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Inotera Memories will triple its capital expenditure in 2010 to $1.3 billion 12/29/2009
Inotera Memories Inc. will triple its capital expenditure in 2010 to $1,385 billion
Hynix to increase capital expenditure for 2010 12/29/2009
Hynix Semiconductor has confirmed that it will increase its planned capital expenditure for 2010 to 2.3 trillion won (about $1.95 billion),
Lockheed Martin develops new micron-sized solar cells 12/28/2009
Sandia National Labs claims the micron-sized solar cells are as efficient as their wafer-sized cells and consume only one hundredth the amount of semiconductor.
Semicon Equipments booking up for November 12/28/2009
November produced the highest recorded semiconductor equipment bookings for 2009. Bookings topped US$790.5, up slightly from US$756.3 million in October.
Toshiba reports impressive Nand Flash revenue 12/28/2009
Toshiba reported NAND flash revenues an impressive 47.5%, quarter on quarter, reaching US$1.36 billion in the third quarter, up from US$924 million in the second quarter.
VIA unveils new chipset for Window 7 PC 12/28/2009
VIA Technologies has announced the VIA VN1000 digital media chipset for next generation desktop and all-in-one PCs
Elpida to transfer 40nm technology to Taiwan manufacturers 12/24/2009
Elpida also noted that, depending on market conditions, it may transfer 40nm process technology to foundry partners ProMOS Technologies and Winbond Electronics to expand production to a higher level.
Micron/Intel commits to 2xnm Flash process 12/24/2009
Micron’s fiscal year 2010 ends in late September, 2010, it is highly likely that the company will start sampling of its 20nm-class flash devices sometime in early calendar 2010.
DRAM Capex to increase in 2010 12/24/2009
With PC vendors having grown their average DRAM content per box to 2.92GB, DRAM makers are seeing a positive outlook for demand in 2010, according to industry sources in Taiwan. The sources expect growing demand for DRAM memory may outpace suppliers' expansion pace next year.
UMC embraces LED manufacturing 12/24/2009
UMC said in a filing dated Dec. 15 that it would also invest $8 million in a Mainland China venture called United LED Corp. A spokesperson for UMC Wednesday confirmed that the firm is joint venture between UMC and Epistar.
Altera named new CFO 12/23/2009
The appointment comes after Altera in late November upped its Q4 guidance. The company now expects sales to be up 15% to 18% on Q3’s $286.6 million opposed to its previous guidance calling for 6% to 10% growth.
Electronic wall paper changes color on demand 12/23/2009
According to Philips, its technology allows different colors of ink to be built into one layer with each color controlled separately, allowing a layer to be transparent, the same color as any one of the inks, or a mixture of multiple colors.
Chip sells going strong 12/23/2009
This would represent a rise of 7.7 percent year-on-year against the three-month average for November 2008. However, actual November chip sales probably rose 26 percent compared with November 2008,
Used semiconductor equipment flourish 12/23/2009
Analysts who do track the market for refurbished equipment forecast that it will rise significantly in 2010 after a down year in 2009.
LG forms company to manage OLED IP's 12/22/2009
As such it is expected that the Kodak patents will be placed in the LG OLED portfolio. LG OLED is expected to sign contracts with LG affiliates to share patents with them.
Converge reports DDR2 prices leveling 12/22/2009
The DDR3 market remains stable, but the DDR2 market is showing some signs of weakness. In both SO-DIMM and desktop, 2-GB PC800 DDR2 has dropped from the low-to-mid-$50s range to high $40s in a two-week span.
WiFi comes into automobile starting 2010 model 12/22/2009
More than half of the 77 million U.S. driving adults considered technology enthusiasts expressed the desire for a Web access in their cars, according to a study by the Consumer Electronics Association. Among the general population, more than one third of Americans said they would be interested.
TSMC employees get bonus + 15% raise 12/22/2009
TSMC will raise base salaries for employees by 15 percent beginning next month, anticipating a strong year. TSMC also said it would give employees an annual bonus equal to two months' salary on Jan. 25, according to the report.
PC Market helps DRAM rebound 12/21/2009
That's partly due to good sales of netbooks and the introduction of Intel's Calpella. Windows 7 has helped boost sales of memory but notebook shipments are likely to have grown by nearly 12 percent in the fourth quarter of this year.
Nokia to partner with Ericsson on TD-SCDMA 12/21/2009
Nokia has affirmed its commitments to the development TD-SCDMA, the the Chinese homegrown 3G standard. In October, the company launched Nokia 6788, its first Symbian-based TD-SCDMA phone and announced the creation of a dedicated TD-SCDMA R&D team in Beijing.
France and Italy to build Solar Farm 12/21/2009
“We are convinced that R&D and investment in innovative and sustainable projects, in all strategic sectors including energy to stop climate change, are essential to economic revival and growth in our countries.”
Automobile and Green Engergy seen as growth areas 12/21/2009
The real driver of global economic growth will no longer be consumers, but rather emerging markets and economies that need infrastructure. So future growth will not be dependent on disposable consumer production.
Engineering openings in Ireland 12/18/2009
Maxim Integrated Products is establishing a new international business services operation in Dublin, where it will initially recruit 50 employees in various disciplines.
Intel to highlight new MPU line up at CES 12/18/2009
Intel has designed two generations of x86-based system-on-chips geared for digital TVs, but so far the company has yet to gain a single design win. TV makers have long design cycles and are secretive about their component choices,
Intel extends speed by stacking GaAs on Silicon 12/18/2009
The resultant compound semiconductor quantum-well FET demonstrated the high carrier velocity and high drive current that make InGaAs-on-Si attractive, but it must be scaled down in size before the technology can be commercialized.
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