanotechnology chip 3/27/2006
IBM announced it had built the first electronic circuit around a carbon molecule, which could potentially produce the next generation of semiconductors.
AMD teams with Xilinx and Celoxica to experiment on co-processor 3/24/2006
At the heart of the proposal is AMD’s Opteron processor with its Direct Connect Architecture and native HyperTransport technology used with a Xilinx FPGA, supported by Celoxica’s programming environment, to create a “cost effective” accelerated computing platform.
DRAM market failed to lift as expected 3/24/2006
Contract prices for DRAMs are expected to be flat in the second half of this month, “as DRAM makers seem to stop proposing price [hikes] for both DDR and DDR2 modules,” according to DRAMeXchange.
Toshiba stops Hynix from selling NAND into Japan 3/24/2006
South Korea's Hynix Semiconductor Inc. was ordered by a Japanese court Friday (March 24) to stop selling NAND flash memory components in Japan in relation to a lawsuit brought by Toshiba Corp.
Hi-tech used to track bird flu 3/24/2006
"To mitigate the risks associated with this type of threat, firms are coming up solutions that include social distancing through enhanced telecommuting and work-from-home strategies involving VPNs and LANs,"
Alcatel in talks with Lucent 3/24/2006
“We can confirm that Lucent and Alcatel are engaged in discussions about a potential merger of equals that is intended to be priced at market,” according to a statement issued by the companies. The deal could potentially create a communications powerhouse, with combined sales of more than $25 billion.
Flash tester company goes IPO 3/23/2006
The company specializes in low-cost ATE for flash memory, but also sells to the MCU and FPGA markets; it has an installed base of some 1,500 systems. For the six months ended Dec. 31, 2005, Nextest had net revenue of $36.6 million and net income of $3.3 million.
Sun open codes to UltraSparc processor 3/23/2006
Specifically, Sun released Verilog RTL code for the processor design, a verification suite and simulation models, an instruction set architecture specification, and the Solaris 10 operating system simulation images.
Rambus lost board member formerly from Applied 3/23/2006
"We understand corporate conflicts have arisen for Mark at his company that were not foreseeable at the time of his appointment."
Three Samsung employees going to jail for price fixing 3/23/2006
Three Samsung Electronics Co. Ltd. executives have agreed to plead guilty and to serve jail time in the U.S. in conjunction with an alleged global conspiracy to fix DRAM prices, the Justice Department said Wednesday
Dell's acquisition of Alienware seen as endorsment to AMD server 3/23/2006
While AMD stopped short of saying the deal was a precursor to AMD-based Dell machines, the company acknowledged it could be a step in the right direction.
JEDEX Conference - April 18-19 SanJose CA 3/22/2006
JEDEX, the leading venue for education and up-to-the-minute information on the trends and technical direction of the memory industry, is being held this year at the Marriott San Jose in San Jose, CA on April 18-19.
Rambus riding on positive notes 3/22/2006
The company raised its range to $45 million to $48 million from previous expectation of $41 million to $43 million for the quarter ending March 31.
Opposition surfaces on Micron's Lexar acquisition 3/22/2006
“Elliott is extremely displeased by the current Micron transaction, in which Lexar shareholders are to receive 0.5625 Micron Technology shares per each company share, as we strongly believe this transaction significantly undervalues Lexar,”
Google to predict sales pattern on goods 3/22/2006
From search queries, Google can analyze, down to the Zip Code and region, the demand for goods and services throughout the world.
Delay of Windows Vista a material effect to the PC industry 3/22/2006
Delaying shipments for consumer PCs until January means Microsoft will miss the holiday shopping season, which accounts for a major portion of retailers' annual sales. In announcing the delay.
Motherboard shipment down, cast shadow on Q2 3/21/2006
MB makers should take more cautious measures on their product deployment and sales forecast for 2Q06 as the AMD/Intel platform transition and the lead-free regulations that effective in 3Q, should jointly step brakes on rapid shipment growth, especially when 2Q is the traditional low season.
Power efficient design conference in Dallas 3/21/2006
This week in Dallas companies that have made their livelihood from improving the power efficiency of chips and electronic systems are gathering to show off their latest innovations at the Applied Power Electronics Conference (APEC)
Intel/Micron JV looking for fab space in Utah 3/21/2006
“We're conducting a worldwide search, so we haven't ruled out any region at the moment,”
Samsung to supply 32GB NAND Flash drive 3/21/2006
Samsung (Seoul) also sells hard disk drives, but the company is aggressively developing NAND-based solid-state storage devices as a potential replacement for traditional storage, especially in MP3 players and hard drives.
H1-B workers badly needed 3/21/2006
Congress is considering increasing the annual H-1B visa cap by at least 50,000 without strengthening safeguards to protect foreign and domestic technology workers.
Transmeta did design for Sony and Microsoft 3/21/2006
“We intend to continue to seek additional strategic alliance opportunities and related agreements with these or other parties to provide engineering services that leverage our microprocessor design and development capabilities,”
IBM licensed Rambus XDR for Cell system usage 3/20/2006
"This agreement with Rambus is part of IBM's continued focus on our Cell BE-based chipsets in support of our goal of developing an array of leading edge computing products based on the revolutionary Cell BE architecture,"
SMIC selects Aviza termal processing system 3/20/2006
The RVP-550 vertical thermal processor for 300mm batch wafer processing is designed for process capability and production requirements through the 65nm node and beyond. The tool offers enhanced throughput as a result of its dual-boat platform.
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