|
 |
|
| New "PC Plus" systems to run dual OS |
12/27/2013 |
|
Multiple computer makers will unveil systems that simultaneously run two different operating systems, both Windows and the Android OS that powers many of the world’s tablets and smartphones. The new devices will be called “PC Plus” machines.
|
|
|
| LED lighting market to expand |
12/27/2013 |
|
LEDinside predicted that the global demand for LED bulb and LED tube will increase by 86 percent and 89 percent in 2014 respectively over 2013.
|
|
|
| BlackBerry joint with Foxconn for niche market |
12/27/2013 |
|
Under the partnership, Foxconn will manufacture products for BlackBerry at facilities in Indonesia and Mexico. BlackBerry will own all of its intellectual property and perform product assurance on devices through the Foxconn partnership.
|
|
|
| SK Hynix stock is hot |
12/26/2013 |
|
The KRX, the country’s sole securities exchange operator, said foreign investors have made a net purchase of 3.87 trillion won ($3.65 billion) as of Friday on shares of the microchip manufacturing arm of SK Group.
|
|
|
| Intel rides success in microserver segment |
12/26/2013 |
|
Intel actually defined the category back in 2009 and maintains a consistent definition of microservers, which hit has used publicly. That definition is "low-power, one-socket scale-out shared architecture".
|
|
|
| 'Phablets' to out sell small "Tablets" in 2014 |
12/23/2013 |
|
In many countries where wi-fi networks are patchy, consumers cherish the phablets’ ability to provide multiple ways of connecting to the Internet. Building in phone capability may add $30, $60 or more to a tablet’s price tag, but consumers find that quite bearable, even if they are motivated only by their need for reliable web access, rather than the chance to talk.
|
|
|
| SK Hynix and AMD joined in development of HBM |
12/23/2013 |
|
SK hynix is the first within the industry to confirm its plan to provide the next-generation chips. TSV technology allows memory and logic circuitry to be place in the same package.
|
|
|
| Panel of semi experts chat about 3D NAND |
12/23/2013 |
|
3-D NAND will be a while in coming, Arcuri points out that Samsung is making progress in producing the parts, which may spur Sandisk and Micron to become more aggressive with their own timelines.
|
|
|
| Calxeda - first causalty in ARM server SOC |
12/23/2013 |
|
"Calxeda had the right idea, but they started too soon," said Linley Gwennap, principal of the market watcher Linley Group, told us. "Once ARM announced a 64bit architecture but didn't have a 64bit core ready, it cut the knees out from Calxeda.
|
|
|
| AMD has aggrasive roadmap to compete |
12/20/2013 |
|
Because of the strong price/performance ratio of its FM3- and FM1-based products, AMD's share in China's DIY market has increased significantly from 30-35% in early 2013 to close to 45% recently.
|
|
|
| 3M unveiled innovative touch sensor film |
12/20/2013 |
|
The 3M Patterned Silver Nanowire consists of conductors made of Cambrios' silver nanowire ink that is micropatterned by 3M on a polyester (PET) film substrate. The material is highly transparent with a target transmittance of greater than 89 percent and exhibits good optical clarity and low haze.
|
|
|
| Engineering outsourcing continue to grow |
12/20/2013 |
|
IT and software services giant Infosys will add nearly 16,000 engineers to its employee roster as outsourcing opportunities coming from the U.S. and European markets continue to increase.
|
|
|
| See the future of smartphone and tablets at CES |
12/19/2013 |
|
There are plenty of those brewing for 2014 even beyond the big show, from the smartphone's screen size and shape to the stuff that goes inside and even pairs to a watch on your wrist or glasses on your face.
|
|
|
| Broadcom to help validate Micron HBM memory |
12/19/2013 |
|
"OEMs today continue to tackle the challenge of an ever-increasing volume, velocity and variety of data. We are delighted to be working with Broadcom to validate a solution that helps alleviate the throughput challenge for our mutual customers,”
|
|
|
| SK Hynix to build new fab for mobile DRAM |
12/19/2013 |
|
Construction of the new factory will begin next year, with mass production of dynamic random access memory, or DRAM, chips starting as early as 2015, one of the people said.
|
|
|
| Toshiba to expand production in Indonesia |
12/19/2013 |
|
Industry Minister MS Hidayat said that the electronics giant will set up an additional site at Java to significantly increase output and make Indonesia its largest production base outside Japan, according to the Jakarta Post.
|
|
|
| LED lighting to glow in 2014 |
12/18/2013 |
|
As retail prices for LED light bulbs keep falling, international vendors are expected to release OEM orders to Taiwan-based makers.
|
|
|
| Toyota licensed wireless charging technology |
12/18/2013 |
|
Toyota has cooperated technically with the company for the past several years. Under this intellectual property license agreement, Toyota will offer wireless charging power capture devices on their future rechargeable hybrid electric and battery electric vehicles.
|
|
|
| Qualcomm found price fixing in China |
12/17/2013 |
|
Xu Kunlin, head of the department of price supervision at the National Development and Reform Commission (NDRC), told China Daily that his agency had obtained "substantial evidence against" Qualcomm.
|
|
|
| Huawei's Honor series are loaded |
12/17/2013 |
|
The Honor 3X joins the first wave of octa-core 1.7GHz MT6592-powered devices, and it boasts 2GB of RAM, a 13-megapixel f/2.2 main camera, a 5-megapixel 1.4-micron front imager plus a generous 3,000mAh battery.
|
|
|
|
