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Samsung put 40nm DDR3 in volume production 2/24/2010
Production of the 4Gb DDR3 raises the amount of memory for use in servers to 32Gigabytes (GB) per module, which is twice the maximum density achieved with modules based on 2Gb components. With the start of volume 4-Gbit DDR3 production, Samsung plans to migrate more than 90 percent of its DDR DRAM production to 40-nm process technologies,
PSC to resume China fab. project 2/23/2010
PSC has already received approval from the Taiwan government to produce 8-inch wafers on 0.18-micron or or less advanced processes in China.
Converge predicts demand on DDR3 2/23/2010
Industry analysts are predicting the memory market to start taking off in the second half of 2010, but Converge believes the uptick in spot market activity will begin sooner. Many of the box builders are reporting an earlier-than-expected migration to DDR3, and that will put a strain on the supply channel.
The Bloom Box - Super high efficiency fuel cell 2/23/2010
Within five to 10 years the company promises to reduce the price to as little as $3,000. "The Bloombox is designed to replace the grid—it's cheaper than the grid and greener than the grid,"
Rayspan announced true milti-band antenna 2/23/2010
"We have the only antenna technology that integrates LTE, 3G, Bluetooth and GPS all from a single-feed antenna."
Irish researcher claims junctionless transistor 2/22/2010
The breakthrough is based on a control gate around a silicon wire that measures just a few dozen atoms in diameter. The gate can be used the squeeze the electron channel to nothing without the use of junctions or doping. The development, which could simplify manufacturing of transistors at around the 10-nanometer era.
Infineon ask ITC to block Elpida DRAM import 2/22/2010
Infineon Technologies North America Corp. have alleged in their complaint, filed on Feb. 19, 2010, that Elpida has engaged in unfair trade practices by making for importation into the U.S., and selling after importation, certain DRAM semiconductors and products that infringe four of Infineon's patents.
Intel to target 11nm with EUV 2/22/2010
At 11-nm, Intel reiterated its concept of a ''complementary'' or mix-and-match strategy, in which 193-nm immersion could work hand-in-hand with EUV or maskless lithography to enable advanced chip designs.
Caltech discovered low cost/high efficiency solar cell 2/22/2010
Solar cells based on the technique could potentially be very inexpensive to manufacture since only 2 percent of the materials are expensive semiconductors while the remainder is made from inexpensive plastic.
LED backlight price continues to fall 2/19/2010
LED backlight costs are falling faster than conventional LCD backlights, with LED backlight unit for 40 inch full HD LCD TVs to reach USD 100 in Q4 2010.
MIT researcher develop energy-harvesting systems 2/19/2010
Massachusetts Institute of Technology(MIT) researchers have develop an energy-harvesting systems that could replace batteries in electronic devices that need to work for long periods of time.
Toshiba unveils 2.5-inch HDD with Self-encrypting technology 2/19/2010
Toshiba have unveil an enterprise-class self-encrypting drive (SED) 2.5-inch enterprise-class HDD.
Anti-trust regulators agrees to Microsoft-Yahoo alliance 2/18/2010
U.S. and Europe anti-trust regulators have agree to allow Microsoft's search alliance with Yahoo.
AT & T to offer Android Phone 2/18/2010
AT&T set a March 7 release date for the Motorola Backflip, which will become the first Android-powered smartphone to run on AT&T's 3G network.
ITC to investigate Apple,Blackberry for Kodak patent violations 2/18/2010
The U.S. ITC it will start an investigation into Apple and Research In Motion based on a complaint filed by Kodak.
Verizon to offer Skype on 3G service 2/17/2010
Verizon Wireless and Skype announced a partnership that will deliver Skype mobile services to Verizon customers with data plans.
Infineon offers reference design for Android phones 2/17/2010
Infineon Technologies has announced the availability of the XMM6181 reference design to help engineers create entry-level Android smartphones.
Intel, Nokia launch open software platform for MeeGo 2/17/2010
Intel and Nokia are merging their Moblin and Maemo software platforms into an open software platform called MeeGo.
Microsoft launch Window Mobile 7 2/16/2010
Microsoft unveiled a new operating system for mobile phones after months of speculation.
Silicon revenues declined 41% in 2009 2/16/2010
Worldwide silicon wafer area shipments hit rock bottom in the first quarter of 2009, but a strong recovery was noted in each subsequent quarter of 2009
Intel partners with Sillicon Hive to enhance Atom processor 2/16/2010
Silicon Hive B.V has set up a collaboration agreement with Intel to use its parallel processing technology across mobile and embedded segments based on the Intel Atom Processor.
Qimonda test equipments up for Auction 2/16/2010
Qimonda automatic test equipments, assembly and packaging and test and measurement instruments will go under the hammer this week at Munich Germany.
NEC to unveil quad-core Cortex-A9 processor 2/15/2010
NEC Electronics looks set to grab a share of the lead in terms of high performance ARM processors at the Mobile World Congress in Barcelona next week with a quad-core Cortex-A9 design.
TI unveil multicore SoC architecture 2/15/2010
Texas Instruments has launched a system-on-chip architecture based on its multicore DSPs.
Acer to offer Notebook with Wimax chip 2/15/2010
Acer has introduced a 13.3-inch ultra-thin notebook with built-in WiMAX module.
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