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ProMos reveal plans to build 25,000 wafers by the end of 2010. 10/7/2010 ProMOS Technology has revealed that plans to scale up its monthly output using 63nm process technology to 35,000 wafer starts will not be carried out until 2011. Taiwan DRAM makers report September revenue drop 10/6/2010 Powerchip Technology and ProMOS Technologies saw their revenues drop on month in September 2010. Fujitsu predicts to ship 5 Million notebooks in 2010 10/6/2010 Japan-based Fujitsu expects to ship five million notebooks in 2010 and aims to increase shipments to 10 million units in 2012, according to Fujitsu Taiwan. A-Data see revenue up by 2% 10/6/2010 Memory module maker Adata Technology has reported revenues of NT$3.45 billion (US$112 million) for September 2010, up 1.7% on month but down 15.5% on year. Inotera revenues by 10% on September Sale 10/5/2010 Inotera Memories saw revenues grow over 10% sequentially in September 2010, buoyed by the ramp-up of 50nm technology, according to the DRAM maker. SanDisk unveils iSSD for Tablet PC and Notebook 10/5/2010 SanDisk's integrated solid-state drive (iSSD), designed for use in mobile computing platforms such as tablet PCs and ultra-thin notebooks, is available for sampling to OEMs ChipMos to build 12-inch gold bumping Fab 10/5/2010 Packaging and testing house ChipMOS Technologies has unveil plans to add a new, 12-inch gold bumping production line in Taiwan with the installation set to complete by the end of 2010. Toshiba launch new 3D TV sets 10/4/2010 Toshiba has launched the first 3D television sets that do not require special glasses. Lenovo predicts highest Notebook shipment growth in 2011 10/4/2010 Lenovo has seen its notebooks occupy more than 30% of total notebook sales in the China market in 2010 and will maintain the leading status in 2011. 3D notebook shipments to reach 200,000 units in 2010 10/4/2010 Global sales of 3D notebooks in 2010 are expected to reach only 150,000-200,000 units, according to sources from Taiwan-based makers. Taiwan goverment approved TSMC China Fab 10/1/2010 An application by Taiwan Semiconductor Manufacturing Company (TSMC) to fabricate on 0.13-micron technology at its Songjiang 8-inch fab in Shanghai was approved by the Investment Commission of Taiwan's Ministry of Economic Affairs (MOEA) on September 29, 2010. AMD to launch Radeon card in October 2010 10/1/2010 AMD will launch its latest generation Radeon HD 6000-series GPU globally on October 19. Samsung to develop Flash storage interface format 10/1/2010 Samsung is developing its own Universal Flash Storage (UFS) interface standard in the first half of 2011, in a move to standardize a command set required to be supported by all embedded and removable memory card interfaces. TSMC sets another sales record for September 2010 9/30/2010 Taiwan Semiconductor Manufacturing Company (TSMC) is expected to set another sales record for September 2010 Gigabyte shipped 5 Million Motherboards in September 2010 9/30/2010 Gigabyte Technology has revealed that its shipments of motherboards increase substantially in September which will bring total motherboard shipments for the third quarter of 2010 to at least 5.2 million units. Foxconn building new handset plant in Northern China 9/29/2010 Foxconn has started construction of a handset-assembly plant in a 138-square kilometer business park surrounding the international airport in Zhengzhou City, northern China Elpida unveil 2Gb DDR3 chip using 30nm process 9/29/2010 Elpida Memory has completed development of a 30nm-class 2Gb DDR3 SDRAM for PCs and consumer electronics products, with sample shipments slated for December 2010 Nanya rolls out 512MB Mobile Ram to key customers 9/29/2010 Nanya Technology has delivered mobile RAM chips to clients for verification with volume production slated for the first quarter of 2011 Gigabyte unveils notebooks with rotatable touch-panel display 9/28/2010 Gigabyte Technology on September 28 will introduce the T1125 11.6-inch notebook, which reportedly will come equipped with a rotatable touch-panel display and docking station AMD to delay Radeon HD 6000 GPU 9/28/2010 AMD has recently postponed the launch schedule of its next-generation Radeon HD 6000 series GPUs from the original October 12 to November 2010. HTC predict to ship 7-8 Million phones for third quarter 2010 9/28/2010 Taiwan-based vendor HTC will ship an estimated 7-8 million smartphones in the third quarter of 2010 TSMC to expand China 8-inch Fab 9/27/2010 Taiwan Semiconductor Manufacturing Company (TSMC) is ramping up the monthly capacity at its Songjiang 8-inch fab in Shanghai to 50,000 wafers by the end of 2010 Elpida to build R&D center in Taiwan 9/27/2010 Elpida Memory reportedly plans to invest about US$95.5 million to set up an R&D center in Taiwan Samsung rolls out 8G DDR3 SODIMM module 9/27/2010 Samsung has announced it already began mass production of an 8GB So-DIMM, or unbuffered DIMM (UDIMM), for notebooks and mobile workstations Component prices set to ease 9/24/2010 After more than a year of increases, prices for discrete components are set to begin to decline in the first quarter of 2011 as demand softens during the seasonally slow period.  532  |  533  |  534  |  535  |  536  |  537  |  538  |  539  |  540  |  541

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