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AMD gets German Goverment Loan to build Fab 11/19/2003
The German government has agreed to provide loan guarantees to AMD to build a new fab in the eastern city of Dresden.
IBM unveiled new 64bit Blade-Server 11/19/2003
IBM announced it will use its 64-bit PowerPC 970 processor in a new blade server.
Hynix sue EU for unfair Tarriffs 11/19/2003
Hynix filed a lawsuit last week against the European Union claiming that the EU Commission's imposition of hefty import duties on its chip exports is unfair.
Bill Gates announced Next Generation Windows at Comdex 11/18/2003
Spam, security and getting high-tech devices to communicate with each other are among the major challenges for the technology world, Microsoft's Bill Gates said at the annual Comdex technology convention
The new Comdex Show 11/18/2003
The new Comdex this year, a re-designed show seems less about glitz and more about business.
Sun ink deal to supply one million PC to Chinese goverment 11/18/2003
Sun Microsystems has announced it will signed a deal with the Chinese government to supply to a million Linux desktops over the next year
AMD to build 2nd Fab in Germany 11/18/2003
AMD may have decided where to build its 2nd chip Fab in Dresden, Germany
Nvidia samples fastest graphic chip 11/18/2003
Nivida announced its fastest graphics processor slated for mobile PCs applocation.
HP/Princeton invents Plastic Memory 11/17/2003
Engineers at Princeton University and Hewlett-Packard Laboratories have invented a combination of materials that could lead to a low-cost, compact write-once,ROM
Infineon ink Dram supply contract with Ramaxel 11/17/2003
Infineon will supply DRAM chips to Ramaxel in a five-year deal that could yield $300 million in sales.
Celestica opened second manufacturing Plant in China 11/17/2003
Celestica Inc have announced it has opened a manufacturing facility in Suzhou, China, supported by more than 1,600 employees
AMD introduced 2.2Ghz Opteron CPU 11/17/2003
AMD has introduced three higher-performing Opteron server processors, which now support a fast memory standard
Elpida Announces 0.11-Micron-Based, 128Mb SDRAM for Digital Consumer Applications 11/17/2003
Elpida Memory Inc, a Japanese dynamic random access memory marker, announced the formation of its Digital Consumer Division
A sneak peek at Intel's new Itanium2 chip 11/14/2003
Due in 2005, Intel said that its new Itanium 2 microprocessor code-named "Montecito" will have four times more storage capacity than its predecessor and will be able to run several applications at once.
Dell continue to roll 11/14/2003
Dell reported a profit of $677 million, or 26 cents a share, on revenue of $10.62 billion, for its third quarter ended Oct. 31.
It spending less than expected, report said 11/14/2003
IT spending for American companies remains low in October, according to a report from Gartner released.
Big Blue builds new supercomputer 11/14/2003
IBM said it will release a new supercomputer the size of a television based on microchip technology to be used in gaming consoles due out next year.
November shipments down, said major motherboard makers 11/13/2003
First-tier motherboard makers are expected to see a decline in November shipment, an industry sources said. That came after the record-setting shipments just a month ago.
Applied Materials announced rebouncing quarter 11/13/2003
Applied Materials reported its first profitable quarter in 12 months, a signal that recovery in the chip business is finally under way.
LSI Logic to spin off storage systems operation 11/13/2003
LSI Logic said it will spin off its storage systems operations from its mainstream semiconductor business to create an independent storage systems company.
Nokia ships phone with "walkie talkie" 11/13/2003
Nokia launched first handset that has "walkie talkie" feature allowing users to speak immediately at the push of a button.
Philips raised $1 billion selling TSMC shares 11/12/2003
Philips Electronics raised more than $1 billion by selling part of its stake in Taiwan Semiconductor Manufacturing Company, the world's largest IC contract manufacturer.
ChipPac announces 6-stacked die CSP 11/12/2003
ChipPac delivered what it claims the first six stacked-die CSP in a 1.6mm profile.
Wireless chips sales strong 11/12/2003
Worldwide communications chip market is projected to grow 20 percent in 2003 and another 26 percent in 2004 after a two years downturn, according to a report from IC Insights.
Cisco to buy Latitude 11/12/2003
Cisco Systems will buy conferencing software maker Latitude Communications to add to its voice technology group.
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