Home
News
Products
Corporate
Contact
 
Wednesday, March 5, 2025

News
Industry News
Publications
CST News
Help/Support
Software
Tester FAQs
Industry News
Samsung OneNand Flash to be with Qualcomm chipset 12/21/2006
Samsung Electronics OneNAND flash memory will be supported in new Qualcomm Mobile Station Modem (MSM) chip sets, the company said.
Siemens set new record on network speed 12/21/2006
Germany's Siemens AG has set a new speed record for electrical processing of data through a fiber-optic cable, it said on Wednesday, opening the possibility of cheaper Internet and data networks.
Gartner forecast Capex up to stay flat in 2007 12/20/2006
Gartner Inc. predicted that capital equipment spending will be $56.6 billion in 2007, up only 1 percent compare to 2006, but it will rebound and grow by 16.1 percent to $65.7 billion in 2008.
AMD to use lead free wafer bumping technology 12/20/2006
AMD has entered into an agreement to license Amkor Technology Inc.'s lead free (Pb-free) electroplated wafer bumping technology.
South Korea to invest $3.71 billion in IT 12/20/2006
South Korea government plans to invest 3.41 trillion won ($3.71 billion) in public IT projects during 2007.
Ericsson to buy Redback Network 12/20/2006
Ericsson will buy data networking equipment vendor Redback for $2.1 billion in cash, the companies said.
Circuit City posted loss 12/19/2006
No. 2 electronics retailer Circuit City posted a surprise third-quarter loss versus expectations for a profit, saying that its results in the important holiday quarter were hurt by the price war that Wal-Mart ignited, especially in the flat-panel television category.
China destination for used semi gears 12/19/2006
By the year 2009, the China market for used semiconductor equipment will hit $800 million, as more foreign companies decide to move their legacy gear to the country, according to an analyst from Semiconductor Equipment and Materials International.
Sharp mass produce blue laser diodes 12/19/2006
Sharp said it has started the commercial production of blue laser diodes, taking aim at a market with strong growth potential.
Taiwanese DRAM makers gave bullish outlook 12/19/2006
PowerChip Semiconductor Corp. of Taiwan and Japan's Elpida Memory Inc. last week announced a joint venture to build what the companies billed as the world's largest memory fab in the Central Taiwan Science Park.
Hynix released 60nm DDR2 chips 12/18/2006
Hynix Semiconductor unveiled high capacity modules based on its 60nm 1Gbit DDR2 DRAM chips. This new memory is aimed for high performance graphic and mobile markets.
Matsushita to mass-produce heat-proof batteries 12/18/2006
Matsushita Electric Industrial said on Monday it aims to mass-produce spark-resistant batteries.
BenQ closed Beijing R&D center 12/18/2006
BenQ Corp. will close its cell phone R&D center in Beijing that will result in laying off of about 400 engineers.
Super Micro to go public 12/18/2006
Super Micro has filed initial public offering papers with the U.S. Securities and Exchange Commission.
Work group to set battery safety standards 12/15/2006
Updated safety standards for laptop batteries should be in place within the next 12 months, a working group of computer firms has said.
Mears say it can go to 22nm channel 12/15/2006
"Our technology can be added to strained silicon, SOI or even bulk CMOS, and the other technologies can fit right alongside ours over the next five or ten years as they become ready for production."
Gartner predicts DRAM market to wind down 12/15/2006
Gartner expects growth to slow significantly to 15 percent in 2007, when DRAM is expected to enter into oversupply conditions during the first half of the year. Gartner does expect the second half of next year to be a period of undersupply, however. The firm projects DRAM revenue to peak in 2008, before beginning to decline in 2009.
TwinMOS introduced overclocker DDR2 DIMMs 12/14/2006
TwinMOS Technologies introduced the brand new TwiSTER DDR2-850 CL5 over-clocking DRAM modules after previously announced TwiSTER DDR2-800 CL5 and TwiSTER DDR2-1066 CL5 last month. So the 3 kinds of overclocking modules make TwiSTER series are specially designed to meet the demanding hardware requirements of over-clockers, advanced game players, and enterprise users.
Are Nanotubes ready for production? 12/14/2006
Applications include low-resistance nanowires in integrated circuits, semiconductor nanotubes for fabricating high performance transistors, micro-miniature heatsinks, ultra-tough polymer composites, gas sensors and light sources for flat panel displays.
Atmel move towards fabless 12/14/2006
Atmel will seek to sell its wafer fabrication facilities in North Tyneside, U.K. and Heilbronn, Germany. Through a combination of voluntary resignations, attrition and other actions, Atmel expects a reduction in its non-manufacturing workforce of approximately 300 employees, and anticipates manufacturing headcount to be reduced by approximately 1,000.
AMD commits to fusion chips 12/14/2006
With Microsoft Corp.'s release of its Vista operating system, computer users will see "the biggest change in a 3-D graphics-rich environment," The OS will, in turn, create a host of new 3-D applications that demand "increased performance-at-watt-per-dollar processors,"
SMIC delays project due to lack of fund 12/14/2006
Local media reported that the scale of the Chengdu project was being reduced, with used equipment being substituted for new equipment. Reports also claimed that SMIC was pushing out the schedule for its new 300-mm wafer fab in Shanghai because of a lack of funds.
Micron strengthens image sensor: acquired Avago division 12/13/2006
The move complements Micron’s existing presence in the CMOS image sensors market, giving the company an additional 2.5 percent stake.
Samsung to provide Low Power DRAM for Mobile applications 12/13/2006
Samsung said it expects OneDRAM to be introduced in handsets by the second half of 2007.
Microsoft drives for Robot standard 12/13/2006
Tandy Trower, who helped launch the first versions of Windows, said Microsoft hopes it can spawn a host of applications for robots as it did for PCs.
 673  |  674  |  675  |  676  |  677  |  678  |  679  |  680  |  681  |  682 

CST Inc. Memory Tester DDR Tester
Copyright © 1994 - 2023 CST, Inc. All Rights Reserved