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Avago to acquire Infineon's fiber optic business 4/2/2007 Infineon is selling its Polymer Optic Fiber (POF) business, based in Regensburg, Germany, to Avago Technologies, the former semiconductor arm of Agilient Technologies Inc. Transmeta trims headcount 4/2/2007 Trasmeta further reduce its headcount last month by an additional 55 employees after announcing a 75-person layoff in February, the company said. And there may be more to come. Hynix hired ex-government official for CEO 4/2/2007 Hynix board of directors has appointed Dr. Jong-Kap Kim as the company’s new chairman and CEO. Europe chip sales showed modest decline 4/2/2007 Europe was one of the better performing sectors for sales of semiconductors in February, according to the Semiconductor Industry Association (SIA), while the Americas region suffered the largest decline. Taiwan company introduce Dual Channel Nand Flash Controller 3/30/2007 Phison Electronics announced that it will introduce a dual-channel controller IC for volume production in April. Hynix to build 12-inch Nand Flash Fab 3/30/2007 Hynix has signed a land contract at Chongju, North Chungchong Province of South Korea for the construction of a 12-inch fab for NAND flash production. AMD announces availability of AMD M690 chipset 3/30/2007 AMD announced the availability of its M690 chipset for its Turion64 X2 dual-core mobile CPUs. TSMC announces 55nm process technology readiness 3/29/2007 TSMC unveiled its half-node 55nm process technology, a 90% linear-shrink process from 65nm including I/O and analog circuits with initial production starting this quarter. Intel to launch new "Penryn" processor 3/29/2007 Intel will begin producing its next-generation "Penryn" processors by the end of 2007 SIS ink chipset license for Intel Quad Core processor 3/29/2007 Silicon Integrated Systems (SiS) announced today that it has signed a long-term licensing contract with Intel for the manufacture and sale of chipsets for the Intel Core 2 Quad processor with 1333MHz front side bus. Intel CEO to visit Taiwan 3/29/2007 Intel - CEO Paul Otellini is scheduled to visit Taiwan on March 29 to meet with the company's partners. Samsung to raise price on 8-Gigabyte Flash chip 3/28/2007 Prices for 8Gb NAND flash parts from Samsung Electronics and Hynix may increase to US$9 due to insufficient capacity. Transcend to expand manufacturing plant in China 3/28/2007 Taiwan memory-module maker Transcend Information plans to add additional production lines and begin construction of a new fab in the second half of 2007. Samsung develop 8-GB chip for Mobile Handsets 3/28/2007 Samsung Electronics said it has developed the industry's first eight-gigabyte flash memory card for mobile handsets. HP slap Acer with Patent Infringement lawsuit 3/28/2007 Hewlett-Packard sued Acer in a US court on Tuesday alleging the Taiwan-based computer maker with unauthorised use of its patented technology. Kingston to invest in chip packaging and testing company 3/27/2007 Kingston Technology may invest in packaging and testing house Orient Semiconductor Electronics through a private placement in order to strengthen their strategic partnership. Foxconn to acquire taiwanese memory module company 3/27/2007 Foxconn Electronics said it is interested in consolidating with second-tier memory module makers with Pan Ram International and Unifosa both named as potential candidates. Acer adds AMD Rev-F CPU to Blade Server 3/27/2007 Acer plans to add blade servers and AMD Rev F Opteron-based servers to its x86 server line-up IBM unveils super fast chips 3/27/2007 IBM said it has developed a chip capable of transmitting an entire DVD movie in a second, a breakthrough that could make PC faster. Micron & Qimonda samples DDR3 Memory 3/26/2007 Qimonda and Micron Technology have delivered samples of next-generation DDR3 DRAM ahead of Samsung Electronics. Intotera Memories opens 2nd Taiwan Fab 3/26/2007 Inotera Memories announced today the opening of its second 12-inch fab in Taoyuan, Taiwan. Intel to build China 12-inch Fab 3/26/2007 Intel announced plans to build a 12-inch wafer fabrication plant in China Winbond to dispose 8 inch fab to Vanguard 3/23/2007 No fund raising activities would be required for the acquisition as Vanguard is cash-rich, with the equivalent of NT$12.19 billion on the books as of the last quarter, the company said. Micron opens Xi-an assembly 3/23/2007 Micron Technology Inc. opened a new manufacturing facility in Xi’an, China this week, the company’s first such facility in the country, designed to assemble and test Micron’s semiconductor products, including dynamic random access memory, NAND flash memory and CMOS image sensors. AMD employs Chartered on 65nm 3/23/2007 An AMD spokesperson told press that it is currently in full production with Chartered at 90-nm and is in the midst of a transition to 65-nm.  674  |  675  |  676  |  677  |  678  |  679  |  680  |  681  |  682  |  683

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