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3D-TV goes into production 1/27/2010
Samsung Electronics Co. Ltd. Tuesday (Jan. 26) claimed to be the first company to commence mass production of panels for 3-D LED TVs and 3-D LCD TVs.
Taiwan Nanya has its worry on DRAM profit 1/26/2010
While everyone had predicted that the price of DDR2 would drop, they thought the loss of revenue would be made up by the shift to 50nm process technology and DDR3. However Nanya told Digitimes that it can't see how the new process will offer any significant contribution to its profitability until the second quarter.
SMIC totally out of DRAM business 1/26/2010
SMIC supplies one third of China's overall demand for SDRAM used in consumer electronics and home appliance applications such as refrigerators, digital TVs and portable media players. Its exit has pushed up spot market prices for 128Mb (16Mb×8) and 256Mb (32Mb×8) SDRAM chips.
Digital media takes quantum leap with Apple 1/26/2010
''To be sure, reading has now joined other forms of media (e.g., listening to music, watching videos) that have faced seismic shifts in distribution over the Internet, with far-reaching implications for traditional business models,''
Silicon MEM enables gyro on smartphone 1/26/2010
Today seven out of 10 games for the iPhone use the built-in MEMS accelerometer as a smart controller that allows users to tilt, shake and otherwise use motion to control games. It is expected in the future nearly every application-specific phone will use a MEMS gyroscope, in conjunction with an accelerometer, to make the user-interface to the applications fun and easy to use.
3bit MLC Nand to take hold in 2010 1/25/2010
Industry sources predict that the adoption of 3bpc NAND in the memory card market will be fast expanding in 2010. Some predict that 70 to 80 percent of two-bit-per-cell chips used in entry-level flash drives and memory cards will be replaced by 3bpc ones in 2010.
3 camps to provide cloud media platform 1/25/2010
"It's a very nascent market for digital media—it's just three percent of the home video market—so it's way too early to declare winners and losers,"
Grace and Hua Hong NEC to build new fab. 1/25/2010
Grace Semiconductor Manufacturing Corp and Shanghai Hua Hong NEC Electronics Co. Ltd. (HHNEC) have begun construction of a 300-mm wafer fab at Zhangjiang Hi-Tech Park, Shanghai, according to local reports.
New optical memory saves power 1/25/2010
The indium phosphide membranes, are integrated onto passive silicon waveguide circuits, which allows different memory cells to be optically connected using silicon wires. It also allows the use of silicon-based microelectronics fabrication technology, making it a cost-effective solution.
Microsoft to launch Window Mobile 7 1/22/2010
Microsoft will announce a date for the commercial availability of Window Mobile 7(WM7), according to sources familiar with Microsoft's roadmap.
AMD reports profit for 4th quarter 2009 1/22/2010
Advanced Micro Devices Inc. reported its first quarterly profits in years during the fourth quarter lifted by improving margins.
Xillinx qualifies UMC to produce 40nm FPGA 1/22/2010
UMC and Xilinx have jointly announced production qualification for Xilinx' FPGA products built using UMC's 40nm logic process technology on 12-inch wafers.
Nanya swings into profit for 4th Quarter 2009 1/21/2010
Nanya Technology has announced it returned to profitability in the fourth quarter of 2009 following 10 consecutive quarterly losses.
Hynix reports 32% rise in 4th Quarter profit 1/21/2010
Hynix has announced revenues for the fourth quarter of 2009 grew 32% on quarter driven by rising DRAM and NAND flash shipments and a rebound in DRAM ASPs.
A-Data report profits for 4th Quarter 2009 1/21/2010
A-Data Technology has posted net profits of US$22.08 million in the fourth quarter of 2009, bringing net earnings for all of the year to NT$21.3 billion.
Samsung to pay $900 Million to Rambus 1/20/2010
Samsung Electronics will pay abut $900 million over five years to license technology from Rambus Inc. under the terms an agreement that settles all litigation between the two companies.
Quanta to build third plant in China 1/20/2010
Quanta Computer has announced it will build a new production base in Chongqing, in addition to its two existing plants located in Songjiang and Changshu, China, according to a filing with the Taiwan Stock Exchange (TSE).
Rexchip post profit in 4th Quarter 2009 1/20/2010
Rexchip Electronics has announced that net profits for the fourth quarter of 2009 amounted to US$110 million
IBM post good profit out-look for 2010 1/19/2010
International Business Machines 's fourth-quarter profit grew 8.7% and posted higher margins.
TSMC completes Fab 12 1/19/2010
TSMC has completed its fifth-phase 12-inch fab (Fab 12) construction at the Hsinchu Science Park.
MSI launch USB3.0 Motherboard 1/19/2010
Micro-Star International (MSI) has announced its USB 3.0-ready motherboard, the P55-GD85.
Micron to enter Solar Market 1/18/2010
Micron Technology has formed a 50:50 joint venture with Origin Energy Ltd. (Sydney, Australia) to focus on the development of photovoltaic technology.
Xillinx chooses TSMC for 28-nm production 1/18/2010
Xilinx said it will use TSMC for foundry services at the 28-nm node in March 2010.
Asustek to ship 21 Million Motheboards in 2010 1/18/2010
Asustek Computer expects to ship 25 million motherboards in 2010, up 20% from 21 million units in 2009, according to Chewei Lin, vice president of Asustek.
Intel reports U$10 Billion in 4th Quarter Sales 1/15/2010
Intel has reported fourth-quarter 2009 revenues of US$10.6 billion, operating income of US$2.5 billion, net income of US$2.3 billion.
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