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Intel to cut prices on 915 chipsets 11/3/2004 Intel is said to plan to cut prices for its 915 chipsets family on December 26 in a move to boost sales, according to sources at Taiwan motherboard makers. Micron said it will not get fine 11/3/2004 Micron Technology said it is not expecting a fine following Infineon' fine in September for DRAM price-fixing. Acer projects 30% growth in 2005 11/3/2004 Acer said it expects its global revenue to increase by 30 percent to 40 percent in 2005. Research firm cut 2005 chip growth rate 11/2/2004 World Semiconductor Trade Statistics, or WSTS, slashed its 2005 growth forecast on chips to 1.2 percent from the previously forecast of 8.5 percent. The expected growth for 2004 is 28.5 precent. National Semi lowers its guidance 11/2/2004 National Semiconductor lowered its revenue guidance for its fiscal Q2 to range from $445 million to $450 million, down about 18 percent to 19 percent sequentially. Oracle set final Peoplesoft bid at $24 a share 11/2/2004 Oracle up its all-cash bid for Peoplesoft to $24 a share, valued at $8.8 billion. The company said this is its "best and final offer", and would drop the bid if the offer would be rejected by midnight Nov. 19. Nokia unveil 3 more new phones 11/2/2004 Nokia unveiled three new camera phones at a company event on Tuesday, including the 7710 media device, a semi-oval phone with a touch screen and designed for television and video, the 3230 smartphone with a megapixel camera, and the 6020 camera phone. AOL to cut 700 jobs 11/2/2004 In a move to cut cost, America Online plans to trim more than 700 jobs early next month, a newspaper reported Tuesday. OKi setup China design center 11/1/2004 Oki Electric has set up a design center subsidiary in China to focus on designing communication application chips. Winbond to increase DRAM shipment to Infineon 11/1/2004 Winbond to double DRAM shipment to Infineon in 4th quarter. Qualcomm to build nation wide high-speed wireless network 11/1/2004 Qualcomm said it will build a national high-speed wireless network for video services through its subsidiary, MediaFlo USA Inc.. The funding needed is about $800 million, to be raised by Qualcomm and other parties. Intel to release faster version of P4 11/1/2004 Intel is expected to release a faster version of its powerful but expensive Pentium 4 Extreme Edition processor this week. Google desktop search for Apple PCs 11/1/2004 Google said it plans to release a version of its desktop search tool for computers running on the Mac operating system from Apple Computer Inc.. Sun develop its next generation Niagra processor 10/29/2004 Sun Microsystems has manufactured first silicon of its next-generation Niagra processor, which isn't due to ship until 2006 Micron halts MRAM development work 10/29/2004 Micron has stopped R&D work on magnetic RAM and is doubtful about phase-change memory Samsung to expand sales in China to $25 billion 10/29/2004 Samsung Electronics said it hopes to expand sales in China to $25 billion by 2010 Samsung behind AMD's PIC development 10/28/2004 Samsung said that it has "played an integral role in the development and manufacturing" of the Personal Internet Communicator (PIC) AMD to offer a low-cost $249 PC 10/28/2004 AMD has announced low cost computer, called the Personal Internet Communicator (PIC). Micron to delay offering MCP devices 10/28/2004 Micron Technology announced it does not intend to make the multi-chip packages (MCPs)at the present moment VIA add new chipset to support AMD processor 10/28/2004 VIA Technologies announced that its VIA K8T890 series chipsets will support the new AMD Athlon 64 FX-55 processor and AMD Athlon 64 processor 4000+. VIA share in chipset market climbs to 18.5% in 3Q 10/28/2004 VIA share in the core-logic chipset market increased sequentially by 3.6 percentage points to 18.5% in the third quarter of this year No cost benefit in China wafer fab, says TSMC's Chang 10/27/2004 TSMC's Chairman, said that the company's China-based wafer fab will not be more cost competitive than its Taiwan-based fabs for at least five years. TI to start building Richardson 300-mm wafer fab November 10/27/2004 TI plans to break ground mid-November on a $3 billion wafer fab complex for processing 300-mm diameter wafers in Richardson, Texas UMC to liquidate singapore fab 10/27/2004 UMC is apparently planning to "liquidate" its fab venture in Singapore and will fold the organization into the parent compa Seagate launched new 3 inch Drive 10/26/2004 Seagate unveiled two new portable hard drives--one of which is just 3 inches in diameter, yet capable of storing 5GB of data  766  |  767  |  768  |  769  |  770  |  771  |  772  |  773  |  774  |  775

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