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| Samsung put 10nm into production |
10/18/2016 |
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The so-called 10LPE process uses triple-patterning lithography to deliver up to a 30% area shrink, 27% higher performance or 40% lower power than its 14nm process.
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| Surface Pro 5 to challenge Apple MacBook |
10/17/2016 |
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It is common knowledge that the only area where Apple would have beaten other subsequent Utrabooks and tablets in 2017 would have been on the display. Come to think of it, if Microsoft will feature a similar display as the latest MacBook Pro's, in their Surface Pro 5, a stronger processor and probably a lighter build than Mac, then we know that Microsoft has completely nailed Apple on this one.
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| PC market continue to slide |
10/17/2016 |
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The PC shipments for the third quarter stood at 68.9 million units—a 5.7% drop compared to the same period in 2015. Gartner analysts said this marked the eighth consecutive quarter of PC shipment decline.
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| 48V system improves car efficiency |
10/17/2016 |
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A well-balanced design can actually reduce fuel consumption—this is the overarching claim of the masterminds of the 48V technology.
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| Root problem on Note 7 uncovered? |
10/17/2016 |
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“Problems with the phone appeared to have arisen from tweaks to the processor to speed up the rate at which the phone could be charged.”
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| Ambitious startup wants to embed DRAM with server processor |
10/14/2016 |
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Placing hundreds or thousands of processing elements in DRAM able to perform work for a controlling server CPU could have a revolutionary impact on how data centers are designed. Simulation results have shown a performance increase of factors of 10 to 25 compared with traditional server architectures.
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| JEDEC established reliability work group in China |
10/14/2016 |
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At its first meeting, hosted by Huawei in Shenzhen on March 18, 2016, approximately 40 participants from major semiconductor and ICT manufacturers were in attendance, including: Haier, Gree, TCL, SMIC, the China Electronic Product Reliability and Environmental Testing Research Institute, and The Computing Institute of the China Academy of Sciences.
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| Wafer shipment broke record |
10/14/2016 |
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Total wafer shipments this year are expected to exceed the market high set in 2015 and are forecast to continue shipping at record levels in 2017 and 2018.
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| Kingston strive amid overall DRAM module market drop |
10/14/2016 |
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Kingston Technology continued to dominate the DRAM module market in 2015 with a 68.36% share, DRAMeXchange indicated. Despite falling prices for PC DRAM, Kingston managed to grow its DRAM module revenues by 3.85% in 2015.
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| A better DRAM technology with no material changes |
10/13/2016 |
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VLT eliminates the need for DRAM refresh, is compatible with existing process technologies and offers significant other benefits including lower power, better area efficiency and compatibility.
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| Metal working machinery order increased |
10/13/2016 |
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Much of the growth came from smaller contract machining shops, a sign of greater activity and capacity constraints in larger industries. Automotive and aerospace also made gains after some faltering.
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| Flash prices to bounce back in Q4 |
10/12/2016 |
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Supply shortage that persisted in the NAND Flash market during the third quarter will become more acute in the fourth quarter due to surging demand from clients in the smartphone and SSD industries.
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| Micron agreed to close Inotera purchase |
10/12/2016 |
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Micron Technology Inc yesterday agreed to close the NT$132.5 billion (US$4.19 billion) buyout of its Taiwanese DRAM manufacturing arm in early December, ending months-long speculation about a potential collapse of the deal.
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| Testing machine learning in self-driving car is a challenge |
10/12/2016 |
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The biggest hole in a federal automated policy published late September is in the regulators¡¯ failure to tangle head-on with fundamental difficulties in testing machine learning¡ªa problem already known to the scientific/engineering community.
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| Samsung marching onto 64 layers 3D NAND |
10/12/2016 |
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Samsung wants to move on as quickly as possible from 48-layer NAND to 64-layer NAND to keep a step ahead of second-ranked Toshiba, which plans to begin mass production of the chips in the first half of 2017.
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| Semi Industry put 450mm on back burner |
10/11/2016 |
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By the end of 2020 there are expected to be 22 more fabs in operation, bringing the total number of 300mm fabs used for IC fabrication to 117.
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| IBM created 7nm transistor |
10/11/2016 |
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That allows for faster computer chips to be used in future devices, and that's important because more computer power usually leads to other technological breakthroughs.
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| Samsung suspend Note 7 production |
10/11/2016 |
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Fires in phones that were meant to replace devices that had been recalled, suggesting it had failed to fix a problem that has already hurt its brand and threatens to derail a recovery in its mobile business.
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| China rushing to fill gaps on flash memory |
10/10/2016 |
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China' National Semiconductor Industry Investment Fund have encouraged a spurt of growth. XMC, for example, has broken ground on one of the largest fabs, due to come on-stream in early 2018 and targeting 3D NAND production with 300mm wafers.
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| Qualcomm/NXP merger talk get closer |
10/10/2016 |
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There is currently a valuation gap of less than 10 percent between Qualcomm and NXP as they discuss a possible transaction. Qualcomm is considering a deal structure of 75 percent cash and 25 percent stock. NXP would prefer all cash, another person said.
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