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| FPGA designs into volume automotive applications |
6/27/2013 |
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With the proliferation of imaging sensors in cars, which is now moving to mid-range volume models, Lattice sees an opportunity to design in its FPGAs for image processing and interface control.
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| Nano material to scale NAND beyond 20nm |
6/27/2013 |
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Using a 25nm thick stack (10-5-10) with an amorphous Al2O3 middle layer Imec produced a large improvement over single Al2O3 dielectric layer. Retention tests showed little loss of charge at temperatures of 125°C.
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| Toshiba to expand NAND production |
6/26/2013 |
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With Toshiba's existing chip facilities now running at full capacity, the company may spend some of a 38 percent hike in its capex budget this year on extending a facto.
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| WD to buy Stec at $340M |
6/26/2013 |
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Western Digital agreed to pay $6.85 a share for STec, a 91 percent premium over the latter’s closing price on June 21, the companies said in statement.
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| SK Hynix signed up with major OEM to produce ReRAM |
6/25/2013 |
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The Icheon, South Korea-based company teamed with U.S. computer makers to develop resistive random access memory, or ReRam, which may replace the flash memory used in smartphones and tablet computers.
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| Microsoft to give heavy discount to schools |
6/24/2013 |
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The deal, which is expected to be officially announced shortly, will apply to educational institutions. It will apply in 25 countries, including in Australia, according to the leaked material.
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| Challenges mounted on scaling cache memories |
6/24/2013 |
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To address the SRAM scaling problem, chipmakers face some tough process and design choices. On the process front, there are various tradeoffs between planar transistors and finFETs. It gets more complicated when choosing between the two technology platforms—bulk CMOS and fully-depleted silicon-on-insulator (FD-SOI).
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| Intel to discontinue some SSD drives |
6/24/2013 |
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Intel intends to discontinue 313, 320, 520, 525 and 710-series solid-state drives of all capacities. Customers should place last orders on the SSDs in late September – mid-October, 2013.
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| SMIC has a new director |
6/21/2013 |
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Maloney spent over 30 years at Intel and rose up through the ranks to become general manager of the Intel Architecture Group and be tipped as a likely successor to Paul Ottelini as CEO.
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| NAND prices to continue its climb |
6/21/2013 |
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In the report, DRAMeXchange, a memory chip research division of Taipei-based TrendForce Corp., pointed out that NAND flash prices showed signs of rising in the first half of June due to limited supply during the inventory restocking period.
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| Rumour: Huawei wants to swallow Nokia |
6/20/2013 |
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Folding Nokia into Huawei, which has quickly become the world's fourth-largest maker of smartphones, has some logic. Combining Nokia's know-how in hardware design and its relationships with wireless operators with a low-cost player like Huawei could be powerful.
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| Freescale's muiltcore processor pushes into avionics |
6/20/2013 |
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Freescale collaborates closely with avionics manufacturers to facilitate certification of systems using multicore processors. “We have formed a working group with top commercial avionics manufacturers to define their requirements for advanced multicore processors being used in commercial avionics applications,”
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