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Semico now predicts slight contraction for semi industry 3/22/2016
The fundamental problem, according to Feldhan, is lack of a compelling driver to spur increased semiconductor consumption.
Intel might turn to AMD for graphic engine design 3/22/2016
Intel’s Nvidia deal is set to expire on March 17, 2017, and a recent report by Bloomberg claimed that Intel is now looking to cut a deal with AMD instead.
SanDisk to offer wireless memory stick 3/21/2016
The SanDisk Connect Wireless Stick features the SanDisk Connect app, which enables nearly effortless management of content between devices including iPhone, iPad, iPod, Android devices, Fire tablets, Mac and PCs — offered via password-protected Wi-Fi connectivity.
Samsung to reduce memory chip investment by half 3/21/2016
"We expect Samsung to cut its spending in dynamic random memory access (DRAM) chips by 51 percent this year from the $2.1 billion that it spent in 2015," said Amit Daryanani, an analyst at RBC Capital Markets.
Toshiba to sell medical unit to Canon 3/21/2016
Both companies said Thursday the deal has been completed. Canon has been eager to expand its medical equipment business.
Auto makers to make emergency self-braking standard 3/21/2016
Nearly all light-duty cars and trucks 8,500 pounds or less will include the systems by 2022, while virtually all larger trucks will be equipped by 2025.
Lenovo is agressive in expansion 3/18/2016
With a research and development budget north of $1.2 billion this year, Lenovo is determined to deliver results across its broad portfolio from mobility to enterprise, and even PC.
Can 3D XPoint memory replace DRAM and NAND? 3/18/2016
Analysts say, 3D XPoint will probably have to coexist with, rather than replace, DRAM and flash memory.
Toshiba to build new factory for 3D NAND Flash 3/18/2016
The company is investing in the plant, which will make its proprietary 3D flash chips, over a period of three years till March 2019. Toshiba expects output to begin no earlier than 2018.
Acura to produce NSX Super car in U.S. 3/18/2016
The 2017 NSX starts at $156,000 and features a 3.5-liter twin-turbocharged V-6 engine with 573 horsepower that is hand-built in nearby Anna, Ohio.
WD shareholders approved SanDisk merger 3/17/2016
Western Digital shareholders voted to issue new stock to finance the acquisition. The transaction is expected to close in the second quarter of this year.
VR headset sale to millions by next year 3/17/2016
Gartner is projecting VR headset shipments to reach 1.4 million this year, growing from 140,000 in 2015. Shipments will grow to 6.3 million by 2017.
Japanese companies joint hands to develop hydrogen fuel 3/17/2016
Toyota on Monday announced details of the public-private partnership with Toshiba Corp. and Iwatani Corp. and the governments of Yokohama, Kawasaki and Kanagawa Prefecture.
Most of Google Search are encrypted 3/17/2016
Encryption shields 77 percent of the requests sent from around the world to Google's data centers, up from 52 percent at the end of 2013, according to company statistics released Tuesday.
AMD roadmap shows advanced GPU with HBM2 memory 3/16/2016
Following the launch of its Polaris GPU this year, the company will release its Vega GPU family, using HBM2 memory.
U.S. regulators approved Microchip acquisition of Atmel 3/16/2016
Microchip (Chandler, Ariz.) said the U.S. Federal Trade Commission cleared the transaction on March 11 and that the German Federal Cartel Office cleared it on Feb. 26. The Korea Fair Trade Commission (KFTC) is the only agency still reviewing the deal from an anti-trust perspective.
Manufacturing Technology orders down 30 percent 3/16/2016
“Despite today’s soft market, the mood from the 400+ manufacturing technology suppliers and buyers that attended the recent MFG meeting was upbeat, as were the forecasts.”
What is up with Virtual Reality? 3/16/2016
Oculus and HTC both said initial orders for the Rift and Vive systems sold out within minutes. A consumer edition of the lower-powered Samsung Gear VR, a mobile Oculus headset that works with Samsung smartphones, sold out when it was first released last year.
WD continue to persue SanDisk by offering debt package 3/15/2016
"The combined company will be ideally positioned to capture the growth opportunities created by the rapidly evolving storage industry."
SMIC license ReRAM technology from Crossbar 3/15/2016
The deal will enable customers of Semiconductor Manufacturing International Corp. (SMIC) to integrate non-volatile ReRAM blocks based on its 40nm CMOS manufacturing process into microcontrollers and SoCs aimed at a wide swatch of markets.
Rumors that Intel chips might replace Qualcomm on iPhones 3/15/2016
Morgan Stanley, Cowen & Co. and Credit Suisse this week all noted signs that production of a new Intel chip is gearing up ahead of the expected iPhone 7 launch this fall.
DARPA working on new chip cooling technology 3/15/2016
The goal is to enhance the performance of RF MMIC power amplifiers and embedded high performance computing systems through chip-level heat removal techniques. Basically, they’re developing a way to cool high-powered microchips from the inside using microscopic drops of water.
3D XPoint memory to be in MacBooks 3/14/2016
Optane is a brand name for a new type of memory and SSD based on 3D Xpoint, a technology jointly developed by Intel and Micron that can be 10 times denser than DRAM, and 1,000 times faster and more durable than flash storage.
HP Enterprise unveils 3PAR storage systems 3/14/2016
HPE revealed that the maximum Flash storage capacity available on 3PAR storage arrays is now 21 petabytes.
DARPA to develope vertical takeoff unpiloted aircraft 3/14/2016
The goal is to build a demonstrator aircraft that can reach a top sustained speed of 300 to 400 knots and carry cargo loads of at least 40 percent of the plane's expected 10,000- to 12,000-pound gross weight.
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