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| Nvidia announced mobile processor for autonomous cars |
8/24/2016 |
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The Drive PX 2 uses two Parker processors and two Pascal-based graphics processing units (GPUs) to power deep-learning applications for self-driving cars. Such cars have to be smart enough to recognize visual obstacles, such as bikers or pedestrians.
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| Samsung is setting up to refurbish smartphones |
8/23/2016 |
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The world's top smartphone maker will refurbish high-end phones returned to the company by users who signed up for one-year upgrade programs in markets such as South Korea and the United States. Samsung would then re-sell these phones at a lower price.
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| Cypress offer complete USB 3 power delivery interface solution |
8/23/2016 |
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USB PD 3.0 provides a number of key enhancements over the current version of the spec, USB PD 2.0 improving the robustness of power sources, sinks and cables. Cypress’s EZ-PD CCG3 and CCG4 USB-C port controllers are believed to be the first solutions to support the USB PD 3.0 specification from the USB Implementers Forum (USB-IF).
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| Renesas wants to buy Intersil |
8/23/2016 |
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Intersil makes chips essential to regulating power in such products as automobiles, industrial machinery and smartphones. It supplies automakers in the U.S., Europe and Asia, and more of its offerings are expected to find their way into electric cars and fuel cell vehicles.
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| China looks to buy Korean chip design technology |
8/23/2016 |
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Tsinghua is in talks to buy Korean fabless, or semiconductor, firms that design chips without production facilities, such as Silicon Mitus, Map and Zinitix, according to Chosun Biz.
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| Galaxy Note 7 pre-sale broke all record |
8/22/2016 |
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Judging from the successful pre-order of Galaxy Note 7, it’s estimated that the total shipments of the model will reach up to 18 million units by the end of 2016.
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| Mobile DRAM business is good |
8/22/2016 |
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Global sales of mobile DRAM increased 17.2% sequentially to US$3.93 billion in the second quarter of 2016. Rising smartphone shipments from China-based vendors including Huawei, Oppo and Vivo, as well as the overall bit supply, led to the revenue increase.
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| Altera Stratix 10 to sell under Intel label by year end |
8/22/2016 |
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Krzanich pledged to ship before the end of the year Altera’s flagship, the Stratix 10 FPGAs. It will wear the Intel brand and use both Intel’s 14nm process technology and be the first chip to use its embedded multi-die interconnect packaging technology.
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| DDR5, the next generation DRAM |
8/22/2016 |
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Specifications for DDR5 memory will be released this year, and deployment of the DRAM will begin in 2020, according to a slide deck presented at the Intel Developer Forum this week.
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| Merger on major wafer suppliers |
8/19/2016 |
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GlobalWafers Co. says greater market share can be achieved in the silicon-wafer market after the Taiwanese supplier to chipmakers agreed to buy SunEdison Semiconductor Ltd. for $683 million including debt, adding new customers and production facilities.
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| SK Hynix debutes UFS 2.1 memory |
8/19/2016 |
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It provides more than three times faster sequential read performance compared to that of the existing embedded Multi Media Card (eMMC) 5.1, reading and writing sequentially at 800 megabytes and 200 megabytes per second, respectively.
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| Samsung to spearhead UFS memory |
8/19/2016 |
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“As King Arthur subjugated the whole nation with the magical sword Excalibur, the Excalibur of a future mobile world will be none other than UFS.” said Cho Hee-chang, a senior research fellow at the Memory Business Division at Samsung Electronics.
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| Intel to foundary ARM processor |
8/18/2016 |
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Officials from Intel and ARM announced that Intel's chip foundry business will build chips for mobile and consumer devices based on ARM's architecture. The agreement will boost Intel's custom manufacturing business.
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| Apple to open R & D lab in China |
8/17/2016 |
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Apple has more than doubled its number of corporate sites in China to 45 since 2011, so the move may help it consolidate some of those facilities. Its spending on research and development has quadrupled in the same time frame.
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| 3D printing puts a lence on image sensor chip |
8/17/2016 |
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Timo Gissibl printed optical free form surfaces and miniature objectives directly onto CMOS image chips, creating an extremely compact sensor with integrated optics. The researchers hope that using such optics, smaller and lighter cameras could be designed for drones and robots.
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| Chemical sensor on a chip |
8/17/2016 |
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The Cornell researchers are using a new material — the titanium dioxide — in a design can make a sensor more sensitive and small enough to be used in the field.
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| Micron shows super fast storage with 3D Xpoint memory |
8/16/2016 |
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Micron (NASDAQ: MU) claimed its Quantx line delivers PCI Express (PCIe) SSD performance with read latencies at less than 10 microseconds and writes at less than 20 microseconds. That, the chipmaker asserted, is 10 times better than NAND flash-based SSDs.
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| Western Digital to get into 3D ReRAM |
8/16/2016 |
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While Western Digital didn’t reveal any fixed timeline for when these products will launch or their specifications, they have confirmed their decision to use SanDisk’s Resistive RAM technology alongside 3D manufacturing to create these special purpose SSDs.
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