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Hynix ownership in confusion 2/26/2010
Bank shareholders in Hynix had received no offers for their 28 percent stake in the memory maker by a recent deadline. As a result the banks, will consider other means of disposing of their stakes including selling off shares in small tranches.
Applied predicts DRAM capex increase by 2H 2/25/2010
The AMAT CFO says you could also that some foundries could ramp up and buy next-generation equipment. And he notes that Taiwan DRAM players also could increase their spending in the second half.
Elpida to take Rexchip Public 2/25/2010
Japanese chip maker Elpida Memory Inc plans to list its Taiwanese unit Rexchip Electronics on the Taiwan stock exchange in the second half of the next financial year ending March 2011,
Entrepreneurs to lobby for new type of visa 2/25/2010
What we want is a visa for a foreigner entrepreneur who raises money from US investors and wants to start a company in the United States.”
Bluetooth group to address smart grid applications 2/25/2010
The study group will explore possible applications of Bluetooth in all aspects of the smart energy market. It will form a strategy for Bluetooth Smart Energy and make recommendations based on its findings.
Toyota still insist it is not an electronic problem 2/24/2010
In testimony on Tuesday, James Lentz, head of Toyota sales in the U.S., denied reports that electronic control units were a possible cause of runaway vehicles, which prompted the first wave of Toyota recalls.
TI to pickup more equipment at bargain base 2/24/2010
TI, which bought majority of Qimonda's equipment last August for $172.5 million, will be the stalking horse bidder for the remaining equipment and set the floor at a court supervised auction.
Samsung put 40nm DDR3 in volume production 2/24/2010
Production of the 4Gb DDR3 raises the amount of memory for use in servers to 32Gigabytes (GB) per module, which is twice the maximum density achieved with modules based on 2Gb components. With the start of volume 4-Gbit DDR3 production, Samsung plans to migrate more than 90 percent of its DDR DRAM production to 40-nm process technologies,
PSC to resume China fab. project 2/23/2010
PSC has already received approval from the Taiwan government to produce 8-inch wafers on 0.18-micron or or less advanced processes in China.
Converge predicts demand on DDR3 2/23/2010
Industry analysts are predicting the memory market to start taking off in the second half of 2010, but Converge believes the uptick in spot market activity will begin sooner. Many of the box builders are reporting an earlier-than-expected migration to DDR3, and that will put a strain on the supply channel.
The Bloom Box - Super high efficiency fuel cell 2/23/2010
Within five to 10 years the company promises to reduce the price to as little as $3,000. "The Bloombox is designed to replace the grid—it's cheaper than the grid and greener than the grid,"
Rayspan announced true milti-band antenna 2/23/2010
"We have the only antenna technology that integrates LTE, 3G, Bluetooth and GPS all from a single-feed antenna."
Irish researcher claims junctionless transistor 2/22/2010
The breakthrough is based on a control gate around a silicon wire that measures just a few dozen atoms in diameter. The gate can be used the squeeze the electron channel to nothing without the use of junctions or doping. The development, which could simplify manufacturing of transistors at around the 10-nanometer era.
Infineon ask ITC to block Elpida DRAM import 2/22/2010
Infineon Technologies North America Corp. have alleged in their complaint, filed on Feb. 19, 2010, that Elpida has engaged in unfair trade practices by making for importation into the U.S., and selling after importation, certain DRAM semiconductors and products that infringe four of Infineon's patents.
Intel to target 11nm with EUV 2/22/2010
At 11-nm, Intel reiterated its concept of a ''complementary'' or mix-and-match strategy, in which 193-nm immersion could work hand-in-hand with EUV or maskless lithography to enable advanced chip designs.
Caltech discovered low cost/high efficiency solar cell 2/22/2010
Solar cells based on the technique could potentially be very inexpensive to manufacture since only 2 percent of the materials are expensive semiconductors while the remainder is made from inexpensive plastic.
LED backlight price continues to fall 2/19/2010
LED backlight costs are falling faster than conventional LCD backlights, with LED backlight unit for 40 inch full HD LCD TVs to reach USD 100 in Q4 2010.
MIT researcher develop energy-harvesting systems 2/19/2010
Massachusetts Institute of Technology(MIT) researchers have develop an energy-harvesting systems that could replace batteries in electronic devices that need to work for long periods of time.
Toshiba unveils 2.5-inch HDD with Self-encrypting technology 2/19/2010
Toshiba have unveil an enterprise-class self-encrypting drive (SED) 2.5-inch enterprise-class HDD.
Anti-trust regulators agrees to Microsoft-Yahoo alliance 2/18/2010
U.S. and Europe anti-trust regulators have agree to allow Microsoft's search alliance with Yahoo.
AT & T to offer Android Phone 2/18/2010
AT&T set a March 7 release date for the Motorola Backflip, which will become the first Android-powered smartphone to run on AT&T's 3G network.
ITC to investigate Apple,Blackberry for Kodak patent violations 2/18/2010
The U.S. ITC it will start an investigation into Apple and Research In Motion based on a complaint filed by Kodak.
Verizon to offer Skype on 3G service 2/17/2010
Verizon Wireless and Skype announced a partnership that will deliver Skype mobile services to Verizon customers with data plans.
Infineon offers reference design for Android phones 2/17/2010
Infineon Technologies has announced the availability of the XMM6181 reference design to help engineers create entry-level Android smartphones.
Intel, Nokia launch open software platform for MeeGo 2/17/2010
Intel and Nokia are merging their Moblin and Maemo software platforms into an open software platform called MeeGo.
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