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TSMC shipped Million 0.13 micron wafers 9/17/2004
TSMC said that the company has produced and shipped more than 1 million 8-inch-equivalent wafers with transistors measuring 0.13 micron across
Japanese researchers develop new capacitor for advanced DRAM 9/17/2004
A joint research team from Hitachi Ltd and Elpida Memory Inc has developed a capacitor intended for use in next-generation DRAM chips with a linewidth of 65 nanometers.
Infineon agrees to $160 million fine in U.S. DRAM price-fixing probe 9/16/2004
Infineon agrees to $160 million fine in U.S. DRAM price-fixing probe
TSMC claims lead in 0.13-micron, low-k production 9/16/2004
TSMC said that it has cumulatively produced and shipped more than one million 8-inch equivalent wafers with circuits made using 0.13-micron processing
LG & IBM disband PC division 9/16/2004
LG IBM PC Co Ltd, a PC business unit, announced Sept 14 that it would disband, leading to the end of the joint venture of LG Electronics and IBM Korea.
Microsoft issue new patch 9/15/2004
Microsoft has issued a patch to fix the security flaw, and urges its customers to use a new utility to locate the computer applications that are vulnerable
Japanese researchers succeeds in creating MRAM wafer 9/15/2004
In what could be a breakthrough for MRAMs, Japanese researchers have successfully fabricated a tunneling-magnetoresistance device on an 8-inch silicon wafer with a magnesium oxide tunnel barrier layer.
Micron samples 288Megabit RLDRAM 9/15/2004
Micron announced qualification of the 288 megabit (Mb) reduced latency DRAM II (RLDRAM® II) products now available in volume production.
Transmeta ship Efficeon processors 9/14/2004
Transmeta had begun shipping limited numbers of Efficeon TM8800 processors in September
Chinese phone company to deploy 3000 cyber cafes 9/14/2004
China's second-largest mobile phone company plans to open 3,000 Internet cafes by the end of the year, exerting stronger state control over a sector once dominated by private enterprise,
Infineon to license Hard-Disk Technology from Hitachi 9/14/2004
Infineon has signed a long-term license agreement with Hitachi on read channel technology for hard drive applications
Motorola reportedly building cell phone R & D center in Beijing 9/13/2004
Motorola said it plans to invest $90 million to build a research and development center in Beijing.
Chartered Launches 0.13micron, 0.11micron, 90nm Processes at 300mm Fab 9/13/2004
Chartered Semiconductor Manufacturing has achieved functional 0.13micron 300mm wafers from its Fab7.
NEC Electronics Announces New Advanced Memory Buffer 9/13/2004
NEC Electronics announced that it has developed a new Advanced Memory Buffer (AMB) device for use in fully buffered dual-inline memory modules (FB-DIMMs).
Samsung Introduces Cell Phone with HDD 9/13/2004
Samsung announce a cell phone with a HDD inside, the SPH-V5400, at the ITU Telecom Asia 2004 conference held Sept 6-11 at Pusan, Korea.
European supply tighthen while Asia is flat 9/10/2004
DDR availability in Europe is said to be poor, with players believing that there are some production issues at a number of original manufacturers and that some customers are on allocation.
Samsung starts production of 512Mb DDR on advanced process 9/10/2004
This time the beginning of mass production in Seoul, South Korea, for 512Mbit DDR SDRAM chips on 300mm wafers using a 90nm process.
iSupply see slow growth in 2005 9/10/2004
DRAM revenues will be particularly weakened by the price erosion, causing worldwide sales growth for the memory to decline to 8.6 percent in 2005, down from 56.2 percent in 2004.
Initiative to define disk interface for handheld 9/10/2004
"No disk drive interface exists today that is tailored to the needs of the handheld and CE market segments, so disk drives have had to make do with other interface alternatives that are complex and cumbersome or simply ill-suited to meet the needs of disk drives in space and power constrained tiny handhelds,"
U.S. High Speed connection grew 60% 9/10/2004
"the United States is making substantial progress in closing the gaps in access for traditionally underserved areas. Those in rural areas, those with low incomes, and those with disabilities are finding advanced services more available."
TSMC and partners to develope MRAM 9/9/2004
The MRAM market is expected to grow from US$2 million in 2004 to US$3.8 billion in 2008, and to US$12.9 billion by 2011, according to the report from research firm NanoMarket LC.
Taiwan to package DDR2 memories in volume 9/9/2004
Taiwan is pushing to become world's largest DDR II packaging service in 2005 with initial estimate of 30 million DDR II per month.
Intel technology to help DNA research 9/9/2004
Intel Corp. entered into an agreement to work with Acacia Research Corp.¡¯s CombiMatrix group on possibly using a platform technology to produce customizable active biochips.
Samsung is closing in with Intel 9/9/2004
While Intel remains solidly in control of the top spot, Samsung¡¯s strong growth boosted its revenue to more than half of Intel¡¯s for the first time, the firm reported.
Intel to go dual-core mobile 9/9/2004
Intel Corp. Wednesday (Sept. 8) announced some of the first details of its 65-nm processor for mobile applications.
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