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Intel to announce processor architecture at IDF 8/12/2005 Paul Ottelini, Intel’s chief executive officer, is expected to announce an architecture for microprocessors during a keynote speech on Aug. 23 at the Intel Developer Forum in San Francisco TSMC plans $7.5 billion superfab 8/11/2005 Taiwan Semiconductor Manufacturing Co. Ltd. has applied to build a next-generation 300-mm wafer fab in Taichung Samsung outputs more DDR2 than DDR for first time 8/11/2005 Samsung Electronics announced today that that it is leading the industry in shifting from DDR to DDR2 memory output. Hynix said to be increasing DRAM testing orders to Taiwan firms 8/11/2005 Taiwan-based testing houses will see a rebound in memory testing orders from Hynix Semiconductor starting this month UMC & Mosaid to joint develop DRAM controller IP 8/10/2005 United Microelectronics Corp. is working with Mosaid Technologies Inc. to develop Double Data Rate and DDR2 synchronous DRAM memory controller intellectual property core Samsung to lose Dell notebook contract 8/10/2005 Samsung Electronics will lose its only contract notebook client, Dell, next year, industry sources revealed yesterday. Nanya denies rumors it is in talks to buy Infineon's memory-chip division 8/10/2005 Nanya rejected market talk that it has been in discussions with Infineon for buying the latter's memory-chip division. Intel to use SIS chipset for entry level motherboards 8/10/2005 Intel may purchase entry-level chipsets from Silicon Integrated Systems (SiS) for its entry-level motherboards Chipset vendor sales up for July 8/9/2005 Silicon Integrated Systems (SiS), VIA Technologies and ULi Electronics – reported slight sequential growth in their July revenues Microsoft to update final Windows 2000 patch 8/9/2005 Microsoft is working to fix compatibility issues with a recently released update pack for Windows 2000. ProMOS claims 90nm production ahead of schedule 8/9/2005 ProMOS Technologies claims that solid support from Hynix Semiconductor has the company two months ahead of schedule on its 90nm wafer production roadmap. IBM launches 130-nanometer SiGe processes 8/8/2005 IBM has announced the availability a fourth generation of its silicon germanium foundry manufacturing process, which the company claimed provides twice the performance of the previous generation. Dell Ships 10 Million Product Units from China 8/8/2005 Dell Inc will celebrate this month the shipment of 10 million product units from its facility in Xiamen, China Intel and AMD planned major cut in CPU prices 8/8/2005 Intel clipped pricing on its highest-volume product this year, the Centrino mobile platform, by more than 30 percent in some instances ChipMOS to test flash memory 8/8/2005 ChipMOS Technologies is looking to expand its flash memory testing capacity as it negotiates orders with a leading flash memory maker. Philips put Taiwan sales under mainland China operation 8/5/2005 Philips Semiconductor has recently put its sales operation in Taiwan under its operation in mainland China after a restructuring it launched last month in its Asia-Pacific operation. TSMC to produce chipset for Xbox360 8/5/2005 Taiwan Semiconductor Manufacturing Co. (TSMC), received Microsoft's chipsets order to make north-bridge chips for its Xbox360 game consoles with 90-nm process, which some industry's experts said that Microsoft is largest customer of TSMC using the 90-nm process Philips to gross $600million on a complex deal selling TSMC stocks 8/5/2005 The sale is scheduled to close on Aug. 10 and Philips has priced its offer at $8.60 per American Depositary Share where each ADS represents five TSMC shares. Foundry competitors exchange sling shots 8/5/2005 TSMC: UMC's dealings with a mainland chip maker called Hejian Technology were "not right," UMC: “The remarks have constituted libel." Diversity, way for memory makers 8/5/2005 Suppliers are continuing to shift production to other types of memory, such as NAND flash, a move that would lessen their investment risk but complicate procurement for OEMs. IBM offers SiGe foundry service for hi speed customers 8/5/2005 IBM Corp. has announced the availability a fourth generation of its silicon germanium foundry manufacturing process, named 8HP, which the company claimed provides twice the performance of the previous generation. Infineon abandon Central Research idea 8/5/2005 Infineon said the move is needed to achieve closer connections between development and production. "This means that the R&D results will transfer quicker into marketable products," China to create giant companies by merger 8/4/2005 The merger comes as China’s policy makers struggle to reconcile free-wheeling capitalism with the legacy of state control. In many cases over the years, the central and provincial governments created and subsidized redundant companies that are surviving, in part, on continued government backing. Hoping to change that, Beijing is pushing for mergers in various industrial sectors. Docomo looking into overseas handset to diversify 3G service 8/4/2005 Docomo is seeking other overseas suppliers to expand the price range of its handsets. It agreed in June to jointly develop FOMA handsets with LG Electronics. They will support dual mode of W-CDMA and GSM/GPRS and also Docomo's i-mode service. Samsung and Denali to provide support for OneNAND memory 8/4/2005 Samsung’s OneNAND is a single-chip that includes a NOR Flash interface, NAND Flash controller logic, a NAND Flash Array and up to 5KBytes of internal Buffer-RAM, able to achieve up to 108MByytes/sec. of read performance.  742  |  743  |  744  |  745  |  746  |  747  |  748  |  749  |  750  |  751

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