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Computex to highlight Internet of Things 5/23/2016
Computex Taipei opens on Tuesday next week and runs through Saturday next week, but it is only open to the public on the last day.
Samsung announced 10nm 6GB LPDDR4 DRAM 5/23/2016
Manufactured on the 10nm architecture, these DRAM memory chips are going to boast better efficiency and are going to be powering up the next wave of smartphones and other tablets.
Rumor: MediaTek to spin off VR business next month 5/23/2016
MediaTek plans to spin off its virtual reality (VR) division to form an independent company in a bid to boost its VR business, according to a recent Chinese-language Economic Daily News
Applied Material sales jumped 5/23/2016
Machines that make flash memory, used as storage in phones and tablets, provided 49 percent of Applied’s total of $1.97 billion in chip equipment orders. That area is being boosted by the switch to chips called 3D Nand. Companies that manufacture smartphone displays also flooded Applied’s order books.
Microsoft sells feature phone line with Nokia name to Finland company 5/20/2016
Microsoft has finally reached an agreement to sell its entry-level feature phone business to FIH Mobile Ltd. and HMD Global,Oy for a meagre sum of $350 million.
Tim Cook to announce Apple software lab in India 5/20/2016
Cook's visit shows how important India has become for Apple and will likely set the stage for the expansion of Apple ecosystem in India.
French company integrated an optical MEM with silicon 5/20/2016
IRT Nanoelec in Grenoble has integrated a III-V/silicon laser and silicon Mach Zehnder modulator to transmit at 25Gbit/s down a single 10km optical fibre, claiming this to be a first.
3D NAND has limits 5/20/2016
3D NAND chips are 32- and 48-layer devices, but the technology will likely hit the ceiling at 128 layers in the 2018 timeframe. Vendors might stack three separate 48-layer 3D NAND devices, creating a 144-layer chip. Even with string stacking, though, 3D NAND could hit the wall at 300 layers.
IBM created a Tri-level PCM memory 5/19/2016
Three-bit PCM could be used as a faster tier of storage within arrays, including all-flash arrays, so the most-used data gets to applications faster. It could also take the place of a lot of the DRAM in systems, cutting the cost of technologies like in-memory databases.
Chinese company wants to buy Germany robot maker 5/19/2016
Industrial firms in China are looking to boost their automation levels to replace humans as the pool of workers shrinks and wages soar.
Vacuum company Dyson wants to be your electric car supplier also 5/19/2016
Dyson planned to invest $1 billion in a new battery plant in the wake of its $90 million purchase of Sakti3, an Ann Arbor-based company that developed new solid-state battery technology.
DuPont offers new packaging film to fight counterfeiting 5/19/2016
Company officials said that the new Izon 3D security film allows sophisticated anti-counterfeiting labels to be applied directly to product packaging atop text, bar codes or other images.
Breakthroughs shrink MRAM area by 30% 5/18/2016
Test chip show a 70% improvement in its memory bit yield compared to standard STT-MRAM. Its memory cell area is also reduced by 30%.
DRAM revenue dropped 16.6% in Q1 5/18/2016
DRAM industry posted US$8.56 billion in revenue in this first quarter, down 16.6% from the previous quarter. Market oversupply and sliding average selling price were the main culprits behind the revenue decline.
AMD introduced M400 series GPU 5/18/2016
The new series spans Radeon R9, Radeon R7, and Radeon R5-class processors sporting support for DirectX 12, the new Vulkan graphics API, OpenGL 4.4, and AMD’s own Mantle API that “speaks” to its GCN architecture.
IDC predicts a down semi market 5/18/2016
An economic pause in China and emerging markets, and a softening of the overall outlook in the US are key factors that will affect global semiconductor demand in 2016, says IDC.
Mobile DRAM taken over 40% DRAM market 5/17/2016
it is expected that mobile DRAM will continue to take up over 40% of the overall DRAM shipments throughout 2016, outpacing commodity and specialty DRAMs."
IC market dropped in Q1 5/17/2016
According to the latest report from IC Insight, eight of the top 10 semiconductor suppliers logged annual declines in 1Q16 sales compared with 1Q15, with several seeing sales fall by 25% or more.
Apple invested $1 billion in Chinese version Uber 5/17/2016
That cool billion is likely to buy Apple everything it needs to know about ride-sharing, an installed base of customers for its future robo-cars, and a stronger foothold, both political and economic, in China.
Taiwan regulators want closer look at proposed MediaTek/NavInfo JV 5/17/2016
The MOEA said that MediaTek will have to submit an application for the joint venture plan with the ministry's Investment Commission and the commission will form a special screening committee to review the proposal.
Foxconn to restructure Sharp display 5/16/2016
Foxconn's vow to turn around display maker Sharp comes with several caveats, including layoffs starting at the board level.
AMD named new chairman 5/16/2016
Advanced Micro Devices announced today that board member John Caldwell has been appointed chairman. Caldwell succeeds Bruce Claflin as chairman of the board.
LED light driver market to reach 4.5 billion units 5/16/2016
Shipments of power drivers and power supplies for LED lighting are expected to grow to 4.5 billion units in 2020, up from 1.4 billion units in 2015, IHS said.
Huang claimed Nvidia graphic is way ahead of competition 5/16/2016
“Our GPU architecture is just superior. We dedicated an enormous amount of effort to advancing our GPU architecture. The engineering of Nvidia is exquisite. Our craftsmanship is unrivaled anywhere.”
MediaTek has a pending merger announcement 5/13/2016
It’s not yet confirmed whether MediaTek is actually going to be picking up Intel’s mobile processor arm, but that is where the speculation is.
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