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| Cisco urge industry to support new IEEE IP policy |
4/7/2015 |
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A RAND licensing commitment should also mean that a patent-owner gets a royalty based on the value its patent adds to a standard, not the value of the entire standard. That’s what the updated IEEE policy does.
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| Chinese are buying up U.S. chip firms |
4/7/2015 |
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China's sweeping plans have American semiconductor makers wondering how they'll fit in. "Clearly their ambition is to transition from being a technology follower to a leader,"
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| 3D scan camera chip takes smartphone to another level |
4/7/2015 |
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The device works by shining beams of light, which are perfectly aligned, on a targeted object. It then detects subtle differences in the light that is reflected back from that object. The differences help it build a digital 3D image of the target.
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| Novatek advances position in STN driver IC |
4/6/2015 |
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Novatek Microelectronics, which specializes in the design of LCD driver ICs, has moved forward its TV SoC business by obtaining new orders from Japan- and Korea-based TV brands, according to industry sources.
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| Analysts flagged risk in TSMC stock |
4/6/2015 |
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Some analysts have downgraded the stock, warning that its sales of chips for smartphones might lag forecasts as demand for mobile devices softens. Pacific Crest Securities in March downgraded the stock to underperform from sector perform, saying some of its top customers suffer from bulging inventories.
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| MediaTek formed partnership to develop a wireless standard |
4/6/2015 |
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The company demonstrates a few examples to tease the imagination. A smartphone controlling the large display of a TV. A TV mounting a smartphone camera, making it a remote baby monitor. A TV turning a smartphone touch panel into a remote control for the TV. A smart television mounting the microphone of a smartphone to enable a voice search on the Internet for images.
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| Google selected Samsung 3D NAND SSD |
4/3/2015 |
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"The agreement calls for Samsung to supply 3D NAND SSD products for Google datacenters." The exact value of the deal is unknown, but the executive said the worth is "sizeable."
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| China's intention to merge ISSI |
4/3/2015 |
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It is a long-term goal as well as established policy of the China government to step into the memory industry, it has adopted a strategy to approach non-mainstream players to gradually build up its capabilities.
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| AMD face security fraud lawsuit |
4/3/2015 |
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The lawsuit filed last year accused Advanced Micro of artificially inflating the company's share price by making false statements about the so-called Llano, which it had touted as "the most impressive processor in history."
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| Broadcom say that NFC is an entry point into IoT |
4/3/2015 |
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Mobile and e-commerce are the most obvious use cases on the surface as Broadcom is touting support for near-field communications (NFC) technology as well as EMV (a.k.a. chip and pin) smartcard and magstripe (MSR) readers.
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| Power Chip to provide the ultimate IoT SOC |
4/2/2015 |
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Powerchip Technology is developing a system-on-a-chip device, combining ARM processor cores and embedded flash memory, for Internet of Things applications. This so-called "iRAM" chip will have Bluetooth, near-field communication and Wi-Fi connectivity, according to industry sources.
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| Adesto announced serial flash for IoT applications |
4/2/2015 |
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Adesto's high temperature serial flash products, available in 512Kb to 16Mb densities are designed to operate between -40°C to 125°C while retaining core competencies such as wide voltage range and ultra-low power operation.
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| Philippine sets target on Free WiFi access |
4/1/2015 |
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"Notwithstanding the issue of the mass accessibility and availability of personal electronic devices that people have to use in order to access public networks, the government has to recognise that the Internet is an important mechanism in delivering some of its services, and a valuable tool for people's participation in governance and in democracy."
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| IBM sets aside $3 Billion for IoT division |
4/1/2015 |
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IBM is training more than 2,000 consultants, researchers and developers to help businesses come up with new ways to use the vast amounts of data that are now available, said Glenn Finch, Big Data and Analytics Lead at IBM Global Business Services.
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| Surface 3 abandoning ARM processor |
4/1/2015 |
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Microsoft is abandoning ARM processors and Windows RT in order to bring the full version of Windows 8.1 to its Surface 3 with an Intel Atom chip.
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| Inotera predicts DRAM prices stability during 2015 |
3/31/2015 |
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¡°In the first quarter, DRAM chip prices dropped deeper than we expected,¡± Inotera chairman Charles Kau (¸ß†¢È«) said, blaming weaker-than-expected demand for PCs. However, prices are expected to start to rebound next quarter and remain stable in the second half of the year.
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| Intel to buy FPGA giant Altera |
3/31/2015 |
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Intel Corp. is already in talks to acquire rival Altera Corp., the Wall Street Journal reported Friday. The move is said to bolster Intel's product line with a focus on Internet-connected devices.
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| U of Maryland studies drone flying routes |
3/31/2015 |
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The work combines the use of big data, historical data and various sources of satellite imaging started during the Iraq and Afghanistan wars when he would try to predict the risks of road-side improvised explosive devices (IEDs) and then send out surveillance drones to check the hot spots that his algorithms would yield.
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| A "smart" business district in Shanghai |
3/31/2015 |
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The long-term, comprehensive agreement will see NXP supply B.M. Holdings with the latest Internet of Things (IoT) technology. When construction completes on the new business district in 2017, it will represent a landmark complex that will help drive local economic development.
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| Toshiba announced devlopment of densest 3D NAND |
3/30/2015 |
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Using a 48-layer NAND flash allows Toshiba to revert to larger NAND process technologies. The company had scaled its 2D NAND down to 15 nanometers (nm), but it was bumping up against a wall in terms of further size reduction because as NAND transistor size shrinks, electrons tend to leak, causing data errors.
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| Intel/Micron predicts triple growth with 3D NAND |
3/30/2015 |
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By stacking the NAND they can greatly increase the capacity. The new 3D NAND technology stacks flash cells vertically in 32 layers to achieve a 256Gbit multilevel cell (MLC) and 384Gbit triple-level cell (TLC) die. This approach will yield greater efficiency and lower the cost too.
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